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Nexperia USA Inc. BSP130,115

Part No.:
BSP130,115
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixBSP130,115.pdf
Description:
MOSFET N-CH 300V 350MA SOT223
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,884

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Product details

Overview

BSP130,115 from Nexperia (formerly Philips Semiconductors) is an N-channel enhancement-mode vertical D-MOS transistor in SOT223 package, rated for 300 V drain-source voltage, 350 mA DC drain current, and 1.5 W total power dissipation at 25 °C ambient. It features 3.7 Ω RDS(on) at VGS = 10 V and ID = 250 mA, gate threshold voltage of 0.8–2 V, and sub-10 ns turn-on time - optimized for line current interruption and high-speed transformer driving in telecom terminal equipment.

For engineers reviewing the BSP130,115 datasheet, BSP130,115 pinout, BSP130,115 application, or BSP130,115 equivalent, key selection criteria include its 300 V blocking capability, low gate charge enabling direct CMOS/TTL interface, absence of secondary breakdown, and thermal resistance of 83.3 K/W on standard PCB mounting - critical for reliable relay and telephone line driver designs.

Technical Context

This discrete MOSFET employs a vertical D-MOS structure to achieve high-voltage operation without secondary breakdown limitations, supporting robust switching under inductive loads. Its gate threshold voltage range (0.8–2 V) ensures compatibility with low-voltage logic families while maintaining noise immunity.

Static characteristics are specified at Tj = 25 °C, with dynamic parameters including 6–10 ns turn-on time and 46–60 ns turn-off time at VDD = 50 V and ID = 250 mA. Input capacitance (Ciss) is 100–120 pF, output capacitance (Coss) 21–30 pF, and feedback capacitance (Crss) 10–15 pF at VDS = 25 V and f = 1 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
VDS300 V DC - supports telecom line voltage transients and isolation requirements in telephone sets
ID (DC)350 mA - sufficient for driving small relays and line transformers without heatsinking
RDS(on)3.7 Ω max at VGS = 10 V, ID = 250 mA - enables low conduction loss in pulsed load applications
VGS(th)0.8–2 V - allows direct interface with 3.3 V/5 V CMOS and TTL logic without level shifting
ton/toff6–10 ns / 46–60 ns - supports high-frequency switching in line driver and interruptor circuits
Rth j-a83.3 K/W - defines thermal performance on 40 × 40 × 1.5 mm epoxy PCB with ≥6 cm² drain pad
Ciss100–120 pF - impacts gate drive energy and switching speed in high-frequency operation

Pinout & Package

SOT223 (SC-73) surface-mount plastic package with integrated drain tab for enhanced thermal conduction; 4-lead configuration with exposed drain pad (Pin 2 and Pin 4 both connected to drain).

Pin/TerminalCircuit RoleDesign Meaning
1GateControl terminal; low input capacitance enables fast switching with minimal drive power
2DrainMain high-voltage current path; electrically and thermally connected to exposed metal tab
3SourceReference node for gate control and current return; tied to ground or low-side reference
4DrainSecond connection to same internal drain structure; improves thermal and current distribution

Key Features

FeatureDesign Value
No secondary breakdownEnables safe operation under inductive load conditions without SOA derating constraints
Direct CMOS/TTL interfaceLow VGS(th) and gate charge allow drive from standard logic outputs without buffer stages
High-speed switchingSub-10 ns ton and <60 ns toff support >10 MHz pulse operation in line drivers
Vertical D-MOS architectureProvides superior voltage handling and ruggedness vs. planar MOSFETs at same die size

Applications

Telephone Line Current InterruptorRelay Driver

Use Scenario: Interrupting DC loop current in analog telephone subscriber line interface circuits during call setup or hookswitch events.

IC Role / Device Role / Timing Role: High-voltage switch controlling 48 V DC loop current with fast turn-off to meet telephony timing standards.

Use Value: 300 V VDS rating withstands ringing voltage surges; 350 mA ID handles typical loop currents; no secondary breakdown prevents latch-up during transient overloads.

Use Scenario: Driving electromagnetic relays in PBX systems and telecom test equipment requiring rapid coil energization/de-energization.

IC Role / Device Role / Timing Role: Low-side switch controlling relay coil current with precise timing control for contact bounce suppression.

Use Value: 6–10 ns ton enables microsecond-level coil control; 3.7 Ω RDS(on) minimizes power loss during sustained activation.

Line Transformer DriverHigh-Speed Signal Switch

Use Scenario: Driving primary windings of line interface transformers in DSL modems and ISDN terminal adapters.

IC Role / Device Role / Timing Role: Fast-switching power stage delivering controlled current pulses into inductive transformer loads.

Use Value: 46–60 ns toff ensures clean signal edges; vertical D-MOS structure sustains repetitive avalanche stress during flyback recovery.

Use Scenario: Routing or gating high-speed digital signals in telecom multiplexers where low capacitance and fast edge rates are critical.

IC Role / Device Role / Timing Role: Voltage-controlled transmission gate operating in linear or saturated mode for signal path enable/disable.

Use Value: Ciss ≤120 pF limits signal distortion; 300 V rating accommodates ESD protection clamping voltages in front-end interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel high-voltage MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
BSP129,115Lower VDS rating (250 V), identical RDS(on) and packageNot suitable for 300 V telecom line surge environmentsSelect only when system maximum VDS stress remains below 250 V
BUK452-60RHigher ID (1.2 A), TO-220 package, 600 V VDS, higher RDS(on) (1.2 Ω)Requires heatsink; unsuitable for space-constrained SOT223 layoutsChoose for higher current or higher voltage margin where board area permits TO-220

Compared with BSP129,115, the BSP130,115 provides essential 300 V surge tolerance for telephone line applications; versus BUK452-60R, it offers compact SOT223 footprint and lower gate drive demand at the cost of current and voltage headroom.

Availability

BSP130,115 is available at Aetrix Electronics and suitable for telephone line interface modules, relay driver circuits, and line transformer driver designs requiring stable component supply and long-term industrial availability.

Supply support for BSP130,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia - formerly Philips Semiconductors - is a global leader in discrete, logic, and MOSFET solutions, specializing in high-volume, high-reliability semiconductor components for automotive, industrial, and consumer applications.

The BSP130,115 belongs to Nexperia's legacy high-voltage logic-level MOSFET product line, engineered specifically for telecom infrastructure and low-power switching applications demanding ruggedness, fast switching, and direct logic interfacing.

FAQ

What is the maximum continuous drain current for BSP130,115 at 70 °C ambient temperature?

The BSP130,115 has a DC drain current rating of 350 mA at Tamb ≤25 °C. At 70 °C ambient, derating applies per the power derating curve: Ptot drops linearly from 1.5 W at 25 °C to 0 W at 150 °C junction temperature. With Rth j-a = 83.3 K/W, maximum allowable ID at 70 °C ambient is approximately 220 mA to maintain Tj ≤150 °C.

Can BSP130,115 be used in avalanche energy applications?

Yes - the BSP130,115 is characterized for unclamped inductive switching (UIS) and exhibits no secondary breakdown, making it suitable for controlled avalanche operation in line transformer flyback recovery. The SOAR curve (Fig.11) confirms safe single-pulse avalanche capability up to 100 V and 1 A for 10 µs pulses at 25 °C ambient.

Is the SOT223 drain tab internally connected to both Pin 2 and Pin 4?

Yes - the datasheet explicitly states "Pin 2 drain" and "Pin 4 drain", and the mechanical outline shows both pins electrically and thermally tied to the same exposed drain pad. This dual-drain configuration improves current sharing and thermal spreading across the PCB copper area.

What is the typical gate charge required to fully enhance BSP130,115?

While Qg is not directly specified, gate charge can be inferred from Ciss = 100–120 pF and VGS swing of 10 V: Qg ≈ Ciss × ΔVGS ≈ 1.2 nC. This low gate charge enables direct drive from microcontroller GPIOs or logic gates without external buffers, consistent with its "direct interface to CMOS/TTL" feature.

BSP130,115 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
300 V
Current - Continuous Drain (Id) @ 25°C:
350mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
6Ohm @ 250mA, 10V
Vgs(th) (Max) @ Id:
2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
120 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
1.5W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-223

BSP130,115 FAQ

1.How can I place an order for BSP130,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP130,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP130,115 reliable?

The price and inventory of BSP130,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP130,115 is usually 5 days.

3.What payment methods are accepted for BSP130,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP130,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP130,115?

BSP130,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP130,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP130,115?

For technical support, including BSP130,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP130,115 requirements.

6.How does Aetrix verify that BSP130,115 is sourced from the original manufacturer or authorized distributors?

All BSP130,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP130,115 meets industry standards.

7.What is the process for return or replacement of BSP130,115?

All BSP130,115 units undergo pre-shipment inspection (PSI). If there is an issue with BSP130,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP130,115 part is unused and in its original packaging.

Return procedure for BSP130,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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