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Diodes Incorporated BSS123TC

Part No.:
BSS123TC
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
TO-236-3, SC-59, SOT-23-3
Datasheet:
AetrixBSS123TC.pdf
Description:
MOSFET N-CH 100V 170MA SOT23-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,073

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Product details

Overview

BSS123 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in SOT23 package, rated for 100 V drain-source voltage, 6.0 Ω RDS(ON) at VGS = 10 V, and 0.17 A continuous drain current. It serves as a low-voltage, low-current switching device in gate driver stages and small servo motor control circuits.

For engineers reviewing the BSS123 datasheet, BSS123 pinout, BSS123 application, or BSS123 equivalent, this part is selected for its low gate threshold (0.8–2.0 V), fast switching (tD(ON) ≤ 8 ns), low input capacitance (Ciss typ. 22 pF), and rugged 100 V rating in compact SOT23 footprint.

Technical Context

This discrete MOSFET uses Diodes Incorporated's high-density trench technology to achieve low on-resistance while maintaining robust avalanche capability and thermal stability across –55°C to +150°C junction temperature range. Its gate threshold voltage shifts predictably with temperature (±0.5 mV/°C), enabling stable biasing in ambient-variable environments.

The device exhibits low leakage (IDSS ≤ 0.1 µA at VDS = 100 V, TA = 25°C) and low diode forward voltage (VSD = 0.84 V typ. at IS = 0.34 A), supporting efficient bidirectional conduction in synchronous rectifier or level-shift configurations.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 100 V - Withstands up to 100 V drain-source potential without breakdown, suitable for 24–48 V system rails.
RDS(ON) 3.2 Ω typ. @ VGS = 10 V - Enables <170 mW conduction loss at 0.17 A, minimizing self-heating in space-constrained layouts.
VGS(TH) 0.8–2.0 V - Ensures reliable turn-on from 3.3 V logic or microcontroller GPIO without level-shifting circuitry.
Ciss 22 pF typ. - Reduces gate drive power and speeds up switching transitions in high-frequency PWM applications.
tD(ON) ≤ 8 ns - Supports >50 MHz switching in gate driver feedback paths and low-side switching nodes.
PD 300 mW - Limits thermal rise to <125°C junction temperature under FR-4 board conditions with recommended pad layout.

Pinout & Package

Package: SOT23 - Surface-mount plastic package with matte tin-plated Alloy 42 leadframe, JEDEC-compliant, moisture sensitivity level 1, weight ≈ 0.008 g.

Pin/Terminal Circuit Role Design Meaning
1 (Source) Current return path for N-channel conduction Connected to ground or low-side reference; forms body diode cathode for reverse recovery in flyback paths.
2 (Gate) Control terminal for channel formation High-impedance input requiring minimal drive current; sensitive to ESD but compatible with 3.3 V/5 V logic levels.
3 (Drain) Current entry point into channel Connected to load or higher-potential rail; carries full switched current and must be routed with adequate copper area for thermal dissipation.

Key Features

Feature Design Value
Low gate threshold voltage Enables direct drive from 3.3 V microcontrollers without external level shifters, reducing component count in IoT sensor nodes.
Fast switching speed Sub-10 ns turn-on delay supports high-frequency (>10 MHz) gate driving in half-bridge and motor control ICs.
Low input capacitance 22 pF Ciss minimizes gate charge (Qg ≈ 1.2 nC) and reduces driver power consumption in battery-powered systems.
High VDSS rating 100 V withstand capability allows use in 48 V industrial bus interfaces and automotive auxiliary circuits without derating.
JEDEC-qualified reliability Qualified per AEC-Q standards for high-reliability operation, supporting extended lifetime in embedded control modules.

Applications

Small Servo Motor Control Power MOSFET Gate Driver

Use Scenario: Driving position-hold current in 12 V DC micro-servos used in robotics joints and actuator feedback loops.

IC Role / Device Role / Timing Role: Low-side switch controlling PWM-modulated current through servo coil windings.

Use Value: Low RDS(ON) and fast switching minimize coil heating and enable precise 20 kHz PWM resolution without audible noise.

Use Scenario: Level-shifting and buffering gate signals between MCU outputs and high-power N-channel MOSFETs in SMPS half-bridges.

IC Role / Device Role / Timing Role: Active pull-down stage ensuring rapid gate discharge and preventing shoot-through during dead-time transitions.

Use Value: Sub-10 ns fall time and low Ciss reduce propagation delay mismatch, improving timing margin in 500 kHz+ converters.

Low-Voltage Load Switch Reverse Polarity Protection

Use Scenario: Enabling/disabling power to peripheral sensors (e.g., I²C temperature sensors) in portable medical devices.

IC Role / Device Role / Timing Role: High-side or low-side load switch controlled by system supervisor IC or firmware.

Use Value: 0.17 A rating and 300 mW power dissipation support sustained operation at 3.3 V/100 mA loads with <50°C junction rise.

Use Scenario: Protecting 24 V industrial controllers from damage due to accidental reverse battery connection.

IC Role / Device Role / Timing Role: N-channel MOSFET configured in common-drain (source-follower) topology with gate tied to input rail via resistor.

Use Value: 100 V VDSS and low VGS(TH) ensure reliable conduction only when polarity is correct, dropping <0.2 V at rated current.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2004LK-7 RDS(ON) = 2.8 Ω @ VGS = 4.5 V; higher ID (0.25 A); same SOT23-3 package Better suited for 3.3 V logic-driven loads above 150 mA; slightly higher gate charge (1.5 nC) Select when lower on-resistance at 4.5 V is critical and thermal headroom permits higher peak current.
FDC637ANZ RDS(ON) = 2.5 Ω @ VGS = 4.5 V; dual-N configuration; SO-8 package Requires PCB real estate for SO-8; enables dual-switch topologies (e.g., half-bridge) not possible with single SOT23 Choose for designs needing two matched switches or where SO-8 thermal performance justifies larger footprint.

Compared with DMN2004LK-7 and FDC637ANZ, BSS123 offers tighter VGS(TH) tolerance (0.8–2.0 V vs. 1.0–2.5 V), lower leakage (<0.1 µA), and smaller SOT23 footprint-making it optimal for ultra-compact, low-leakage, 3.3 V–driven signal switching where absolute minimum RDS(ON) is secondary to gate drive simplicity.

Availability

BSS123 is available at Aetrix Electronics and suitable for small servo motor control, power MOSFET gate drivers, and low-voltage load switching requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for BSS123 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The BSS123 belongs to Diodes' trench-MOSFET product line, engineered specifically for low-power, low-voltage switching applications where gate drive simplicity, thermal efficiency, and JEDEC reliability are prioritized over ultra-low RDS(ON).

FAQ

Is BSS123 suitable for 3.3 V microcontroller GPIO direct drive?

Yes. With a gate threshold voltage range of 0.8–2.0 V and typical RDS(ON) of 3.2 Ω at VGS = 4.5 V, the BSS123 fully turns on using standard 3.3 V logic outputs. Its low input capacitance (22 pF) ensures minimal loading on MCU pins and avoids unintended oscillation without external gate resistors in most cases.

What is the maximum continuous drain current at 85°C ambient?

At TA = 85°C, the maximum continuous drain current is derated to approximately 0.11 A. This is calculated using the 300 mW power dissipation limit and RDS(ON) increase with temperature (1.4× at 85°C), resulting in ~250 mW allowable dissipation and corresponding ID = √(PD/RDS(ON)) ≈ 0.11 A.

Does BSS123 include integrated ESD protection?

No. The BSS123 does not integrate dedicated ESD protection structures. Its gate oxide is rated for ±20 V continuous gate-source voltage, but transient ESD events exceeding ±2 kV HBM require external protection (e.g., TVS diode or series resistor) in handling-sensitive environments like automated assembly or field-replaceable modules.

Can BSS123 replace BSS138 in existing designs?

Yes, with verification. BSS123 has higher VDSS (100 V vs. 50 V), lower RDS(ON) (3.2 Ω vs. 3.5 Ω at 10 V), and similar gate characteristics. However, its higher gate threshold spread (0.8–2.0 V vs. 0.8–1.5 V) may affect turn-on consistency in marginal 2.5 V drive scenarios-confirm timing margins and leakage in final layout.

BSS123TC Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
TO-236-3, SC-59, SOT-23-3
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
170mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
6Ohm @ 100mA, 10V
Vgs(th) (Max) @ Id:
2.8V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
20 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
360mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-23-3

BSS123TC FAQ

1.How can I place an order for BSS123TC through Aetrix?

Please submit a Request for Quotation (RFQ) for BSS123TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSS123TC reliable?

The price and inventory of BSS123TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS123TC is usually 5 days.

3.What payment methods are accepted for BSS123TC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSS123TC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSS123TC?

BSS123TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSS123TC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSS123TC?

For technical support, including BSS123TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS123TC requirements.

6.How does Aetrix verify that BSS123TC is sourced from the original manufacturer or authorized distributors?

All BSS123TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS123TC meets industry standards.

7.What is the process for return or replacement of BSS123TC?

All BSS123TC units undergo pre-shipment inspection (PSI). If there is an issue with BSS123TC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSS123TC part is unused and in its original packaging.

Return procedure for BSS123TC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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