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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. BSS138AKQB-QZ

Name: BSS138AKQB-QZ
Brand: Nexperia USA Inc.
SKU: BSS138AKQB-QZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSS138AKQB-QZ

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: 3-XDFN Exposed Pad

Datasheet:: BSS138AKQB-QZ.pdf

Description:: BSS138AKQB-Q/SOT8015/DFN1110D-

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Product details

Overview

BSS138AKQB-QZ from Nexperia is a 60 V, N-channel enhancement-mode Trench MOSFET in a DFN1110D-3 (SOT8015) leadless package, designed for low-side switching in space-constrained automotive and industrial control circuits. It delivers R_DS(on) = 2.1 Ω @ V_GS = 10 V, 100 mA, supports logic-level drive (V_GS(th) = 0.8–1.5 V), and operates up to T_j = 175 °C.

For engineers reviewing the BSS138AKQB-QZ datasheet, BSS138AKQB-QZ pinout, BSS138AKQB-QZ application, or BSS138AKQB-QZ equivalent, this page provides verified technical context, thermal derating behavior, AEC-Q101 qualification status, side-wettable flank solder inspection capability, and real-world switching performance metrics for relay driver and high-speed line driver implementations.

Technical Context

This MOSFET uses Trench technology to achieve low R_DS(on) and fast switching with Q_G(tot) = 0.21–0.315 nC and t_f = 3 ns. Its gate threshold voltage range (0.8–1.5 V at T_j = 25 °C) ensures reliable turn-on with 3.3 V and 5 V logic systems.

The device integrates ESD protection (HBM = 500 V), features side-wettable flanks for automated optical solder joint inspection, and is qualified to AEC-Q101 for automotive under-hood applications. Thermal resistance R_th(j-sp) = 17–22 K/W enables efficient heat transfer to PCB copper pads.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	60 V - Maximum drain-source blocking voltage; supports 48 V automotive bus transients and industrial 24/48 V systems.
R_DS(on)	2.1 Ω (typ) @ V_GS = 10 V, I_D = 100 mA - Enables <100 mW conduction loss at 340 mA continuous current on FR4 PCB.
V_GS(th)	0.8–1.5 V @ I_D = 250 µA - Ensures full enhancement with standard 3.3 V microcontroller GPIO without level-shifting.
Q_G(tot)	0.21–0.315 nC - Low gate charge minimizes drive power and enables >1 MHz switching in load-switching applications.
T_j max	175 °C - Extended junction temperature rating supports operation in engine control units and motor drivers without forced cooling.
ESD HBM	500 V - Integrated electrostatic discharge protection reduces need for external TVS in board-level ESD design.
P_tot	6.9 W @ T_sp = 25 °C - High power dissipation enabled by low R_th(j-sp) (17–22 K/W) to solder point on optimized PCB layout.

Pinout & Package

DFN1110D-3 (SOT8015) is a 1.1 mm × 1.0 mm × 0.48 mm leadless, ultra-thin surface-mount package with side-wettable flanks for automated optical solder inspection. It features a thermally enhanced drain pad and 0.65 mm pitch.

Pin/Terminal	Circuit Role	Design Meaning
1	G (Gate)	Control terminal; accepts logic-level input; requires ≤0.315 nC charge for full turn-on; sensitive to ESD.
2	S (Source)	Reference node for gate drive; connects to system ground or low-side return path; carries full load current.
3	D (Drain)	High-side connection point; ties to switched load or supply rail; thermally coupled to PCB copper for heat dissipation.

Key Features

Feature	Design Value
Logic-level gate drive	V_GS(th) ≤ 1.5 V enables direct interface with 3.3 V/5 V MCUs without gate driver ICs.
AEC-Q101 qualification	Qualified for automotive applications including engine management, body electronics, and ADAS sensor interfaces.
Side-wettable flanks	Protruding flank geometry allows AOI systems to verify solder fillet formation-critical for zero-defect automotive manufacturing.
Trench MOSFET architecture	Delivers lower R_DS(on) and higher cell density than planar MOSFETs, reducing footprint and conduction losses.
Extended temperature range	Rated for continuous operation from –55 °C to +175 °C junction temperature-suitable for under-hood and industrial environments.

Applications

Relay Driver

High-Speed Line Driver

Use Scenario: Driving electromagnetic relays in automotive door modules and HVAC control units where space and thermal headroom are constrained.

IC Role / Device Role / Timing Role: Low-side switch controlling relay coil current; handles inductive kickback via integrated body diode.

Use Value: 175 °C T_j rating and 60 V V_DS withstand capability ensure reliability during load dump events and hot ambient conditions.

Use Scenario: Transmitting digital control signals across noisy industrial backplanes or CAN/LIN stub lines with minimal propagation delay.

IC Role / Device Role / Timing Role: Fast-switching buffer stage isolating MCU GPIO from long traces; leverages 3 ns fall time and low C_iss (9 pF).

Use Value: Sub-nanosecond switching and low gate charge enable clean edge integrity at >10 Mbps data rates without signal distortion.

Low-Side Load Switch

Switching Power Supply Auxiliary

Use Scenario: Enabling/disabling power to sensors, LEDs, or communication peripherals in battery-powered IoT nodes and telematics units.

IC Role / Device Role / Timing Role: Controlled power path switch; operates in linear or saturated mode depending on V_GS and load current.

Use Value: R_DS(on) = 2.1 Ω limits voltage drop to <350 mV at 170 mA, preserving battery runtime and minimizing self-heating.

Use Scenario: Synchronous rectification or auxiliary bias winding switching in isolated DC-DC converters for automotive infotainment and ADAS power supplies.

IC Role / Device Role / Timing Role: Secondary-side switch managing energy transfer timing; benefits from low Q_GD (0.051 nC) for reduced Miller-induced shoot-through risk.

Use Value: 0.051 nC gate-drain charge and 1.1 pF Crss minimize switching losses and improve efficiency at 500 kHz–1 MHz operating frequencies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN2004LKQ-7	R_DS(on) = 1.8 Ω @ V_GS = 4.5 V; same DFN1110D-3 package; lower V_GS(th) (0.5–1.1 V); no AEC-Q101 certification.	Preferred for consumer-grade 3.3 V systems requiring marginally lower on-resistance but not automotive qualification.	Select when AEC-Q101 is not required and tighter V_GS(th) tolerance improves system noise immunity.
PSMN1R5-30YL	R_DS(on) = 1.5 mΩ @ V_GS = 10 V; larger LFPAK56 package; rated for 30 V only; higher ID (120 A pulsed).	Used in high-current 12 V/24 V power distribution; unsuitable for 60 V applications or space-constrained layouts.	Choose only for high-power, non-automotive 24 V systems where thermal performance outweighs size constraints.

Compared with DMN2004LKQ-7 and PSMN1R5-30YL, the BSS138AKQB-QZ uniquely balances AEC-Q101 compliance, 60 V rating, ultra-small footprint, and logic-level compatibility-making it optimal for automotive signal switching where qualification, voltage margin, and board area are jointly critical.

Availability

BSS138AKQB-QZ is available at Aetrix Electronics and suitable for automotive relay drivers, industrial low-side load switches, high-speed line drivers, and AEC-Q101-compliant embedded control modules requiring stable component supply across extended temperature ranges.

Supply support for BSS138AKQB-QZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD-protected components.

The BSS138AKQB-QZ belongs to Nexperia's AEC-Q101-qualified TrenchMOS portfolio, engineered specifically for robust, space-efficient switching in automotive body electronics, power management, and sensor interface applications.

FAQ

Is BSS138AKQB-QZ pin-compatible with the standard BSS138?

No. BSS138AKQB-QZ uses the DFN1110D-3 (SOT8015) leadless package with side-wettable flanks, whereas legacy BSS138 variants use SOT23-3. The pin numbering (G-S-D) matches functionally, but the footprint, thermal characteristics, and soldering process differ significantly-requiring PCB redesign and requalification.

What is the maximum continuous drain current at 100 °C ambient temperature?

At T_amb = 100 °C on an FR4 PCB with single-sided 1 cm² drain pad, the normalized current derating factor is ~70% (per Fig. 2), yielding I_D ≈ 240 mA continuous-matching the limiting value table. This reflects real thermal constraints, not just electrical ratings.

Does BSS138AKQB-QZ include integrated gate protection?

Yes. It features built-in ESD protection rated to 500 V HBM per JESD22-A114, eliminating the need for external gate resistors or TVS diodes in most 3.3 V/5 V logic-driven applications-reducing BOM count and layout complexity.

Can BSS138AKQB-QZ be used in avalanche mode?

Yes-its unclamped avalanche energy rating is 6.6 mJ (T_j(init) = 25 °C, I_D = 20 mA). This supports limited inductive switching without external snubbers, but repetitive avalanche operation is not recommended; proper clamping or freewheeling paths should be used in production designs.

BSS138AKQB-QZ Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 3-XDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 60 V

Current - Continuous Drain (Id) @ 25°C:: 340mA (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 2.5V, 10V

Rds On (Max) @ Id, Vgs:: 2.8Ohm @ 100mA, 10V

Vgs(th) (Max) @ Id:: 1.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 315 pC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 9 pF @ 30 V

FET Feature:: -

Power Dissipation (Max):: 490mW (Ta), 6.9W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: DFN1110D-3

BSS138AKQB-QZ FAQ

1.How can I place an order for BSS138AKQB-QZ through Aetrix?

Please submit a Request for Quotation (RFQ) for BSS138AKQB-QZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSS138AKQB-QZ reliable?

The price and inventory of BSS138AKQB-QZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS138AKQB-QZ is usually 5 days.

3.What payment methods are accepted for BSS138AKQB-QZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSS138AKQB-QZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSS138AKQB-QZ?

BSS138AKQB-QZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSS138AKQB-QZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSS138AKQB-QZ?

For technical support, including BSS138AKQB-QZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS138AKQB-QZ requirements.

6.How does Aetrix verify that BSS138AKQB-QZ is sourced from the original manufacturer or authorized distributors?

All BSS138AKQB-QZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS138AKQB-QZ meets industry standards.

7.What is the process for return or replacement of BSS138AKQB-QZ?

All BSS138AKQB-QZ units undergo pre-shipment inspection (PSI). If there is an issue with BSS138AKQB-QZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSS138AKQB-QZ part is unused and in its original packaging.

Return procedure for BSS138AKQB-QZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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