Nexperia USA Inc. BSS84AKV,115
- Part No.:
- BSS84AKV,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-563, SOT-666
- Datasheet:
-
BSS84AKV,115.pdf
- Description:
- MOSFET 2P-CH 50V 0.17A SOT666
- Quantity:
- Payment:

- Shipping:

Inventory:25,016
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSS84AKV,115 from Nexperia is a dual P-channel enhancement-mode Trench MOSFET in SOT666 package, rated for −50 V drain-source voltage and −170 mA continuous drain current per channel at 25 °C. It delivers logic-level gate drive compatibility (VGS(th) = −1.1 to −2.1 V), low RDS(on) of 4.5 Ω (typ.) at VGS = −10 V, and fast switching with td(on) = 13–26 ns and tf = 25 ns - enabling high-side loadswitching and relay driving in space-constrained portable electronics.
For engineers reviewing the BSS84AKV,115 datasheet, BSS84AKV,115 pinout, BSS84AKV,115 application, or BSS84AKV,115 equivalent, key selection criteria include dual-channel P-channel topology, ultra-small SOT666 footprint (1.6 × 1.2 × 0.55 mm), thermal resistance Rth(j-a) = 330 K/W (per transistor, FR4 PCB), ESD rating of 1 kV HBM, and verified performance across −55 °C to +150 °C junction temperature range.
Technical Context
This dual discrete MOSFET integrates two independent P-channel Trench devices sharing no internal connection - each with isolated source, gate, and drain terminals. Its trench architecture enables lower RDS(on) and higher transconductance (gfs = 150 mS typ.) versus planar alternatives while maintaining tight VGS(th) distribution (−1.6 V typ.) for predictable turn-on behavior under logic-level control.
The device operates as a normally-off switch requiring negative gate bias relative to source. With QG(tot) = 0.26–0.35 nC and Ciss = 24–36 pF, it supports high-frequency switching up to several MHz in low-power DC-DC and signal routing applications, while its integrated source-drain diode (VSD = −0.48 to −1.2 V at −115 mA) provides controlled reverse conduction capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −50 V - Maximum blocking voltage per channel; supports rail-to-rail operation in 3.3 V/5 V systems with margin against transients. |
| ID (continuous) | −170 mA @ Tamb = 25 °C - Sustained load current per channel without derating on standard FR4 PCB. |
| RDS(on) | 4.5 Ω (typ.) @ VGS = −10 V, ID = −100 mA - Low on-resistance minimizes conduction loss in battery-powered high-side switches. |
| VGS(th) | −1.1 to −2.1 V - Threshold voltage range ensures reliable turn-on with 3.3 V GPIO or open-drain drivers. |
| QG(tot) | 0.26–0.35 nC - Small total gate charge enables fast switching with minimal driver strength requirement. |
| Tj range | −55 to +150 °C - Full industrial temperature operation without derating; validated by JEDEC stress testing. |
| ESD HBM | 1000 V - Robust electrostatic discharge immunity simplifies handling and board-level ESD protection design. |
Pinout & Package
Package: SOT666 - ultra-compact surface-mount plastic package (1.6 mm × 1.2 mm × 0.55 mm body height), 6-lead, 0.5 mm pitch, designed for high-density PCB layouts and reflow soldering per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of Channel 1 - connects to load return path or system ground reference for high-side configuration. |
| 2 | G1 | Gate terminal of Channel 1 - controls turn-on/off of first MOSFET; requires negative bias relative to S1. |
| 3 | D2 | Drain terminal of Channel 2 - connects to power rail or switched output node for independent second channel control. |
| 4 | S2 | Source terminal of Channel 2 - electrically isolated from S1; enables dual independent high-side or low-side switching. |
| 5 | G2 | Gate terminal of Channel 2 - fully independent control input; no shared gate structure with G1. |
| 6 | D1 | Drain terminal of Channel 1 - connects to power supply or load input; thermally coupled to PCB pad per datasheet layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) ≤ −2.1 V ensures full enhancement with 3.3 V microcontroller outputs without level-shifting circuitry. |
| Ultra-small SOT666 footprint | 1.6 × 1.2 mm area saves >60% board space vs. SO-8 or TSOP6 packages - critical for wearables and IoT sensors. |
| Trench MOSFET technology | Delivers 30% lower RDS(on) and 2× higher gfs than comparable planar P-MOSFETs at same die size. |
| ESD protection | 1 kV HBM rating eliminates need for external TVS diodes in most handheld and consumer-grade designs. |
| Thermal performance | Rth(j-sp) = 115 K/W enables direct thermal coupling to PCB copper pour for sustained 170 mA operation. |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
|
Use Scenario: Driving electromagnetic relays in programmable logic controllers (PLCs) and industrial I/O modules where space and power efficiency are constrained. IC Role / Device Role / Timing Role: Dual-channel high-side switch controlling coil current paths; each channel independently isolates relay coils from common supply rails. Use Value: Eliminates need for discrete bipolar transistors and base resistors; reduces component count by 4× per relay while improving reliability via integrated ESD protection. |
Use Scenario: Transmitting differential digital signals across short PCB traces or flexible cables in USB-C accessory detection and sensor interface circuits. IC Role / Device Role / Timing Role: Fast-switching active pull-up/pull-down element in bidirectional line drivers supporting >10 MHz toggle rates. Use Value: Achieves <26 ns turn-on delay and <25 ns fall time - enabling clean edge integrity without overshoot in 3.3 V signaling environments. |
| High-Side Loadswitch | Switching Circuits |
|
Use Scenario: Power gating individual subsystems (e.g., display backlight, RF module, sensor array) in battery-powered medical monitors and portable diagnostics equipment. IC Role / Device Role / Timing Role: Dual independent high-side power switch managing separate voltage domains with precise enable/disable sequencing. Use Value: RDS(on) = 4.5 Ω (typ.) limits voltage drop to <0.8 V at 170 mA - preserving >90% efficiency in 3.3 V supply rails. |
Use Scenario: Implementing compact, low-cost power multiplexers in automotive body control modules (non-safety-critical) and smart home hubs requiring dual independent switching paths. IC Role / Device Role / Timing Role: Discrete dual-P-channel switch replacing mechanical jumpers or larger IC-based load switches in cost-sensitive designs. Use Value: SOT666 package allows placement directly adjacent to connectors or connectors - reducing trace inductance and improving EMC performance over leaded alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG1012T | Single-channel P-MOSFET (SOT-723); RDS(on) = 5.5 Ω @ −4.5 V; no dual integration. | Requires two devices and extra PCB area to match BSS84AKV functionality; lacks integrated dual isolation. | Select when only one switch is needed and board space permits duplication; not suitable for true dual-channel coordination. |
| FDMA1023PZ | Dual P-channel in WDFN-6 (2 × 2 mm); RDS(on) = 3.8 Ω @ −4.5 V; higher thermal performance (Rth(j-a) = 150 K/W). | Better thermal handling but 2.5× larger footprint; requires modified stencil and layout; not drop-in compatible. | Prefer for higher-current (>200 mA) or thermally demanding applications where SOT666 size constraint is relaxed. |
Compared with DMG1012T and FDMA1023PZ, BSS84AKV,115 uniquely balances ultra-compact size, dual-channel independence, and logic-level compatibility - making it optimal for space-limited, low-power, multi-rail switching where thermal loads remain below 330 mW per channel.
Availability
BSS84AKV,115 is available at Aetrix Electronics and suitable for relay driver circuits, high-speed line drivers, high-side loadswitches, and compact switching circuits requiring stable component supply and long-term production continuity.
Supply support for BSS84AKV,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient logic, analog, and MOSFET solutions - spun off from Philips in 2017 and headquartered in Nijmegen, Netherlands.
The BSS84AKV belongs to Nexperia's TrenchMOS family, engineered specifically for space-constrained, low-voltage switching applications in portable electronics, wearables, and industrial control where miniaturization and logic-level drive are critical.
FAQ
What is the maximum continuous drain current per channel at 100 °C ambient?
The BSS84AKV,115 supports −110 mA continuous drain current per channel at Tamb = 100 °C, as specified in Table 5 (Limiting Values). This derating reflects thermal constraints of the SOT666 package on standard FR4 PCB; actual current may increase with enhanced copper pour or forced airflow.
Can BSS84AKV,115 be used in linear (analog) mode operation?
No - the BSS84AKV,115 is characterized and qualified only for switching operation. Its Safe Operating Area (SOA) curve (Fig. 3) shows limited linear region capability, and RDS(on) variation with temperature (Fig. 11) makes precision analog use impractical. It is not recommended for constant-current or amplifier applications.
Is the SOT666 package lead-free and RoHS-compliant?
Yes - the BSS84AKV,115 uses lead-free terminations and complies with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. The package material meets JEDEC J-STD-020 moisture sensitivity level MSL3, and reflow profile follows IPC/JEDEC J-STD-020D.2.
Does the device include back-to-back body diodes between channels?
No - the BSS84AKV,115 contains two fully isolated P-channel MOSFETs with no internal connection between channels. Each has its own intrinsic source-drain diode (VSD = −0.48 to −1.2 V), oriented anode-to-source, cathode-to-drain - enabling independent reverse conduction per channel but no cross-channel diode coupling.
BSS84AKV,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SOT-563, SOT-666
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 50V
- Current - Continuous Drain (Id) @ 25°C:
- 170mA
- Rds On (Max) @ Id, Vgs:
- 7.5Ohm @ 100mA, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.35nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 36pF @ 25V
- Power - Max:
- 500mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-666
BSS84AKV,115 FAQ
1.How can I place an order for BSS84AKV,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSS84AKV,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSS84AKV,115 reliable?
The price and inventory of BSS84AKV,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSS84AKV,115 is usually 5 days.
3.What payment methods are accepted for BSS84AKV,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSS84AKV,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSS84AKV,115?
BSS84AKV,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSS84AKV,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSS84AKV,115?
For technical support, including BSS84AKV,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSS84AKV,115 requirements.
6.How does Aetrix verify that BSS84AKV,115 is sourced from the original manufacturer or authorized distributors?
All BSS84AKV,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSS84AKV,115 meets industry standards.
7.What is the process for return or replacement of BSS84AKV,115?
All BSS84AKV,115 units undergo pre-shipment inspection (PSI). If there is an issue with BSS84AKV,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSS84AKV,115 part is unused and in its original packaging.
Return procedure for BSS84AKV,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSS84AKV,115 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

