Nexperia USA Inc. BUK4D110-20PX
- Part No.:
- BUK4D110-20PX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
BUK4D110-20PX.pdf
- Description:
- SMALL SIGNAL MOSFET FOR AUTOMOTI
- Quantity:
- Payment:

- Shipping:

Inventory:6,000
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Product details
Overview
BUK4D110-20PX from Nexperia is a P-channel enhancement-mode Trench MOSFET in DFN2020MD-6 (SOT1220) package, rated for -20 V VDS, 88–110 mΩ RDS(on) at VGS = -4.5 V and ID = -3.4 A, with AEC-Q101 qualification and 175 °C maximum junction temperature. It serves as a high-side load switch or DC-DC synchronous rectifier in automotive power management.
For engineers reviewing the BUK4D110-20PX datasheet, BUK4D110-20PX pinout, BUK4D110-20PX application, or BUK4D110-20PX equivalent, key selection criteria include its side-wettable flanks for optical solder inspection, HBM ESD rating >1 kV, fast switching (tr = 7 ns, tf = 7 ns), low gate charge (QG(tot) = 3.6–5 nC), and thermal resistance Rth(j-sp) = 15–20 K/W.
Technical Context
This device uses Trench MOSFET technology to achieve low on-resistance and fast switching in a thermally enhanced ultra-thin DFN package. Its gate threshold voltage (VGS(th) = -0.6 to -1.3 V) enables robust turn-on control with standard logic-level drive down to -2.5 V.
The integrated source-drain diode supports bidirectional current flow in half-bridge configurations, with VSD = -0.9 to -1.2 V at IS = -2 A and trr = 9 ns. Avalanche ruggedness of 5 mJ (unclamped, ID = -0.5 A) supports transient energy handling in inductive switching applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -20 V - Maximum drain-source blocking voltage for automotive 12 V system rail protection |
| RDS(on) | 88–110 mΩ @ VGS = -4.5 V, ID = -3.4 A, Tj = 25 °C - Enables <1 W conduction loss at 3.4 A continuous current |
| QG(tot) | 3.6–5 nC - Low gate charge reduces driver power demand and enables >1 MHz switching in DC-DC converters |
| tr/tf | 7 ns / 7 ns @ VDS = -10 V, ID = -3.2 A, RG(ext) = 6 Ω - Supports high-frequency PWM with minimal switching loss |
| Tj(max) | 175 °C - Enables operation in under-hood automotive environments without derating at ambient up to 125 °C |
| Rth(j-sp) | 15–20 K/W - Junction-to-solder-point thermal resistance allows direct PCB copper pad cooling for high-power density layouts |
| ESD HBM | >1 kV (Class H1C) - Robust electrostatic immunity simplifies handling and board assembly without special ESD controls |
Pinout & Package
DFN2020MD-6 (SOT1220) is a 2 mm × 2 mm × 0.65 mm leadless plastic package with side-wettable flanks for automated optical solder joint inspection. Thermal performance is optimized via exposed drain terminals on the bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 5, 6, 7 | Drain (D) | Five parallel drain terminals connected to internal die drain metallization and exposed thermal pad - primary current path and heat dissipation node |
| 3 | Gate (G) | Control terminal with 36 Ω typical gate resistance - compatible with standard logic-level drivers and low-current microcontroller GPIO |
| 4, 8 | Source (S) | Two source terminals providing low-inductance return path - enables Kelvin sensing or separate power/return routing in high-accuracy current monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Side-wettable flanks | Enables 100% automated optical inspection (AOI) of solder joints without X-ray, reducing manufacturing defect escape |
| AEC-Q101 qualification | Validated for automotive powertrain and body electronics per stress test requirements - no additional qualification needed for Tier 1 designs |
| Trench MOSFET architecture | Delivers 25% lower RDS(on) vs planar P-channel equivalents at same die size - improves power density in space-constrained modules |
| Extended temperature range | Full parametric performance guaranteed from -55 °C to +175 °C - eliminates need for thermal derating in engine control units |
| Low QGD/QG ratio | QGD = 1.2 nC of total QG(tot) = 3.6–5 nC - minimizes Miller plateau time and improves hard-switching robustness |
Applications
| Automotive High-Side Load Switch | DC-DC Synchronous Rectifier |
|---|---|
|
Use Scenario: Power distribution to infotainment head unit during vehicle ignition sequence, requiring controlled inrush current and reverse polarity protection. IC Role / Device Role / Timing Role: P-channel MOSFET configured as high-side switch with gate driven by dedicated load switch controller (e.g., NCV8450). Use Value: 175 °C Tj(max) ensures reliability in hot under-dash environments; side-wettable flanks enable AOI verification of solder integrity on safety-critical power rails. |
Use Scenario: Secondary-side rectification in 12 V → 5 V buck converter for ADAS camera module, operating at 500 kHz switching frequency. IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode to reduce conduction loss and improve efficiency. Use Value: 88–110 mΩ RDS(on) cuts rectifier loss by >60% vs 40 V Schottky; fast tr/tf (7 ns) minimizes dead-time losses at high frequency. |
| Industrial PLC Output Stage | USB-C Power Delivery Switch |
|
Use Scenario: Solid-state relay replacement in programmable logic controller output card driving 24 V solenoid loads with 100 ms switching cycles. IC Role / Device Role / Timing Role: High-side switch controlling solenoid current with integrated overtemperature shutdown via external thermal monitor. Use Value: Avalanche energy rating of 5 mJ absorbs inductive kickback without external snubber; AEC-Q101 qualification provides proven reliability for industrial field deployments. |
Use Scenario: VBUS path switch in USB-C port supporting 20 V/5 A PD3.0 power delivery, requiring reverse-voltage blocking and low RDS(on). IC Role / Device Role / Timing Role: Bidirectional P-channel switch enabling source/sink capability with gate driven by PD controller (e.g., FUSB302). Use Value: -20 V VDS rating covers full USB PD 3.0 range; dual source pins support Kelvin sensing for accurate current limiting in safety-critical charging paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG2305UX-13 | RDS(on) = 48 mΩ @ -4.5 V but only rated for -20 V VDS; no AEC-Q101 qualification; SO-8 package (larger footprint, higher Rth(j-a)) | Lacks automotive qualification and side-wettable flanks - suitable for consumer-grade DC-DC but not for automotive or high-reliability industrial use | Select when cost is prioritized over qualification and thermal performance; requires larger PCB area and lacks AOI support |
| PSMN2R0-20PL | RDS(on) = 2.0 mΩ @ -4.5 V but in larger LFPAK56 package; AEC-Q101 qualified; higher QG(tot) = 24 nC limits switching speed | Better conduction efficiency at high current (>10 A), but slower switching and larger footprint - better for low-frequency, high-current loads | Select for high-current (<15 A), low-frequency (<100 kHz) applications where thermal mass outweighs switching speed needs |
Compared with DMG2305UX-13 and PSMN2R0-20PL, BUK4D110-20PX uniquely balances automotive qualification, ultra-compact DFN2020MD-6 packaging, side-wettable flanks for process control, and optimized gate charge for high-frequency DC-DC - making it the preferred choice for space-constrained, high-reliability 12 V system switches.
Availability
BUK4D110-20PX is available at Aetrix Electronics and suitable for automotive power distribution, industrial PLC outputs, USB-C PD switching, and high-speed line driver applications requiring stable component supply across production lifecycles.
Supply support for BUK4D110-20PX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD-protected interfaces.
BUK4D110-20PX belongs to Nexperia's TrenchMOS automotive power portfolio, designed specifically for high-efficiency, high-temperature switching in 12 V vehicle electrical systems and industrial control modules.
FAQ
What is the maximum continuous drain current for BUK4D110-20PX at 100 °C ambient temperature?
At Tamb = 100 °C on a standard FR4 PCB with 6 cm² drain pad, the maximum continuous drain current is -4.2 A (per Table 5, Limiting Values). This is derived from thermal derating of the 7.5 W Ptot rating using Rth(j-a) = 66–76 K/W and Tj(max) = 175 °C, ensuring safe operation without active cooling.
Does BUK4D110-20PX support gate drive from a 3.3 V microcontroller?
No - the gate threshold voltage VGS(th) ranges from -0.6 V to -1.3 V, but full enhancement requires VGS ≤ -4.5 V to achieve specified RDS(on). A 3.3 V MCU cannot drive the gate sufficiently negative; a level-shifting circuit or dedicated gate driver (e.g., TC4427) is required to generate ≥ -4.5 V gate voltage relative to source.
How does the side-wettable flank feature improve manufacturing yield?
The side-wettable flanks expose solderable metal along the vertical edges of the DFN2020MD-6 package, allowing automated optical inspection (AOI) systems to verify solder fillet formation and wetting quality without X-ray. This detects voids, insufficient solder, or tombstoning early in SMT lines, improving first-pass yield in automotive and industrial production.
Can BUK4D110-20PX be used in avalanche mode for inductive load switching?
Yes - it is rated for 5 mJ non-repetitive unclamped avalanche energy (EAS) at Tj(init) = 25 °C and ID = -0.5 A. This supports single-event inductive kickback suppression in relay or solenoid drivers, but repetitive avalanche operation is not characterized and must be avoided in continuous-duty designs.
BUK4D110-20PX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.4A (Ta), 6.7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 8V
- Rds On (Max) @ Id, Vgs:
- 96mOhm @ 3.4A, 8V
- Vgs(th) (Max) @ Id:
- 1.3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 5 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 365 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta), 7.5W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2020MD-6
BUK4D110-20PX FAQ
1.How can I place an order for BUK4D110-20PX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK4D110-20PX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK4D110-20PX reliable?
The price and inventory of BUK4D110-20PX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK4D110-20PX is usually 5 days.
3.What payment methods are accepted for BUK4D110-20PX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK4D110-20PX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK4D110-20PX?
BUK4D110-20PX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK4D110-20PX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK4D110-20PX?
For technical support, including BUK4D110-20PX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK4D110-20PX requirements.
6.How does Aetrix verify that BUK4D110-20PX is sourced from the original manufacturer or authorized distributors?
All BUK4D110-20PX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK4D110-20PX meets industry standards.
7.What is the process for return or replacement of BUK4D110-20PX?
All BUK4D110-20PX units undergo pre-shipment inspection (PSI). If there is an issue with BUK4D110-20PX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK4D110-20PX part is unused and in its original packaging.
Return procedure for BUK4D110-20PX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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