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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. BUK4D16-20H

Name: BUK4D16-20H
Brand: Nexperia USA Inc.
SKU: BUK4D16-20H
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK4D16-20H

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: 6-UDFN Exposed Pad

Datasheet:: BUK4D16-20H.pdf

Description:: SMALL SIGNAL MOSFETS FOR AUTOMOT

Quantity:: RFQ Add To RFQ list

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Inventory:2,769

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Product details

Overview

BUK4D16-20H from Nexperia is a 20 V, N-channel Trench MOSFET in DFN2020MD-6 (SOT1220) package, optimized for low-side load switching and DC-DC conversion with R_DS(on) = 13 mΩ @ V_GS = 4.5 V, I_D = 8.5 A, T_j = 25 °C, and AEC-Q101 qualification for automotive use.

For engineers reviewing the BUK4D16-20H datasheet, BUK4D16-20H pinout, BUK4D16-20H application, or BUK4D16-20H equivalent, this device supports high-speed switching in space-constrained automotive and industrial power stages where thermal performance, side-wettable flanks for solder inspection, and 175 °C junction operation are critical selection criteria.

Technical Context

This N-channel enhancement-mode MOSFET uses Trench technology to achieve low on-resistance and fast switching dynamics. Its gate threshold voltage (V_GS(th)) ranges 0.6–1.3 V at T_j = 25 °C, enabling robust turn-on with 2.5 V logic-level drive while maintaining <1 µA drain leakage at V_DS = 20 V, T_j = 25 °C.

The device integrates an intrinsic source-drain diode with V_SD = 0.7–1.2 V at I_S = 2 A and t_rr = 10 ns, supporting synchronous rectification and flyback recovery. Thermal resistance R_th(j-sp) is 4–8 K/W to solder point, leveraging the thermally enhanced DFN2020MD-6 package with exposed drain pads.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	20 V - Maximum continuous drain-source blocking voltage; defines safe operating range in 12 V automotive systems.
R_DS(on)	13 mΩ (typ) @ V_GS = 4.5 V, I_D = 8.5 A, T_j = 25 °C - Enables <100 mW conduction loss at 9 A, reducing thermal stress in compact layouts.
I_D (cont)	26 A @ T_sp = 25 °C - Continuous current rating based on solder-point temperature, not ambient; enables higher real-world current than ambient-rated equivalents.
Q_G(tot)	9.8 nC (typ) - Total gate charge determines driver strength requirement; compatible with standard logic-level gate drivers (e.g., TC4427).
T_j(max)	175 °C - Junction temperature limit validated per AEC-Q101; supports under-hood automotive deployment without derating.
E_AS	13 mJ - Unclamped avalanche energy at I_D = 1.3 A; provides single-pulse ruggedness against inductive switching transients.

Pinout & Package

DFN2020MD-6 (SOT1220) is a 2 mm × 2 mm × 0.65 mm leadless, thermally enhanced plastic package with side-wettable flanks for automated optical solder inspection and high-power density mounting.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 5, 6, 7	Drain (D)	Five parallel drain terminals connected to internal die drain metallization; provide low-inductance, high-current path and thermal conduction to PCB copper pad.
3	Gate (G)	Single gate input terminal; requires ESD-safe handling and controlled gate drive slew rate to minimize ringing and overshoot.
4, 8	Source (S)	Two dedicated source terminals; establish low-impedance return path and reduce source inductance in high-di/dt switching.

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive applications including engine control, body electronics, and ADAS power stages per stress test requirements.
Side-wettable flanks	Enables 100% automated optical inspection (AOI) of solder joints without X-ray, improving manufacturing yield and field reliability.
Trench MOSFET architecture	Delivers lower R_DS(on) and higher figure-of-merit (R_DS(on) × Q_G) vs. planar MOSFETs, reducing conduction + switching losses simultaneously.
ESD protection > 2 kV HBM	Class H2 rating eliminates need for external ESD protection in board-level handling and assembly, simplifying layout and BOM.
Extended T_j range (−55 to +175 °C)	Supports operation in extreme environments such as under-bonnet modules, motor controllers, and industrial inverters without thermal shutdown.

Applications

Automotive Body Control Module (BCM)

Industrial DC-DC Converter

Use Scenario: Driving 12 V solenoids, relays, and LED lighting loads in vehicle door modules and seat controls.

IC Role / Device Role / Timing Role: Low-side switch controlling load current with fast turn-on/turn-off (<25 ns combined delay + rise/fall) to minimize PWM jitter.

Use Value: 13 mΩ R_DS(on) limits power dissipation to ≤1.5 W at 10 A, eliminating heatsinks in space-constrained BCM PCBs.

Use Scenario: Synchronous rectifier in 5–24 V input, 3.3–12 V output buck converters for PLC I/O modules.

IC Role / Device Role / Timing Role: Power switch in high-frequency (500 kHz–1 MHz) topology; leverages low Q_G and C_iss = 931 pF for efficient gate drive.

Use Value: 10 ns reverse recovery time and low Q_r = 3 nC reduce dead-time losses and EMI generation during hard commutation.

High-Speed Line Driver

Low-Side Load Switch

Use Scenario: Transmitting differential digital signals across noisy factory-floor cabling in industrial Ethernet PHY interfaces.

IC Role / Device Role / Timing Role: Current-source active termination switch enabling precise impedance matching and signal integrity up to 100 Mbps.

Use Value: Tight V_GS(th) distribution (0.6–1.3 V) ensures consistent turn-on across temperature and unit-to-unit variation, minimizing timing skew.

Use Scenario: Hot-swap power management for USB-C PD accessories and embedded peripherals requiring inrush current limiting.

IC Role / Device Role / Timing Role: Main pass element controlled by external gate driver IC; handles peak currents up to 106 A (single pulse, 10 µs).

Use Value: 175 °C T_j(max) and 19 W P_tot at T_sp = 25 °C allow sustained 8.5 A operation without thermal throttling in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage power switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ON Semiconductor NTMFS4C09NT1G	R_DS(on) = 9.5 mΩ @ 4.5 V but larger 3.3 mm × 3.3 mm SO-8FL package; no side-wettable flanks.	Better conduction efficiency but less suitable for AOI-driven automotive production lines.	Select when lowest possible R_DS(on) dominates over manufacturability and footprint size.
Infineon BSC014N04LS6	40 V rating, R_DS(on) = 1.4 mΩ @ 4.5 V, PG-TSDSON-8 package; higher voltage margin but larger die and cost.	Over-specified for 12 V systems; introduces unnecessary gate charge (Q_G = 22 nC) and layout area.	Select only if future-proofing for 24 V system expansion or higher surge immunity is required.

Compared with NTMFS4C09NT1G and BSC014N04LS6, BUK4D16-20H offers optimal balance of automotive qualification, AOI compatibility, and thermal performance in a 2 mm × 2 mm footprint-making it preferred for cost-sensitive, high-volume automotive and industrial switching where solder joint reliability and board space are constrained.

Availability

BUK4D16-20H is available at Aetrix Electronics and suitable for automotive body electronics, industrial DC-DC converters, and high-speed line driver circuits requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant traceability.

Supply support for BUK4D16-20H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD-protected components.

The BUK4D16-20H belongs to Nexperia's TrenchMOS® automotive power portfolio, engineered specifically for robust low-voltage switching in harsh environments where thermal resilience, manufacturability, and AEC-Q101 compliance are mandatory.

FAQ

What is the maximum continuous drain current for BUK4D16-20H at 100 °C solder point temperature?

At T_sp = 100 °C, the normalized continuous drain current is 65% of the 26 A rating at T_sp = 25 °C, yielding 16.9 A. This value is derived from Figure 2 in the datasheet and accounts for thermal derating due to reduced heat transfer efficiency at elevated solder point temperatures.

Does BUK4D16-20H support 1.8 V logic-level gate drive?

No-BUK4D16-20H has a typical V_GS(th) of 0.95 V but requires ≥2.5 V to achieve meaningful R_DS(on) (17–25 mΩ). At 1.8 V, R_DS(on) exceeds 50 mΩ, causing excessive conduction loss; it is not rated for 1.8 V logic drive and should be paired with ≥3.3 V gate sources.

How does the side-wettable flank design impact reflow soldering process?

The side-wettable flanks require a specific stencil aperture and reflow profile: solder paste deposit height must be ≥0.1 mm, and peak reflow temperature must reach 245–260 °C for 45–60 s to ensure full fillet formation on all six flanks-verified via AOI using standardized gray-scale contrast thresholds per IPC-A-610.

Is the intrinsic body diode suitable for reverse polarity protection?

Yes-the source-drain diode has V_SD = 0.7–1.2 V at I_S = 2 A and t_rr = 10 ns, making it viable for low-loss reverse polarity protection in 12 V systems. However, its 2 A continuous rating (T_amb = 25 °C) requires thermal derating above 60 °C ambient, and external Schottky clamping is recommended for >5 A applications.

BUK4D16-20H Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 6-UDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 20 V

Current - Continuous Drain (Id) @ 25°C:: 8.5A (Ta), 26A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 2.5V, 8V

Rds On (Max) @ Id, Vgs:: 14mOhm @ 9A, 8V

Vgs(th) (Max) @ Id:: 1.3V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 15 nC @ 4.5 V

Vgs (Max):: ±12V

Input Capacitance (Ciss) (Max) @ Vds:: 931 pF @ 10 V

FET Feature:: -

Power Dissipation (Max):: 2W (Ta), 19W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: DFN2020MD-6

BUK4D16-20H FAQ

1.How can I place an order for BUK4D16-20H through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK4D16-20H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK4D16-20H reliable?

The price and inventory of BUK4D16-20H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK4D16-20H is usually 5 days.

3.What payment methods are accepted for BUK4D16-20H?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK4D16-20H transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK4D16-20H?

BUK4D16-20H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK4D16-20H order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK4D16-20H?

For technical support, including BUK4D16-20H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK4D16-20H requirements.

6.How does Aetrix verify that BUK4D16-20H is sourced from the original manufacturer or authorized distributors?

All BUK4D16-20H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK4D16-20H meets industry standards.

7.What is the process for return or replacement of BUK4D16-20H?

All BUK4D16-20H units undergo pre-shipment inspection (PSI). If there is an issue with BUK4D16-20H, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK4D16-20H part is unused and in its original packaging.

Return procedure for BUK4D16-20H:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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