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Nexperia USA Inc. BUK4D50-30PX
- Part No.:
- BUK4D50-30PX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
BUK4D50-30PX.pdf
- Description:
- BUK4D50-30P/SOT1220/SOT1220
- Quantity:
- Payment:
- Shipping:
Inventory:4,004
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Product details
Overview
BUK4D50-30PX from Nexperia is a P-channel enhancement-mode Trench MOSFET in DFN2020MD-6 (SOT1220) package, rated for −28 V VDS, 13 A continuous drain current at Tsp = 25 °C, and 41 mΩ RDS(on) at VGS = −4.5 V and Tj = 25 °C. It serves as a high-side load switch or relay driver in automotive and industrial power control circuits.
For engineers reviewing the BUK4D50-30PX datasheet, BUK4D50-30PX pinout, BUK4D50-30PX application, or BUK4D50-30PX equivalent, this device is selected for compact high-current switching where side-wettable flanks enable optical solder inspection, AEC-Q101 qualification supports automotive deployment, and 175 °C junction rating enables operation in thermally constrained environments.
Technical Context
This MOSFET uses Trench MOSFET technology to achieve low on-resistance and fast switching with gate charge QG(tot) of 14–21 nC and turn-off delay td(off) of 42 ns under standard test conditions. Its gate threshold voltage VGS(th) ranges from −0.45 V to −1.0 V, enabling reliable turn-on with low-voltage logic-level drive.
The device integrates an intrinsic body diode with VSD = −0.74 to −1.2 V at IS = −1.9 A and exhibits 11.6 ns reverse recovery time. Thermal resistance from junction to solder point is 7–10 K/W, supporting high-power density PCB layouts with 6 cm² drain pad on FR4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −28 V - Maximum blocking voltage for high-side switch configurations in 24 V automotive systems. |
| RDS(on) | 41 mΩ (typ) at VGS = −4.5 V, ID = −4 A, Tj = 25 °C - Enables <1 W conduction loss at 7 A, critical for thermal management in space-constrained modules. |
| ID | −13 A continuous at Tsp = 25 °C - Supports robust load switching up to ~300 W in 24 V systems with appropriate PCB copper area. |
| QG(tot) | 14–21 nC - Determines gate drive power and switching speed; compatible with standard 5 V microcontroller GPIOs via small external buffer. |
| Tj(max) | 175 °C - Allows sustained operation in engine bay or under-hood applications without derating below ambient extremes. |
| AEC-Q101 | Qualified - Meets stress-test requirements for discrete semiconductors in automotive electronics per AEC standard. |
| Rth(j-sp) | 7–10 K/W - Enables direct thermal coupling to PCB copper, reducing need for heatsinks in medium-power designs. |
Pinout & Package
DFN2020MD-6 (SOT1220) is a leadless, ultra-thin surface-mount package measuring 2.0 × 2.0 × 0.65 mm with side-wettable flanks for automated optical solder inspection. The exposed drain terminals provide low thermal resistance and high current capability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 5, 6, 7 | Drain (D) | Five parallel drain terminals connected to internal die drain metallization; primary current path and thermal conduction path to PCB. |
| 3 | Gate (G) | Control terminal; requires −4.5 V to fully enhance; low gate capacitance (Ciss = 1254 pF) minimizes drive energy. |
| 4, 8 | Source (S) | Two source terminals tied to internal source bond wires; referenced to system ground in high-side switch topology. |
Key Features
| Feature | Design Value |
|---|---|
| Side-wettable flanks | Enables automated optical inspection (AOI) of solder joints without X-ray, improving manufacturing yield and field reliability. |
| Extended temperature range | Junction operation up to 175 °C supports placement near heat sources (e.g., ECUs, motor drivers) without thermal throttling. |
| Trench MOSFET architecture | Delivers lower RDS(on) per die area than planar MOSFETs, enabling smaller package size without sacrificing current handling. |
| Low threshold voltage | VGS(th) down to −0.45 V ensures turn-on with 3.3 V logic controllers, eliminating need for level-shifting gate drivers. |
| Thermal enhanced ultra-thin package | 0.65 mm height and 6 cm² drain pad reduce thermal impedance to solder point (Rth(j-sp) = 7 K/W), simplifying thermal design. |
Applications
| Automotive Body Control Module | Industrial PLC Output Stage |
|---|---|
|
Use Scenario: Controlling 12–24 V solenoids, lamps, and actuators in door modules, seat controls, and lighting systems. IC Role / Device Role / Timing Role: High-side load switch managing up to 13 A peak loads with fast turn-off (<60 ns) to prevent inductive kickback damage. Use Value: AEC-Q101 qualification and 175 °C rating ensure functional safety compliance and long-term reliability in under-dash environments. |
Use Scenario: Driving 24 V DC output channels in programmable logic controller (PLC) backplanes with overcurrent protection. IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays, providing >1 million switching cycles and sub-millisecond response. Use Value: Low RDS(on) reduces self-heating during continuous duty, while side-wettable flanks support automated AOI in high-volume SMT lines. |
| High-Speed Line Driver | DC Power Distribution Switch |
|
Use Scenario: Transmitting digital control signals across noisy industrial bus lines using active pull-down with fast edge rates. IC Role / Device Role / Timing Role: P-channel switch configured as active-low line driver with 10 ns rise time and 18 ns fall time at 4 A load. Use Value: Low gate charge (14–21 nC) and optimized Ciss/Coss ratio enable clean signal integrity up to 10 MHz without overshoot. |
Use Scenario: Hot-swap and inrush current limiting in 24 V distributed power rails for embedded computing and sensor nodes. IC Role / Device Role / Timing Role: Load switch with controlled turn-on via gate resistor network to limit dV/dt and suppress voltage transients. Use Value: Integrated body diode with 3.8 nC recovered charge and 11.6 ns trr supports bidirectional current flow during fault recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel high-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT6009LPS-13 | RDS(on) = 5.5 mΩ @ VGS = −10 V (higher drive voltage required); larger SO-8 package (4.9 × 6.0 mm). | Better conduction efficiency above 10 V gate drive but lacks AEC-Q101 qualification and side-wettable flanks. | Select when higher current (>20 A) and lower RDS(on) justify larger footprint and non-automotive qualification. |
| PMZB200UN,115 | RDS(on) = 65 mΩ @ VGS = −4.5 V; smaller DFN1006-3 package (1.0 × 0.6 × 0.45 mm); 20 V VDS rating. | Limited to ≤20 V systems and ≤2 A continuous current; not qualified for automotive use. | Choose only for cost-sensitive, low-power consumer applications where size is paramount and voltage/current demands are minimal. |
Compared with DMT6009LPS-13 and PMZB200UN,115, the BUK4D50-30PX uniquely balances AEC-Q101 compliance, 28 V rating, 13 A capability, and optical inspectability in a 2 × 2 mm footprint-making it optimal for space- and reliability-critical automotive and industrial high-side switches.
Availability
BUK4D50-30PX is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC output stages, and high-speed line driver circuits requiring stable component supply, long lifecycle assurance, and traceable sourcing.
Supply support for BUK4D50-30PX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential system functionality, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.
The BUK4D50-30PX belongs to Nexperia's TrenchMOS automotive-qualified power MOSFET family, engineered specifically for high-reliability high-side switching in thermally demanding 12–24 V systems.
FAQ
What is the maximum continuous drain current for BUK4D50-30PX at 100 °C solder point temperature?
At Tsp = 100 °C, the continuous drain current is −8.2 A, as specified in Table 5 (Limiting values). This derating reflects thermal constraints of the DFN2020MD-6 package on standard FR4 PCBs with 6 cm² drain pad, ensuring safe operation without exceeding 175 °C junction temperature.
Does BUK4D50-30PX require a gate resistor for driving from a 3.3 V microcontroller?
Yes - while its VGS(th) is as low as −0.45 V, full enhancement to 13 A requires VGS ≤ −4.5 V. A level-shifting gate driver or resistive divider is needed to translate 3.3 V logic to sufficient negative gate voltage; a series gate resistor (e.g., 10 Ω) also dampens ringing and controls dV/dt during switching.
How does the side-wettable flank feature improve manufacturing yield?
The side-wettable flanks expose solderable metal along the package edges, allowing automated optical inspection (AOI) systems to verify solder joint formation and fillet shape without X-ray. This detects voids, insufficient wetting, or bridging early in SMT lines-reducing field failures and rework costs in automotive and industrial production.
Can BUK4D50-30PX be used in synchronous rectification applications?
No - it is a P-channel enhancement-mode MOSFET optimized for high-side switching, not synchronous rectification. Its body diode forward voltage (VSD = −0.74 to −1.2 V) and reverse recovery characteristics (trr = 11.6 ns, Qr = 3.8 nC) are not optimized for high-frequency freewheeling; N-channel devices with dedicated synchronous rectifier specs are preferred.
BUK4D50-30PX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 28 V
- Current - Continuous Drain (Id) @ 25°C:
- 5A (Ta), 13A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 4A, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 21 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1254 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.1W (Ta), 15W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2020MD-6
BUK4D50-30PX FAQ
1.How can I place an order for BUK4D50-30PX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK4D50-30PX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK4D50-30PX reliable?
The price and inventory of BUK4D50-30PX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK4D50-30PX is usually 5 days.
3.What payment methods are accepted for BUK4D50-30PX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK4D50-30PX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK4D50-30PX?
BUK4D50-30PX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK4D50-30PX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK4D50-30PX?
For technical support, including BUK4D50-30PX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK4D50-30PX requirements.
6.How does Aetrix verify that BUK4D50-30PX is sourced from the original manufacturer or authorized distributors?
All BUK4D50-30PX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK4D50-30PX meets industry standards.
7.What is the process for return or replacement of BUK4D50-30PX?
All BUK4D50-30PX units undergo pre-shipment inspection (PSI). If there is an issue with BUK4D50-30PX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK4D50-30PX part is unused and in its original packaging.
Return procedure for BUK4D50-30PX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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