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Nexperia USA Inc. BUK4D72-30X

Part No.:
BUK4D72-30X
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixBUK4D72-30X.pdf
Description:
BUK4D72-30X
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,092

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Product details

Overview

BUK4D72-30X from Nexperia is a 30 V, N-channel enhancement-mode Trench MOSFET in a DFN2020MD-6 (SOT1220) leadless package, designed for low-side load switching and high-speed line driving. It delivers RDS(on) = 55 mΩ (typ) at VGS = 4.5 V, supports ID = 3.8 A continuous drain current at Tamb = 25 °C, and operates up to Tj = 175 °C. Its AEC-Q101 qualification and side-wettable flanks support automotive and industrial PCB assembly.

For engineers reviewing the BUK4D72-30X datasheet, BUK4D72-30X pinout, BUK4D72-30X application, or BUK4D72-30X equivalent, key selection criteria include its ultra-thin 2 × 2 × 0.65 mm footprint, 1.5 kV HBM ESD rating, thermal resistance Rth(j-sp) = 12 K/W, gate charge QG(tot) = 3 nC (typ), and guaranteed avalanche energy of 6.2 mJ.

Technical Context

This MOSFET uses Trench technology to achieve low on-resistance and fast switching with minimal gate drive requirements. Its threshold voltage VGS(th) = 0.75–1.25 V enables reliable turn-on with 2.5 V–4.5 V logic-level signals, and its dynamic parameters-QGD = 0.9 nC, Ciss = 255 pF, tr = 20 ns-support high-frequency switching in compact power stages.

The device integrates an intrinsic body diode with VSD = 0.8–1.2 V at IS = 1.9 A and trr = 12.6 ns, enabling efficient freewheeling in inductive loads. Its thermal design leverages the DFN2020MD-6's solderable side pads and 6 cm² drain pad to sustain Ptot = 10 W at Tsp = 25 °C while maintaining junction temperatures within AEC-Q101 limits.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V maximum - defines safe blocking capability in 24 V automotive and industrial bus applications
RDS(on) 55 mΩ typ at VGS = 4.5 V, ID = 3.8 A - enables <170 mW conduction loss at full rated current
ID 3.8 A continuous at Tamb = 25 °C - supports robust low-side switching in space-constrained PCBs
QG(tot) 3 nC typ - reduces gate drive power and allows use with low-current microcontroller GPIOs
Tj max 175 °C - ensures operation in under-hood automotive environments and sealed industrial enclosures
ESD Rating 1500 V HBM - eliminates need for external ESD protection in board-level handling and assembly
Rth(j-sp) 12 K/W typical - enables direct thermal coupling to PCB copper for passive cooling without heatsinks

Pinout & Package

DFN2020MD-6 (SOT1220) is a 2 mm × 2 mm × 0.65 mm leadless, thermally enhanced plastic package with side-wettable flanks for optical solder inspection. Its exposed drain terminals provide low-inductance, high-current paths and superior thermal transfer to PCB copper.

Pin/Terminal Circuit Role Design Meaning
1, 2, 5, 6, 7 Drain (D) Five parallel drain terminals - reduce package inductance and spread heat across large PCB copper area
3 Gate (G) Single gate input - compatible with standard 3.3 V/5 V logic drivers; low QG minimizes switching losses
4, 8 Source (S) Two source terminals - provide low-impedance return path and improve current sharing in high-di/dt switching

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive-grade reliability including temperature cycling, humidity, and mechanical shock
Side-wettable flanks Enables automated optical inspection (AOI) of solder joints without X-ray, reducing manufacturing QA cost
Extended Tj range Rated for continuous operation up to 175 °C - eliminates derating concerns in high-ambient environments
Trench MOSFET architecture Delivers lower RDS(on) per die area than planar MOSFETs - improves power density in miniaturized designs
Ultra-thin profile 0.65 mm height - enables stacking in multi-layer modules and integration into slim consumer or medical enclosures

Applications

Relay Driver High-Speed Line Driver

Use Scenario: Replacing electromechanical relays in automotive body control modules (BCM) and industrial PLC I/O cards.

IC Role / Device Role / Timing Role: Low-side switch controlling 12 V/24 V relay coils with fast turn-on/turn-off to suppress contact arcing.

Use Value: Eliminates coil flyback voltage spikes via integrated body diode recovery (trr = 12.6 ns), reducing snubber component count by 30%.

Use Scenario: Driving terminated RS-485 or CAN FD bus lines in automotive infotainment head units and ADAS domain controllers.

IC Role / Device Role / Timing Role: High-speed digital output stage delivering >10 Mbps edge rates with controlled slew via low Ciss/Coss ratio.

Use Value: Achieves <20 ns rise/fall times with QGD = 0.9 nC and RDS(on) < 72 mΩ, minimizing signal distortion on 120 Ω differential lines.

Low-Side Load Switch Switching Power Supply

Use Scenario: Hot-swap and inrush current limiting for USB-C PD ports and 5 V/3.3 V auxiliary rails in automotive telematics units.

IC Role / Device Role / Timing Role: Controlled power path switch with soft-start enabled by gate capacitance and external RC timing.

Use Value: Supports 3.8 A steady-state load with <170 mW conduction loss and 1.95 W thermal budget at Tamb = 100 °C.

Use Scenario: Synchronous rectifier in 30 V-input buck converters for ADAS camera modules and radar power supplies.

IC Role / Device Role / Timing Role: Secondary-side switch replacing Schottky diodes to reduce forward voltage drop and improve efficiency.

Use Value: Delivers 0.8–1.2 V VSD and 6.2 mJ unclamped avalanche energy, enabling robust operation during transient overloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN3026LSD-13 RDS(on) = 26 mΩ @ 4.5 V but in larger SO-8 package (4.9 × 6.0 mm); higher QG = 8.5 nC Requires more PCB area and higher gate drive current; better suited for non-space-constrained industrial SMPS Select when lower RDS(on) outweighs size and thermal constraints
PMV30UN2 RDS(on) = 45 mΩ @ 4.5 V in same DFN2020MD-6 package but rated only to Tj = 150 °C and not AEC-Q101 qualified Lacks automotive qualification and high-temp margin; suitable for commercial-grade consumer power management Select for cost-sensitive non-automotive designs where 175 °C operation is unnecessary

Compared with DMN3026LSD-13 and PMV30UN2, BUK4D72-30X uniquely balances ultra-compact size, AEC-Q101 compliance, and 175 °C operation-making it the only option for space-limited, high-reliability automotive switching where thermal headroom and qualification are non-negotiable.

Availability

BUK4D72-30X is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC I/O modules, and USB-C power delivery systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BUK4D72-30X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection solutions.

The BUK4D72-30X belongs to Nexperia's TrenchMOS® automotive-qualified power MOSFET family, engineered specifically for low-RDS(on), high-temperature robustness, and manufacturability in lead-free reflow processes.

FAQ

What is the maximum continuous drain current at 100 °C ambient temperature?

The BUK4D72-30X supports ID = 2.4 A continuous at Tamb = 100 °C, as specified in Table 5 (Limiting Values). This derating reflects thermal dissipation limits on standard FR4 PCBs with single-sided 6 cm² drain copper, and aligns with the normalized current curve in Figure 2.

Does the BUK4D72-30X require a gate resistor for 3.3 V MCU drive?

No external gate resistor is required for basic turn-on with 3.3 V microcontrollers, as VGS(th) = 0.75–1.25 V ensures reliable enhancement. However, a 10–22 Ω series resistor is recommended to dampen ringing caused by low gate impedance and parasitic inductance in high-di/dt layouts.

How does the side-wettable flank design impact solder joint inspection?

The tin-plated side pads enable automated optical inspection (AOI) of solder fillets without X-ray, verifying wetting quality and voiding on all six terminals. This eliminates manual visual checks and reduces field failure risk in high-volume automotive assembly lines.

Is the body diode suitable for synchronous rectification in DC-DC converters?

Yes-the intrinsic source-drain diode has VSD = 0.8–1.2 V at IS = 1.9 A and trr = 12.6 ns, making it viable for low-voltage synchronous rectification. Its 6.2 mJ unclamped avalanche rating also provides margin against inductive kickback during light-load transitions.

BUK4D72-30X Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Bulk
Product Status:
Obsolete
FET Type:
-
Technology:
-
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
-
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
-
Vgs(th) (Max) @ Id:
-
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
-
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN2020MD-6

BUK4D72-30X FAQ

1.How can I place an order for BUK4D72-30X through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK4D72-30X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK4D72-30X reliable?

The price and inventory of BUK4D72-30X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK4D72-30X is usually 5 days.

3.What payment methods are accepted for BUK4D72-30X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK4D72-30X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK4D72-30X?

BUK4D72-30X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK4D72-30X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK4D72-30X?

For technical support, including BUK4D72-30X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK4D72-30X requirements.

6.How does Aetrix verify that BUK4D72-30X is sourced from the original manufacturer or authorized distributors?

All BUK4D72-30X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK4D72-30X meets industry standards.

7.What is the process for return or replacement of BUK4D72-30X?

All BUK4D72-30X units undergo pre-shipment inspection (PSI). If there is an issue with BUK4D72-30X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK4D72-30X part is unused and in its original packaging.

Return procedure for BUK4D72-30X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BUK4D72-30X Tags

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  • Nexperia USA Inc.
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