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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

NXP Semiconductors BUK6240-75C,118

Name: BUK6240-75C,118
Brand: NXP Semiconductors
SKU: BUK6240-75C,118
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK6240-75C,118

Manufacturer:: NXP Semiconductors

Category:: FETs, MOSFETs

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: BUK6240-75C,118.pdf

Description:: MOSFET N-CH 75V 22A DPAK

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Product details

Overview

BUK6240-75C from Nexperia is an AEC Q101-qualified N-channel TrenchMOS FET in DPAK (SOT428) package, rated for 75 V V_DS, 22 A continuous drain current at T_mb = 25 °C, and 175 °C junction temperature. It delivers 39–46 mΩ R_DS(on) at V_GS = 10 V and ID = 10 A, T_j = 25 °C, and is engineered for high-reliability automotive power switching including electric power steering and transmission control.

For engineers reviewing the BUK6240-75C datasheet, BUK6240-75C pinout, BUK6240-75C application, or BUK6240-75C equivalent, key selection criteria include its 75 V breakdown voltage, 22 A thermal-current capability at mounting base, 2.52 K/W R_th(j-mb), avalanche energy rating of 25 mJ, and compatibility with standard and logic-level gate drive sources in thermally demanding environments.

Technical Context

This device uses advanced TrenchMOS technology to achieve low on-resistance and robust switching performance. Its gate threshold voltage ranges from 0.8 V at T_j = 175 °C to 3.3 V at T_j = −55 °C, enabling stable operation across extreme automotive temperature ranges.

The integrated source-drain diode supports freewheeling in inductive loads, with V_SD = 0.9–1.2 V at I_S = 25 A and T_j = 25 °C, and t_rr = 42 ns under specified conditions. Dynamic parameters include Q_G(tot) = 21.4 nC and Q_GD = 6.84 nC at V_DS = 60 V, supporting efficient high-frequency switching.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	75 V maximum drain-source voltage - defines safe blocking capability in 12 V/24 V automotive systems with transient overvoltage margin.
I_D (continuous)	22 A at T_mb = 25 °C - specifies maximum steady-state load current with heatsink interface at ambient mounting base temperature.
R_DS(on)	39–46 mΩ at V_GS = 10 V, I_D = 10 A, T_j = 25 °C - determines conduction loss and thermal rise under nominal gate drive.
R_th(j-mb)	2.52 K/W - quantifies thermal resistance from silicon junction to mounting base, critical for heatsink sizing and power derating.
E_DS(AL)S	25 mJ non-repetitive avalanche energy - enables single-event surge tolerance without external clamping in inductive switching applications.
V_GS(th)	1.8–2.8 V at T_j = 25 °C - ensures reliable turn-on with logic-level microcontroller outputs and standard 5 V/12 V gate drivers.
t_r/t_f	17.8 ns rise / 35 ns fall time - supports fast switching in PWM-controlled motor and solenoid drivers with reduced switching losses.

Pinout & Package

BUK6240-75C is housed in a plastic single-ended surface-mounted DPAK package (SOT428), featuring a metal mounting base thermally and electrically connected to the drain terminal. The package has three leads (one cropped), optimized for PCB thermal management and high-current routing.

Pin/Terminal	Circuit Role	Design Meaning
1 (G)	Gate	Control input for MOSFET channel activation; requires ≤16 V DC or ≤20 V pulsed drive per absolute max ratings.
2 (D)	Drain	Main high-side power path; electrically and thermally tied to mounting base for low-inductance, high-current conduction.
3 (S)	Source	Return path for load current; referenced to system ground in low-side switch configurations.
Mounting Base (mb)	Drain connection	Exposed metal pad soldered to PCB copper pour; provides primary thermal path and carries full drain current.

Key Features

Feature	Design Value
AEC Q101 qualification	Validated for automotive-grade reliability including temperature cycling, humidity testing, and mechanical shock per AEC Q101 standard.
175 °C maximum junction temperature	Enables operation in engine bay and transmission control modules where ambient temperatures exceed 125 °C.
Logic-level gate drive compatibility	Turns on fully with V_GS ≥ 4.5 V, supporting direct interfacing with 3.3 V/5 V microcontrollers without level-shifting circuitry.
TrenchMOS technology	Delivers lower R_DS(on) and higher cell density than planar MOSFETs, improving power efficiency and reducing footprint.
Integrated source-drain diode	Provides inherent freewheeling path for inductive loads (e.g., solenoids, motors), eliminating need for external catch diodes in many designs.

Applications

Electric Power Steering (EPS)	Start-Stop Micro-Hybrid Control
Use Scenario: High-current motor phase switching in 12 V EPS systems requiring rapid, low-loss commutation under vibration and thermal stress. IC Role / Device Role / Timing Role: Low-side or high-side power switch controlling brushed or brushless motor windings with PWM duty cycle modulation. Use Value: 22 A continuous current and 25 mJ avalanche energy ensure robustness against motor back-EMF spikes during direction reversal and stall events.	Use Scenario: Controlling starter motor engagement and battery isolation in 12 V start-stop systems with frequent cold-cranking cycles. IC Role / Device Role / Timing Role: High-current solid-state relay replacing electromechanical contactors for precise, wear-free engine restart sequencing. Use Value: 175 °C junction rating and AEC Q101 qualification guarantee long-term reliability across extreme thermal transients during repeated stop/start events.
Transmission Solenoid Driver	LED Headlamp Dimming
Use Scenario: Driving electro-hydraulic shift solenoids in automatic transmissions where precise current regulation and fault tolerance are critical. IC Role / Device Role / Timing Role: Current-regulated switch in constant-current driver stage, often paired with external sense resistor and op-amp feedback. Use Value: Tight V_GS(th) distribution (1.8–2.8 V) and low R_DS(on) variation enable consistent solenoid actuation force across temperature and unit-to-unit variance.	Use Scenario: PWM dimming of high-brightness LED arrays in adaptive front-lighting systems (AFS) with tight thermal constraints. IC Role / Device Role / Timing Role: Low-side switch modulating LED string current at frequencies >1 kHz to eliminate visible flicker and support dynamic beam shaping. Use Value: Fast 17.8 ns rise / 35 ns fall times minimize switching losses at high PWM frequencies, while 2.52 K/W R_th(j-mb) enables compact heatsinking on dense headlamp PCBs.

Electric Power Steering (EPS)

Start-Stop Micro-Hybrid Control

Use Scenario: High-current motor phase switching in 12 V EPS systems requiring rapid, low-loss commutation under vibration and thermal stress.

IC Role / Device Role / Timing Role: Low-side or high-side power switch controlling brushed or brushless motor windings with PWM duty cycle modulation.

Use Value: 22 A continuous current and 25 mJ avalanche energy ensure robustness against motor back-EMF spikes during direction reversal and stall events.

Use Scenario: Controlling starter motor engagement and battery isolation in 12 V start-stop systems with frequent cold-cranking cycles.

IC Role / Device Role / Timing Role: High-current solid-state relay replacing electromechanical contactors for precise, wear-free engine restart sequencing.

Use Value: 175 °C junction rating and AEC Q101 qualification guarantee long-term reliability across extreme thermal transients during repeated stop/start events.

Transmission Solenoid Driver

LED Headlamp Dimming

Use Scenario: Driving electro-hydraulic shift solenoids in automatic transmissions where precise current regulation and fault tolerance are critical.

IC Role / Device Role / Timing Role: Current-regulated switch in constant-current driver stage, often paired with external sense resistor and op-amp feedback.

Use Value: Tight V_GS(th) distribution (1.8–2.8 V) and low R_DS(on) variation enable consistent solenoid actuation force across temperature and unit-to-unit variance.

Use Scenario: PWM dimming of high-brightness LED arrays in adaptive front-lighting systems (AFS) with tight thermal constraints.

IC Role / Device Role / Timing Role: Low-side switch modulating LED string current at frequencies >1 kHz to eliminate visible flicker and support dynamic beam shaping.

Use Value: Fast 17.8 ns rise / 35 ns fall times minimize switching losses at high PWM frequencies, while 2.52 K/W R_th(j-mb) enables compact heatsinking on dense headlamp PCBs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STL220N4F7AG	40 V V_DS, 220 A I_D, TO-263 package, lower R_DS(on) (0.75 mΩ), not AEC Q101 qualified.	Targeted at high-current industrial motor drives, not automotive under-hood use.	Select only for non-automotive 12 V systems requiring higher current and lower conduction loss; verify thermal design for larger TO-263 footprint.
IRF3205PBF	55 V V_DS, 110 A I_D, TO-220 package, R_DS(on) = 8.0 mΩ, no AEC qualification, 175 °C T_j.	Used in general-purpose power supplies and DC-DC converters, not validated for automotive vibration or lifetime requirements.	Consider for cost-sensitive non-automotive 24 V applications needing higher peak current; requires external avalanche protection and thermal derating.

Compared with STL220N4F7AG and IRF3205PBF, the BUK6240-75C trades higher R_DS(on) for AEC Q101 compliance, DPAK thermal efficiency, and guaranteed 75 V blocking-making it uniquely suited for space-constrained, safety-critical automotive power switching where qualification and thermal reliability outweigh raw conduction performance.

Availability

BUK6240-75C is available at Aetrix Electronics and suitable for electric power steering, start-stop micro-hybrid control, and transmission solenoid driver applications requiring stable component supply across extended automotive product lifecycles.

Supply support for BUK6240-75C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, spun off from NXP in 2017 and focused on automotive, industrial, computing, consumer, and wearable markets.

The BUK6240-75C belongs to Nexperia's TrenchMOS automotive-qualified PowerMOS family, designed specifically for high-reliability, thermally demanding automotive power switching applications including EPS, transmission, and body electronics.

FAQ

What is the maximum continuous drain current rating for BUK6240-75C?

The BUK6240-75C is rated for 22 A continuous drain current at mounting base temperature (T_mb) of 25 °C. At T_mb = 100 °C, the rating drops to 16 A due to thermal derating. This value assumes proper PCB copper pour and heatsinking per the 2.52 K/W R_th(j-mb) specification. The BUK6240-75C must be operated within these limits to maintain reliability and avoid junction overheating.

Is BUK6240-75C suitable for logic-level gate drive?

Yes, the BUK6240-75C supports logic-level gate drive with V_GS(th) ranging from 1.8 V to 2.8 V at 25 °C and remaining functional down to 0.8 V at 175 °C. It achieves R_DS(on) ≤ 64 mΩ at V_GS = 5 V, enabling direct drive from 3.3 V or 5 V microcontrollers without external level shifters. The BUK6240-75C is explicitly characterized for both standard and logic-level gate sources in its datasheet.

Does BUK6240-75C have avalanche capability?

Yes, the BUK6240-75C is rated for 25 mJ non-repetitive drain-source avalanche energy (E_DS(AL)S) under defined test conditions (I_D = 22 A, V_sup ≤ 75 V, R_GS = 50 Ω). This capability allows the BUK6240-75C to safely absorb inductive energy during switching transients without external snubbers in applications like solenoid and motor control, provided single-pulse conditions remain within the 175 °C junction temperature limit.

What package type does BUK6240-75C use and how is thermal management handled?

The BUK6240-75C uses the DPAK (SOT428) plastic surface-mount package with a metal mounting base electrically and thermally connected to the drain. Thermal management relies on soldering this base to a large PCB copper pour acting as a heatsink. Its R_th(j-mb) is 2.52 K/W, meaning a 60 W power dissipation generates ~151 K temperature rise from base to junction-so effective base cooling is essential. The BUK6240-75C mounting base must be properly sized and thermally anchored per Nexperia's layout guidelines.

Is BUK6240-75C qualified for automotive applications?

Yes, the BUK6240-75C is explicitly designed and qualified to AEC Q101 standards for high-performance automotive applications. It meets requirements for temperature cycling, mechanical shock, humidity resistance, and long-term reliability in under-hood environments. Its 175 °C maximum junction temperature and characterization across −55 °C to +175 °C operating range confirm suitability for automotive power systems including EPS, transmission control, and start-stop systems. The BUK6240-75C carries full AEC Q101 documentation and test reports from Nexperia.

BUK6240-75C,118 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: TrenchMOS™

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 75 V

Current - Continuous Drain (Id) @ 25°C:: 22A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 46mOhm @ 10A, 10V

Vgs(th) (Max) @ Id:: 2.8V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 21.4 nC @ 10 V

Vgs (Max):: ±16V

Input Capacitance (Ciss) (Max) @ Vds:: 1280 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 60W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DPAK

BUK6240-75C,118 FAQ

1.How can I place an order for BUK6240-75C,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK6240-75C,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK6240-75C,118 reliable?

The price and inventory of BUK6240-75C,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK6240-75C,118 is usually 5 days.

3.What payment methods are accepted for BUK6240-75C,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK6240-75C,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK6240-75C,118?

BUK6240-75C,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK6240-75C,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK6240-75C,118?

For technical support, including BUK6240-75C,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK6240-75C,118 requirements.

6.How does Aetrix verify that BUK6240-75C,118 is sourced from the original manufacturer or authorized distributors?

All BUK6240-75C,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK6240-75C,118 meets industry standards.

7.What is the process for return or replacement of BUK6240-75C,118?

All BUK6240-75C,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK6240-75C,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK6240-75C,118 part is unused and in its original packaging.

Return procedure for BUK6240-75C,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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