Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Nexperia USA Inc. BUK6D16-30EX

Part No.:
BUK6D16-30EX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixBUK6D16-30EX.pdf
Description:
MOS DISCRETES
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,970

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

BUK6D16-30EX from Nexperia is a 30 V, N-channel enhancement-mode Trench MOSFET in a DFN2020MD-6 (SOT1220) leadless package, rated for 23 A continuous drain current at Tsp = 25 °C, 13.4 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and qualified to AEC-Q101 for automotive use - deployed as a low-side load switch in 12 V battery-powered control modules.

For engineers reviewing the BUK6D16-30EX datasheet, BUK6D16-30EX pinout, BUK6D16-30EX application, or BUK6D16-30EX equivalent, this device is selected for high-reliability, space-constrained switching where thermal performance, side-wettable flanks for solder inspection, and extended junction temperature (175 °C) are critical design requirements.

Technical Context

This MOSFET employs Trench MOSFET technology to achieve low on-resistance and fast switching with QG(tot) = 10.7–16 nC and tf = 5 ns under standard test conditions. Its gate threshold voltage (VGS(th)) ranges from 1.0 V to 2.5 V at Tj = 25 °C, enabling robust turn-on with 4.5 V logic-level drive.

The device integrates a built-in source-drain diode with VSD = 0.8–1.2 V at IS = 2.4 A and exhibits avalanche ruggedness of 23 mJ (unclamped, Tj(init) = 25 °C), supporting inductive load handling without external snubbers in many automotive relay driver implementations.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V maximum - supports 12 V automotive systems with margin against load dump transients.
RDS(on) 13.4 mΩ typical at VGS = 10 V, Tj = 25 °C - enables <1.3 W conduction loss at 8.4 A.
ID 23 A continuous at Tsp = 25 °C - suitable for high-current solenoid or lamp drivers.
Ptot 15 W at Tsp = 25 °C - requires thermal pad (6 cm²) on FR4 for full power operation.
Rth(j-sp) 7–10 K/W - low junction-to-solder-point resistance enables efficient heat transfer to PCB copper.
QG(tot) 10.7–16 nC - ensures fast, low-energy gate driving with standard 5 V/3.3 V microcontroller outputs.
AEC-Q101 Qualified - validated for automotive temperature cycling, humidity, and mechanical stress per JESD22.

Pinout & Package

DFN2020MD-6 (SOT1220) package: 2 mm × 2 mm × 0.65 mm body, leadless, thermal-enhanced, with side-wettable flanks for automated optical solder inspection.

Pin/Terminal Circuit Role Design Meaning
1, 2, 5, 6, 7 Drain (D) Five parallel drain terminals - collectively form main power path and thermal interface to PCB copper pad.
3 Gate (G) Single gate input - low Ciss (553 pF) and RG ≈ 1.8 Ω enable fast, stable switching with minimal ringing.
4, 8 Source (S) Two source terminals - provide return path and reduce source inductance for improved EMI and dI/dt performance.

Key Features

Feature Design Value
Side-wettable flanks Enables 100% automated optical inspection (AOI) of solder joints without X-ray, reducing manufacturing defect escape.
Tj = 175 °C rating Supports operation in engine bay environments without derating below 125 °C ambient, simplifying thermal design.
Trench MOSFET architecture Delivers 25% lower RDS(on) vs. planar equivalents at same die size - improves power density in compact modules.
Ultra-thin 0.65 mm profile Reduces board stack height in multi-layer automotive ECUs and enables placement under shields or connectors.
Low QGD/QG ratio 2.3 nC / 10.7 nC ≈ 0.21 - enhances hard-switching efficiency and reduces Miller-induced shoot-through risk.

Applications

Automotive Relay Driver High-Speed CAN Bus Power Switch

Use Scenario: Driving 12 V automotive relays (e.g., HVAC blower, headlamp, fuel pump) in body control modules.

IC Role / Device Role / Timing Role: Low-side switch controlling relay coil current up to 23 A peak, with fast turn-off (tf = 5 ns) to suppress back-EMF spikes.

Use Value: Eliminates need for external flyback diode due to integrated avalanche-rated source-drain diode (23 mJ).

Use Scenario: Enabling/disabling power to isolated CAN transceiver domains during sleep/wake transitions.

IC Role / Device Role / Timing Role: Low-RDS(on) load switch ensuring <50 mV dropout at 500 mA, with sub-20 ns switching to meet ISO 11898-2 timing constraints.

Use Value: Prevents bus leakage during sleep mode while maintaining fast wake-up response (<1 µs delay from gate signal to rail enable).

LED Headlamp Dimming Stage 12 V DC-DC Converter Synchronous Rectifier

Use Scenario: PWM-controlled current sink for high-brightness LED strings in adaptive front lighting systems (AFS).

IC Role / Device Role / Timing Role: High-frequency (≥2 kHz) low-side switch with minimal RDS(on) drift over temperature (RDS(on) ×1.9 at Tj = 175 °C).

Use Value: Enables precise 0.1% duty-cycle resolution without thermal runaway, thanks to tight VGS(th) distribution (1.0–2.5 V).

Use Scenario: Secondary-side synchronous rectification in 12 V input buck converters for infotainment power supplies.

IC Role / Device Role / Timing Role: Fast-turning, low-loss rectifier replacing Schottky diodes - operates with gate driven by transformer-coupled or controller-synchronized signal.

Use Value: Reduces conduction losses by >40% vs. 40 V Schottky (e.g., RB055LAM-40), improving efficiency from 89% to 93% at 5 A output.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-side switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor NTMFS4C09NT1G 30 V, 21 A, RDS(on) = 12.5 mΩ @ 10 V, DFN5x6 package (larger footprint, no SWF) Lacks side-wettable flanks and AEC-Q101 qualification - limited to industrial/commercial use only Select when higher current margin is needed and AOI capability is not required.
Infineon BSC014N04LS6 40 V, 100 A, RDS(on) = 1.4 mΩ @ 10 V, PG-TSDSON-8 package (5× larger, higher cost) Over-specified voltage/current - excessive for 12 V systems; higher gate charge (34 nC) increases driver complexity Choose only if future-proofing for 24 V systems or paralleling is planned.

Compared with NTMFS4C09NT1G and BSC014N04LS6, the BUK6D16-30EX delivers optimal balance of automotive qualification, ultra-compact size, AOI compatibility, and thermal performance for 12 V low-side switching - avoiding both under-specification and unnecessary over-engineering.

Availability

BUK6D16-30EX is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC I/O modules, and consumer appliance motor controls requiring stable component supply across long production lifecycles.

Supply support for BUK6D16-30EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.

The BUK6D series targets space-constrained, thermally demanding automotive and industrial switching applications - designed specifically for AEC-Q101 compliance, side-wettable flanks, and optimized RDS(on)-to-package-size ratio in DFN formats.

FAQ

Is BUK6D16-30EX pin-compatible with earlier BUK6D16-30E?

Yes - BUK6D16-30EX is a direct replacement for BUK6D16-30E, sharing identical DFN2020MD-6 (SOT1220) package, pinout, electrical specifications, and AEC-Q101 qualification. The 'X' suffix denotes updated wafer fabrication or assembly process, with no functional or mechanical changes affecting design-in or layout reuse.

What is the minimum gate drive voltage required for full enhancement?

The gate-source threshold voltage (VGS(th)) is specified from 1.0 V to 2.5 V at Tj = 25 °C. For guaranteed RDS(on) ≤ 16.8 mΩ and ID ≥ 8.4 A, VGS ≥ 4.5 V is required; 10 V drive achieves the full 13.4 mΩ typical value. Logic-level microcontrollers (3.3 V) can operate it but with higher on-resistance (~24.3 mΩ at VGS = 4.5 V).

Can BUK6D16-30EX be used in parallel configurations?

Yes - its positive temperature coefficient of RDS(on) (normalized to 1.9× at Tj = 175 °C) enables inherent current sharing. However, layout symmetry (matched gate trace lengths, shared thermal pad) and individual gate resistors (≥2 Ω) are mandatory to prevent oscillation and ensure balanced dynamic current distribution during switching.

Does the integrated source-drain diode support reverse recovery in high-frequency PWM?

The diode has trr = 12.1 ns and Qr = 4.2 nC at Tj = 25 °C, making it suitable for PWM frequencies up to 500 kHz in low-side switch topologies. At higher frequencies or high dI/dt, external Schottky clamping may still be advised to minimize voltage overshoot and EMI.

BUK6D16-30EX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
8.4A (Ta), 23A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
16.8mOhm @ 8.4A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
16 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
553 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.3W (Ta), 15W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
DFN2020MD-6

BUK6D16-30EX FAQ

1.How can I place an order for BUK6D16-30EX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK6D16-30EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK6D16-30EX reliable?

The price and inventory of BUK6D16-30EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK6D16-30EX is usually 5 days.

3.What payment methods are accepted for BUK6D16-30EX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK6D16-30EX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK6D16-30EX?

BUK6D16-30EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK6D16-30EX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK6D16-30EX?

For technical support, including BUK6D16-30EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK6D16-30EX requirements.

6.How does Aetrix verify that BUK6D16-30EX is sourced from the original manufacturer or authorized distributors?

All BUK6D16-30EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK6D16-30EX meets industry standards.

7.What is the process for return or replacement of BUK6D16-30EX?

All BUK6D16-30EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK6D16-30EX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK6D16-30EX part is unused and in its original packaging.

Return procedure for BUK6D16-30EX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BUK6D16-30EX Tags

  • BUK6D16-30EX
  • BUK6D16-30EX PDF
  • BUK6D16-30EX Datasheet
  • BUK6D16-30EX Specifications
  • BUK6D16-30EX Images
  • Nexperia USA Inc.
  • Nexperia USA Inc. BUK6D16-30EX
  • Buy BUK6D16-30EX
  • BUK6D16-30EX Price
  • BUK6D16-30EX Distributor
  • BUK6D16-30EX Supplier
  • BUK6D16-30EX Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER