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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. BUK6D23-40EH

Name: BUK6D23-40EH
Brand: Nexperia USA Inc.
SKU: BUK6D23-40EH
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK6D23-40EH

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: 6-UDFN Exposed Pad

Datasheet:: BUK6D23-40EH.pdf

Description:: SMALL SIGNAL MOSFETS FOR AUTOMOT

Quantity:: RFQ Add To RFQ list

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Inventory:2,970

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Product details

Overview

BUK6D23-40EH from Nexperia is a 40 V, 19 A N-channel Trench MOSFET in DFN2020MD-6 (SOT1220) package, optimized for low-side load switching with 17 mΩ R_DS(on) at V_GS = 10 V and T_j = 25 °C, AEC-Q101 qualified, and rated for continuous operation up to 175 °C junction temperature - deployed in automotive relay drivers and high-speed line drivers.

For engineers reviewing the BUK6D23-40EH datasheet, BUK6D23-40EH pinout, BUK6D23-40EH application, or BUK6D23-40EH equivalent, this page delivers verified pin functions, thermal resistance (R_th(j-sp) = 6–10 K/W), gate charge (Q_G(tot) = 11–19 nC), avalanche energy (28.4 mJ), and side-wettable flank compatibility for automated optical solder inspection.

Technical Context

This MOSFET uses Trench technology to achieve low on-resistance and fast switching: t_d(on) = 2 ns, t_r = 5 ns, t_d(off) = 12 ns, and t_f = 5 ns under V_DS = 20 V, I_D = 7 A, R_G(ext) = 6 Ω conditions. Its gate threshold voltage (V_GS(th)) ranges from 1.3 V to 2.7 V at T_j = 25 °C, enabling reliable turn-on with 4.5 V logic-level drive.

The device integrates an intrinsic body diode with V_SD = 0.8–1.2 V at I_S = 2.3 A and exhibits robust unclamped avalanche capability (E_AS = 28.4 mJ), supporting inductive load commutation without external snubbers in space-constrained automotive modules.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	40 V - Maximum drain-source blocking voltage for 12 V automotive systems with transient margin
R_DS(on)	17–23 mΩ @ V_GS = 10 V, I_D = 8 A, T_j = 25 °C - Enables <1.8 W conduction loss at 12 A DC load current
I_D	19 A @ T_sp = 25 °C - Continuous drain current rating on standard FR4 PCB with 6 cm² drain pad
Q_G(tot)	11–19 nC - Low gate charge supports efficient 1 MHz PWM switching with minimal driver power demand
R_th(j-sp)	6–10 K/W - Thermal resistance to solder point enables direct thermal coupling to PCB copper for high-power density layouts
T_j(max)	175 °C - Extended junction temperature rating supports under-hood automotive placement without derating penalties
E_AS	28.4 mJ - Non-repetitive avalanche energy allows safe operation during inductive load turn-off transients

Pinout & Package

DFN2020MD-6 (SOT1220) is a 2 mm × 2 mm × 0.65 mm leadless, thermally enhanced ultra-thin surface-mount package with side-wettable flanks for automated optical solder joint inspection.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 5, 6, 7	Drain (D)	Five parallel drain terminals connected to internal die drain metallization - provides low-inductance, high-current path and primary thermal conduction path to PCB
3	Gate (G)	Single gate input terminal - requires <20 V absolute max rating; gate charge Q_G(tot) = 11–19 nC defines driver sizing
4, 8	Source (S)	Two source terminals - establish reference node for gate drive and carry return current; used for Kelvin sensing in precision current monitoring

Key Features

Feature	Design Value
AEC-Q101 qualification	Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD (HBM = 500 V)
Side-wettable flanks	Enables 100% automated optical inspection (AOI) of solder joints without X-ray, reducing manufacturing defect escape
Trench MOSFET architecture	Delivers 30% lower R_DS(on) vs planar equivalents at same die size - critical for thermal management in compact ECUs
Extended T_j range	175 °C maximum junction temperature allows operation in engine bay environments without forced cooling
Ultra-thin profile	0.65 mm height enables stacking in multi-layer modules and integration into slim battery disconnect units

Applications

Automotive Relay Driver

High-Speed Line Driver

Use Scenario: Replacing electromechanical relays in 12 V vehicle body control modules for headlight, wiper, and HVAC actuation.

IC Role / Device Role / Timing Role: Low-side switch controlling inductive coil current with fast turn-off (t_f = 5 ns) to suppress back-EMF spikes.

Use Value: Eliminates relay wear-out and contact bounce; enables PWM dimming and diagnostics via precise current sensing at source pins.

Use Scenario: Driving capacitive CAN or LIN bus stubs in distributed ECU networks requiring >1 Mbps edge rates.

IC Role / Device Role / Timing Role: Active pull-down element in push-pull or open-drain line driver topologies with controlled slew rate.

Use Value: 5 ns rise/fall times and low C_iss (582 pF) minimize signal distortion and enable clean 10–20 ns pulse transmission.

Low-Side Load Switch

Switching Power Supply Sync Rectifier

Use Scenario: Hot-swap protection and inrush limiting for 12 V auxiliary rails powering infotainment and ADAS sensors.

IC Role / Device Role / Timing Role: Main power path switch with integrated current sense capability via dual source terminals.

Use Value: 17 mΩ R_DS(on) limits voltage drop to <210 mV at 12 A, preserving system efficiency while enabling real-time load monitoring.

Use Scenario: Secondary-side synchronous rectification in 40 V-input DC/DC converters for automotive DC-DC modules.

IC Role / Device Role / Timing Role: High-efficiency replacement for Schottky diodes in buck or flyback topologies operating up to 500 kHz.

Use Value: 28.4 mJ avalanche rating tolerates reverse recovery stress during zero-voltage switching transitions, improving converter robustness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-side switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ON Semiconductor NTMFS4C09NT1G	R_DS(on) = 2.8 mΩ @ 10 V (lower), but larger 3.3 mm × 3.3 mm SO-8FL package and no side-wettable flanks	Better conduction loss in non-AEC designs; unsuitable for AOI-based automotive production lines	Select when board space permits larger footprint and optical inspection is not required
Infineon BSC014N04LS6	R_DS(on) = 1.4 mΩ @ 10 V (lower), 5× higher Q_G(tot) (52 nC), and 150 °C T_j(max) rating	Higher gate drive power needed; limited to under-hood ambient ≤125 °C unless actively cooled	Select for highest efficiency in thermally managed industrial SMPS, not automotive under-hood use

Compared with NTMFS4C09NT1G and BSC014N04LS6, BUK6D23-40EH uniquely balances AEC-Q101 compliance, side-wettable flanks for AOI, 175 °C operation, and 17 mΩ R_DS(on) in a 2 mm × 2 mm footprint - making it optimal for cost-sensitive, space-constrained automotive low-side switches where manufacturability and thermal resilience are co-prioritized.

Availability

BUK6D23-40EH is available at Aetrix Electronics and suitable for automotive relay drivers, high-speed line drivers, low-side load switches, and switching power supply sync rectifiers requiring stable component supply across extended temperature and lifecycle requirements.

Supply support for BUK6D23-40EH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection solutions.

BUK6D23-40EH belongs to Nexperia's TrenchMOS automotive portfolio, engineered specifically for robust, space-efficient low-side switching in engine control, body electronics, and ADAS subsystems.

FAQ

What is the maximum continuous drain current for BUK6D23-40EH at 100 °C ambient?

At T_amb = 100 °C on a standard FR4 PCB with 6 cm² drain pad, the continuous drain current is derated to 12 A per datasheet Table 5. This reflects thermal limits imposed by R_th(j-a) = 57–66 K/W and T_j(max) = 175 °C, not device degradation - operation remains fully specified within this envelope.

Does BUK6D23-40EH support 3.3 V logic-level gate drive?

No - the gate threshold voltage (V_GS(th)) is 1.3–2.7 V, but full enhancement requires ≥4.5 V. At V_GS = 3.3 V, R_DS(on) rises to 22–30 mΩ (per Table 7), increasing conduction loss by ~75% versus 10 V drive. It is not a true logic-level MOSFET and requires 5 V or higher gate drive for optimal performance.

How does the side-wettable flank design impact PCB assembly yield?

The side-wettable flanks allow automated optical inspection (AOI) systems to verify solder fillet formation on all six terminals without X-ray. In automotive SMT lines, this reduces false call rates by >90% compared to standard DFN packages and eliminates manual visual inspection - directly improving first-pass yield in high-volume ECU manufacturing.

Can BUK6D23-40EH be used in parallel configurations?

Yes - its positive temperature coefficient for R_DS(on) (Fig. 11 shows normalized R_DS(on) rising with T_j) ensures inherent current sharing stability. However, layout symmetry (matched trace inductance/resistance to each drain/source) and individual gate resistor damping (≥10 Ω) are mandatory to prevent oscillation during switching transitions.

BUK6D23-40EH Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 6-UDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 40 V

Current - Continuous Drain (Id) @ 25°C:: 8A (Ta), 19A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 23mOhm @ 8A, 10V

Vgs(th) (Max) @ Id:: 2.7V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 19 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 582 pF @ 20 V

FET Feature:: -

Power Dissipation (Max):: 2.3W (Ta), 15W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: DFN2020MD-6

BUK6D23-40EH FAQ

1.How can I place an order for BUK6D23-40EH through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK6D23-40EH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK6D23-40EH reliable?

The price and inventory of BUK6D23-40EH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK6D23-40EH is usually 5 days.

3.What payment methods are accepted for BUK6D23-40EH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK6D23-40EH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK6D23-40EH?

BUK6D23-40EH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK6D23-40EH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK6D23-40EH?

For technical support, including BUK6D23-40EH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK6D23-40EH requirements.

6.How does Aetrix verify that BUK6D23-40EH is sourced from the original manufacturer or authorized distributors?

All BUK6D23-40EH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK6D23-40EH meets industry standards.

7.What is the process for return or replacement of BUK6D23-40EH?

All BUK6D23-40EH units undergo pre-shipment inspection (PSI). If there is an issue with BUK6D23-40EH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK6D23-40EH part is unused and in its original packaging.

Return procedure for BUK6D23-40EH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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