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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. BUK6D38-30EX

Name: BUK6D38-30EX
Brand: Nexperia USA Inc.
SKU: BUK6D38-30EX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK6D38-30EX

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: 6-UDFN Exposed Pad

Datasheet:: BUK6D38-30EX.pdf

Description:: MOSFET N-CH 30V 5.5A/17A 6DFN

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Product details

Overview

BUK6D38-30EX from Nexperia is a 30 V, N-channel Trench MOSFET in DFN2020MD-6 (SOT1220) package, rated for 17 A continuous drain current at 25 °C, 29–38 mΩ R_DS(on) at V_GS = 10 V and T_j = 25 °C, and qualified to AEC-Q101 for automotive use. It serves as a low-side load switch or high-speed line driver in power management circuits requiring robust thermal performance and optical solder inspection capability.

For engineers reviewing the BUK6D38-30EX datasheet, BUK6D38-30EX pinout, BUK6D38-30EX application, or BUK6D38-30EX equivalent, key selection criteria include its 175 °C junction temperature rating, side-wettable flanks for automated optical inspection (AOI), 1.5 kV HBM ESD protection, and thermal resistance of 4–8 K/W from junction to solder point - critical for compact, thermally constrained automotive and industrial PCB layouts.

Technical Context

This MOSFET employs Trench MOSFET technology to achieve low on-resistance with fast switching characteristics: t_d(on) = 3 ns, t_r = 16 ns, t_d(off) = 10 ns, and t_f = 4 ns under standard test conditions (V_DS = 15 V, I_D = 5.5 A, R_G(ext) = 6 Ω). Its gate threshold voltage (V_GS(th)) ranges from 1.0 V to 2.5 V at T_j = 25 °C, enabling reliable turn-on with 3.3 V or 5 V logic-level drive.

The device integrates an intrinsic source-drain diode with V_SD = 0.8–1.2 V at I_S = 2 A and T_j = 25 °C, and exhibits 9 ns reverse recovery time (t_rr) and 2 nC recovered charge (Q_r). Avalanche ruggedness is specified at 10 mJ (unclamped, I_D = 0.67 A, T_j(init) = 25 °C), supporting transient energy handling in inductive switching applications.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V maximum drain-source voltage - defines safe blocking capability in 24 V automotive and industrial bus systems.
R_DS(on)	29–38 mΩ at V_GS = 10 V, I_D = 5.5 A, T_j = 25 °C - enables <1 W conduction loss at 10 A, reducing heatsink requirements.
I_D (continuous)	17 A at T_sp = 25 °C - supports high-current low-side switching in motor drivers and power supplies.
T_j max	175 °C - allows operation in under-hood automotive environments and sealed industrial enclosures without derating.
R_th(j-sp)	4–8 K/W junction-to-solder-point thermal resistance - enables direct thermal coupling to PCB copper, improving power density.
ESD HBM	>1.5 kV - ensures robustness during board assembly and handling without additional protection circuitry.
Avalanche energy	10 mJ (unclamped) - provides margin against inductive kickback in relay and solenoid driving applications.

Pinout & Package

Package: DFN2020MD-6 (SOT1220), 2 mm × 2 mm × 0.65 mm body, leadless thermal-enhanced ultra-thin outline with side-wettable flanks for AOI.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 5, 6, 7	Drain (D)	Five parallel drain terminals - maximize current handling and minimize package inductance; connected to large thermal pad for heat dissipation.
3	Gate (G)	Single gate input - compatible with standard CMOS/TTL logic drive; low Q_G(tot) = 5.3–8 nC enables fast, low-power switching.
4, 8	Source (S)	Two source terminals - reduce source inductance and improve stability in high-di/dt applications like motor control.

Key Features

Feature	Design Value
AEC-Q101 qualification	Validated for automotive-grade reliability including temperature cycling, humidity bias, and mechanical shock - suitable for engine control, lighting, and body electronics.
Side-wettable flanks	Exposed metal on package edges enables automated optical inspection (AOI) of solder joint quality - eliminates X-ray requirement for production line verification.
Extended T_j range	Rated for continuous operation up to 175 °C - supports placement near heat sources (e.g., power inductors, processors) without thermal throttling.
Low R_DS(on) temperature coefficient	R_DS(on) increases only ~1.7× from 25 °C to 175 °C (typical) - maintains predictable conduction loss across full operating range.
Fast switching with low Q_GD	Q_GD = 1.2 nC - minimizes Miller plateau duration and improves immunity to dv/dt-induced turn-on in half-bridge configurations.

Applications

Automotive LED Headlamp Driver

Industrial PLC Output Module

Use Scenario: Driving high-brightness LED arrays in adaptive front-lighting systems (AFS) with PWM dimming and short-circuit protection.

IC Role / Device Role / Timing Role: Low-side switch controlling LED current path; handles 10–15 A peak loads with <100 ns switching transitions.

Use Value: 29–38 mΩ R_DS(on) limits conduction loss to <2.5 W at 15 A, while 175 °C T_j rating ensures stable operation inside sealed headlamp housings.

Use Scenario: Solid-state replacement for electromechanical relays in programmable logic controller (PLC) digital output modules.

IC Role / Device Role / Timing Role: Low-side load switch interfacing microcontroller GPIO to 24 V DC field devices (solenoids, indicators, small motors).

Use Value: AEC-Q101 qualification and 1.5 kV HBM ESD rating eliminate need for external protection, reducing BOM count and board area in DIN-rail mounted controllers.

USB-C Power Delivery Load Switch

Brushless DC Motor Gate Driver Stage

Use Scenario: Inrush current limiting and fault isolation in USB-C PD sink applications with 5–20 V input and up to 5 A load current.

IC Role / Device Role / Timing Role: High-speed low-side switch enabling <10 µs response to overcurrent events via external comparator feedback.

Use Value: 3 ns turn-on delay and 4 ns fall time support precise timing control; side-wettable flanks ensure solder joint integrity on dense, multi-layer USB-C port PCBs.

Use Scenario: Low-side switch in three-phase BLDC motor inverter half-bridges, driven by gate driver ICs with 6 Ω external gate resistor.

IC Role / Device Role / Timing Role: Power stage transistor conducting phase current up to 12 A continuous (T_sp = 100 °C); switches at 20–50 kHz.

Use Value: 4–8 K/W R_th(j-sp) enables efficient heat transfer to 6 cm² drain pad, maintaining T_j < 150 °C even at full load in fanless motor drives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-side switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ON Semiconductor NTMFS4C09NT1G	R_DS(on) = 3.8 mΩ @ 10 V (lower), but larger 5×6 mm SO-8FL package and no side-wettable flanks.	Better conduction efficiency at high current, but requires X-ray for solder inspection and occupies >2.5× PCB area.	Select when lowest R_DS(on) dominates and AOI is not required; avoid in space-constrained automotive modules.
Infineon BSC014N04LS6	R_DS(on) = 1.4 mΩ @ 10 V, 40 V V_DS, but 150 °C T_j max and no AEC-Q101 qualification.	Higher voltage margin and lower loss, but unsuitable for automotive under-hood use without additional qualification.	Prefer for industrial 36 V systems where extended temperature and automotive compliance are not mandatory.

Compared with NTMFS4C09NT1G and BSC014N04LS6, BUK6D38-30EX uniquely balances AEC-Q101 compliance, 175 °C operation, side-wettable flanks, and 2 mm × 2 mm footprint - making it optimal for space- and reliability-critical automotive and industrial low-side switches where board-level AOI and thermal density are design constraints.

Availability

BUK6D38-30EX is available at Aetrix Electronics and suitable for automotive LED drivers, industrial PLC outputs, USB-C power delivery load switching, and brushless DC motor control requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for BUK6D38-30EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic solutions.

The BUK6D38-30EX belongs to Nexperia's TrenchMOS automotive portfolio, engineered specifically for low-R_DS(on), high-temperature, and AOI-compatible power switching in next-generation vehicle electronics and industrial automation systems.

FAQ

What is the maximum continuous drain current for BUK6D38-30EX at 100 °C case temperature?

At T_sp = 100 °C, the maximum continuous drain current is 12 A, as specified in Table 5 (Limiting values). This derating reflects thermal constraints of the DFN2020MD-6 package and must be verified using the normalized current curve (Figure 2), where I_der drops to ~70% of the 25 °C value.

Does BUK6D38-30EX require a gate resistor for stable switching in a 24 V automotive load switch application?

Yes - a 6 Ω external gate resistor is used in the datasheet's dynamic characterization (Table 7), and it is recommended to limit peak gate current, suppress ringing, and control dV/dt during turn-on/off. For 24 V loads with inductive components, this value balances switching speed and EMI mitigation without compromising reliability.

Can BUK6D38-30EX be used in a high-side configuration?

No - BUK6D38-30EX is an N-channel MOSFET with no integrated charge pump or bootstrap capability. High-side operation would require gate drive above the source potential, which is unsupported by its pinout and absolute maximum V_GS rating of ±20 V. It is designed exclusively for low-side switching.

Is the source-drain diode in BUK6D38-30EX suitable for freewheeling in relay coil suppression?

Yes - the intrinsic body diode has V_SD = 0.8–1.2 V at I_S = 2 A and t_rr = 9 ns, making it effective for clamping inductive flyback in relay drivers. Its low Q_r = 2 nC minimizes reverse recovery losses, and avalanche rating of 10 mJ provides margin against unclamped transients.

BUK6D38-30EX Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 6-UDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 5.5A (Ta), 17A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 38mOhm @ 5.5A, 10V

Vgs(th) (Max) @ Id:: 2.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 8 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 266 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 2W (Ta), 19W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: DFN2020MD-6

BUK6D38-30EX FAQ

1.How can I place an order for BUK6D38-30EX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK6D38-30EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK6D38-30EX reliable?

The price and inventory of BUK6D38-30EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK6D38-30EX is usually 5 days.

3.What payment methods are accepted for BUK6D38-30EX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK6D38-30EX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK6D38-30EX?

BUK6D38-30EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK6D38-30EX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK6D38-30EX?

For technical support, including BUK6D38-30EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK6D38-30EX requirements.

6.How does Aetrix verify that BUK6D38-30EX is sourced from the original manufacturer or authorized distributors?

All BUK6D38-30EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK6D38-30EX meets industry standards.

7.What is the process for return or replacement of BUK6D38-30EX?

All BUK6D38-30EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK6D38-30EX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK6D38-30EX part is unused and in its original packaging.

Return procedure for BUK6D38-30EX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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