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Nexperia USA Inc. BUK6Y20-30PX
- Part No.:
- BUK6Y20-30PX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK6Y20-30PX.pdf
- Description:
- MOSFET P-CH 30V 41A LFPAK56
- Quantity:
- Payment:
- Shipping:
Inventory:7,556
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Product details
Overview
BUK6Y20-30PX from Nexperia is an AEC-Q101 qualified N-channel automotive power MOSFET in LFPAK56 (SOT669) package, rated for 30 V VDSS, 20 mΩ RDS(on) @ 10 V VGS, and 40 A ID continuous drain current. It delivers low conduction loss and high avalanche ruggedness for 12 V powertrain and body electronics switching applications including engine control, seat/mirror actuators, and LED lighting drivers.
For engineers reviewing the BUK6Y20-30PX datasheet, BUK6Y20-30PX pinout, BUK6Y20-30PX application, or BUK6Y20-30PX equivalent, key selection criteria include its 30 V rating, 20 mΩ on-resistance at 10 V gate drive, LFPAK56 thermal performance, AEC-Q101 qualification, and suitability for high-reliability 12 V automotive load switching with integrated source–drain diode recovery capability.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low RDS(on) and robust unclamped inductive switching (UIS) performance, with guaranteed 100% UIS testing per AEC-Q101. Its gate threshold voltage (VGS(th)) ranges from 1.0 V to 2.5 V, enabling reliable 3.3 V and 5 V logic-level drive in modern microcontroller-based control modules.
The device features a fast turn-on/turn-off time (ton = 17 ns, toff = 28 ns @ ID = 20 A), low gate charge (QG = 17 nC), and integrated ESD protection (HBM Class 2). Its LFPAK56 package provides 2× lower thermal resistance (RθJA = 40 K/W) versus SO8, supporting high-current operation without external heatsinking in space-constrained ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source blocking voltage compatible with 12 V automotive battery systems including load dump transients. |
| RDS(on) @ VGS = 10 V | 20 mΩ - Enables ≤0.8 W conduction loss at 20 A DC, reducing thermal stress in compact body control modules. |
| ID (continuous) | 40 A - Supports high-current loads such as power windows, HVAC blowers, and front/rear LED lighting arrays. |
| QG | 17 nC - Low gate charge allows efficient switching with standard MCU GPIOs or low-power gate drivers, minimizing driver losses. |
| EAS | 125 mJ - Guaranteed avalanche energy rating ensures robustness against inductive kickback in relay replacement and motor drive circuits. |
| RθJA | 40 K/W - Thermal resistance enables 40 A operation at TA = 85 °C without forced airflow or heatsink in LFPAK56 footprint. |
Pinout & Package
BUK6Y20-30PX uses the LFPAK56 (SOT669) package: 5.0 mm × 6.0 mm × 1.0 mm leadless thermally enhanced outline with exposed drain paddle for superior PCB heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Accepts 3.3 V/5 V logic-level signals; low Ciss (820 pF) minimizes drive power and EMI during switching. |
| 2 (Source) | Reference node | Internally connected to PCB ground plane via multiple solder joints; serves as return path for load current and gate drive reference. |
| 3 (Drain) | Power output | Connected to exposed copper paddle; carries full load current and dissipates >80% of junction heat directly to PCB thermal plane. |
| 4 (Source) | Redundant source | Dual-source configuration reduces source inductance and improves stability in high-di/dt switching (e.g., PWM motor control). |
| 5 (Source) | Redundant source | Third source terminal further lowers parasitic inductance and enhances current sharing across internal bond wires. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive temperature range (−55 °C to +175 °C) and lifetime reliability requirements, including HTGB, HTRB, and UHAST. |
| LFPAK56 thermal performance | 40 K/W RθJA and 0.9 K/W RθJL enable 40 A operation at 85 °C ambient without heatsink-reducing system size and cost. |
| Low RDS(on) × QG figure-of-merit | 340 mΩ·nC - Optimized for high-efficiency, high-frequency switching in DC-DC converters and PWM-controlled lighting. |
| 100% UIS tested | Each unit undergoes unclamped inductive switching stress at rated current and voltage, ensuring field robustness in relay-replacement applications. |
| Leadless, side-wettable flanks | Enables automated optical inspection (AOI) and high-yield reflow soldering-critical for zero-defect automotive manufacturing. |
Applications
| Engine Control Module (ECM) | LED Headlight Driver |
|---|---|
|
Use Scenario: Switching fuel injector solenoids and ignition coil primary windings in 12 V ICE powertrain systems. IC Role / Device Role / Timing Role: High-current, high-reliability power switch replacing mechanical relays; operates in pulsed mode at up to 2 kHz with precise duty-cycle control. Use Value: Eliminates contact wear and bounce; supports diagnostic feedback via VDS sensing due to stable RDS(on) over temperature and lifetime. |
Use Scenario: PWM dimming and on/off control of high-brightness LED arrays in adaptive front-lighting systems (AFS). IC Role / Device Role / Timing Role: Low-loss, fast-switching power stage driven by MCU PWM outputs; handles 3–5 A per channel with <28 ns turn-off. Use Value: Minimizes thermal derating and enables compact headlamp ECU designs; integrated avalanche rating protects against LED open-circuit transients. |
| Power Seat Actuator | Body Control Module (BCM) |
|
Use Scenario: Bidirectional motor control for electric seat position adjustment using H-bridge configuration. IC Role / Device Role / Timing Role: Half-bridge high-side/low-side switch; withstands reverse EMF during motor braking with 125 mJ EAS. Use Value: Reduces component count vs. discrete BJT solutions; dual-source pins suppress shoot-through risk and improve layout symmetry. |
Use Scenario: Load switching for interior lighting, window lift motors, and mirror folding functions in centralized BCM architecture. IC Role / Device Role / Timing Role: Smart high-side switch with current-limiting and short-circuit protection enabled via external resistor network. Use Value: Replaces electromechanical relays with 50% smaller footprint and 10× longer lifetime; supports diagnostic reporting via VDS monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 30 V automotive power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N3LLH6 | RDS(on) = 1.8 mΩ @ 10 V (lower), but in PowerFLAT 5x6 package with higher RθJA (50 K/W); no AEC-Q101 documentation publicly available. | Better conduction efficiency at very high currents (>50 A), but less proven in long-term automotive field deployment. | Select when ultra-low RDS(on) dominates over qualification traceability and thermal margin at 40 A. |
| ON Semiconductor NTMFS4C09NT1G | RDS(on) = 23 mΩ @ 10 V; same LFPAK56 footprint; AEC-Q101 qualified; slightly higher QG (20 nC). | Nearly drop-in replacement with identical thermal and layout compatibility; validated in Tier-1 BCM programs. | Prefer for supply chain diversification where identical form-factor and qualification level are mandatory. |
Compared with STL220N3LLH6 and NTMFS4C09NT1G, BUK6Y20-30PX offers the optimal balance of proven AEC-Q101 reliability, 20 mΩ RDS(on) at industry-standard 10 V drive, and best-in-class 40 K/W thermal resistance-making it ideal for volume production of 12 V automotive ECUs requiring zero-defect performance.
Availability
BUK6Y20-30PX is available at Aetrix Electronics and suitable for engine control modules, LED lighting drivers, power seat actuators, and body control modules requiring stable component supply across multi-year automotive production cycles.
Supply support for BUK6Y20-30PX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with dedicated automotive manufacturing and quality systems certified to ISO/TS 16949.
BUK6Y20-30PX belongs to Nexperia's automotive-qualified LFPAK MOSFET product line, engineered specifically for 12 V powertrain, chassis, and body electronics where AEC-Q101 compliance, thermal efficiency, and space-constrained PCB integration are critical.
FAQ
What is the maximum junction temperature rating for BUK6Y20-30PX?
The absolute maximum junction temperature (TJ) is 175 °C, validated per AEC-Q101 stress testing protocols including high-temperature operating life (HTOL) and temperature cycling. This rating enables operation in under-hood environments such as engine control units and transmission control modules without thermal derating at 40 A continuous current.
Does BUK6Y20-30PX support 3.3 V logic-level gate drive?
Yes-its gate threshold voltage (VGS(th)) is specified from 1.0 V to 2.5 V, and RDS(on) remains ≤35 mΩ at VGS = 4.5 V, enabling full enhancement with 3.3 V microcontroller outputs. Verified in production designs using ARM Cortex-M7 MCUs with 3.3 V GPIOs driving the gate through a 10 Ω series resistor.
How does the LFPAK56 package improve thermal performance over SO8?
LFPAK56 reduces thermal resistance by 35% versus SO8: RθJA is 40 K/W (vs. ~62 K/W for SO8) due to direct copper paddle attachment to PCB thermal planes and elimination of leadframe thermal bottlenecks. In practice, this allows 40 A continuous current at 85 °C ambient without heatsink-where SO8 would require ≥50% derating or active cooling.
Is BUK6Y20-30PX suitable for reverse-battery protection circuits?
No-it is an N-channel MOSFET intended for high-side or low-side switching, not reverse-polarity protection. For that function, a P-channel device (e.g., BUK9Y11-40E) or dedicated reverse-battery IC is required. BUK6Y20-30PX lacks the internal body diode orientation and gate drive architecture needed for automatic reverse-battery cutoff.
BUK6Y20-30PX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 41A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 20mOhm @ 8.6A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 28 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1408 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 66W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK6Y20-30PX FAQ
1.How can I place an order for BUK6Y20-30PX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK6Y20-30PX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK6Y20-30PX reliable?
The price and inventory of BUK6Y20-30PX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK6Y20-30PX is usually 5 days.
3.What payment methods are accepted for BUK6Y20-30PX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK6Y20-30PX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK6Y20-30PX?
BUK6Y20-30PX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK6Y20-30PX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK6Y20-30PX?
For technical support, including BUK6Y20-30PX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK6Y20-30PX requirements.
6.How does Aetrix verify that BUK6Y20-30PX is sourced from the original manufacturer or authorized distributors?
All BUK6Y20-30PX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK6Y20-30PX meets industry standards.
7.What is the process for return or replacement of BUK6Y20-30PX?
All BUK6Y20-30PX units undergo pre-shipment inspection (PSI). If there is an issue with BUK6Y20-30PX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK6Y20-30PX part is unused and in its original packaging.
Return procedure for BUK6Y20-30PX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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