Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

NXP Semiconductors BUK7514-55A,127

Name: BUK7514-55A,127
Brand: NXP Semiconductors
SKU: BUK7514-55A,127
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BUK7514-55A,127

Manufacturer:: NXP Semiconductors

Category:: FETs, MOSFETs

Package:: TO-220-3

Datasheet:: BUK7514-55A,127.pdf

Description:: MOSFET N-CH 55V 73A TO220AB

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:9,240

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BUK7514-55A from NXP Semiconductors is a standard-level N-channel TrenchMOS FET in TO-220AB (SOT78A) package, designed for automotive-critical power switching. It delivers 55 V drain-source voltage rating, 73 A continuous drain current at T_mb = 25 °C, and 12 mΩ typical R_DS(on) at V_GS = 10 V and T_j = 25 °C, enabling efficient high-current DC load control in engine management and body electronics.

For engineers reviewing the BUK7514-55A datasheet, BUK7514-55A pinout, BUK7514-55A application, or BUK7514-55A equivalent, key selection criteria include AEC-Q101 qualification, unclamped avalanche energy of 125 mJ, thermal resistance R_th(j-mb) = 0.9 K/W, gate threshold voltage range (1–4.4 V), and mounting-base temperature derating behavior.

Technical Context

This device uses TrenchMOS technology to achieve low on-state resistance while maintaining robustness for automotive environments. Its gate-source threshold voltage (V_GS(th)) varies from 1 V at T_j = 175 °C to 4.4 V at T_j = −55 °C, supporting reliable turn-on across full junction temperature range. The integrated source-drain diode exhibits V_SD = 0.85–1.2 V at I_S = 25 A and T_j = 25 °C.

Dynamic characteristics include C_iss = 1848–2464 pF, C_oss = 421–506 pF, and fast switching with t_d(on) = 17–26 ns and t_f = 51–71 ns under specified test conditions. Internal inductances are tightly controlled: L_D = 3.5–4.5 nH (tab-to-die), L_S = 7.5 nH (lead-to-bond pad), minimizing voltage overshoot during hard switching.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	55 V maximum - supports 42 V nominal automotive battery systems with margin for load dump transients
I_D (continuous)	73 A at T_mb = 25 °C - enables high-power solenoid, fan, or heater control without external heatsink derating
R_DS(on)	12–14 mΩ typ at V_GS = 10 V, I_D = 25 A, T_j = 25 °C - limits conduction loss to ≤2.2 W at 30 A, reducing thermal stress
E_DS(AL)S	125 mJ unclamped avalanche energy - sustains single-pulse inductive kickback from 50 A loads without failure
R_th(j-mb)	0.9 K/W - allows direct mounting to chassis or heatsink for efficient thermal transfer in space-constrained modules
V_GS(th)	2–4 V typ at T_j = 25 °C - ensures compatibility with 3.3 V and 5 V logic-level gate drivers without level shifting
Q_G	~50 nC typical - determines gate drive power requirement and switching speed in PWM applications

Pinout & Package

Package: TO-220AB (SOT78A), plastic single-ended package with heatsink-mounted mounting base connected to drain; 3-lead configuration with 1 mounting hole.

Pin/Terminal	Circuit Role	Design Meaning
1 (G)	Gate	Control terminal accepting 0–20 V gate-source voltage; requires <100 nA leakage current handling
2 (D)	Drain	Main power input; electrically tied to mounting base for low-inductance heat path and simplified PCB layout
3 (S)	Source	Power return path; referenced to system ground; carries full load current with minimal parasitic inductance (L_S = 7.5 nH)
Mounting base (mb)	Drain connection	Integral thermal and electrical path to heatsink; eliminates need for separate drain trace and reduces EMI loop area

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive safety-critical applications including engine control, braking, and ADAS subsystems
Low R_DS(on)	12 mΩ typ enables >98% efficiency at 30 A/12 V, reducing thermal design burden in sealed enclosures
High avalanche ruggedness	125 mJ non-repetitive energy rating protects against inductive switching failures in relay replacement circuits
Thermal performance	0.9 K/W junction-to-mounting-base resistance supports sustained operation at T_j = 175 °C with proper heatsinking
Wide V_GS(th) range	1–4.4 V over −55 to +175 °C ensures predictable turn-on behavior across automotive ambient extremes

Applications

Engine Control Module (ECM)	Body Control Module (BCM)
Use Scenario: Switching fuel injector solenoids and ignition coil primary windings in 12 V/24 V gasoline/diesel engines. IC Role / Device Role / Timing Role: High-side or low-side power switch controlling inductive loads with precise PWM timing and fast fall time (t_f ≤ 71 ns). Use Value: Avalanche energy rating prevents failure during coil flyback; low R_DS(on) minimizes power loss in duty-cycle-intensive injection cycles.	Use Scenario: Driving HVAC blower motors, seat heaters, and door lock actuators in passenger compartments. IC Role / Device Role / Timing Role: Robust DC power switch interfacing directly with microcontroller GPIO or dedicated driver ICs. Use Value: AEC-Q101 compliance ensures reliability over 15-year vehicle lifetime; mounting base connection simplifies thermal management in compact BCM housings.
Electric Power Steering (EPS)	Commercial Vehicle Lighting
Use Scenario: Controlling assist motor phase currents and auxiliary hydraulic pump drives in steer-by-wire systems. IC Role / Device Role / Timing Role: High-current MOSFET in H-bridge or half-bridge configurations requiring fast switching and low conduction loss. Use Value: 73 A continuous rating supports peak assist torque demands; tight C_iss/C_oss specs enable clean commutation at >20 kHz PWM frequencies.	Use Scenario: Managing LED headlamp arrays and trailer lighting loads in trucks and buses with 24 V nominal systems. IC Role / Device Role / Timing Role: Load switch protecting downstream circuitry from reverse polarity, overvoltage, and short-circuit faults. Use Value: 55 V V_DS withstands 36 V load dump events; internal source-drain diode provides freewheeling path for inductive lamp ballasts.

Engine Control Module (ECM)

Body Control Module (BCM)

Use Scenario: Switching fuel injector solenoids and ignition coil primary windings in 12 V/24 V gasoline/diesel engines.

IC Role / Device Role / Timing Role: High-side or low-side power switch controlling inductive loads with precise PWM timing and fast fall time (t_f ≤ 71 ns).

Use Value: Avalanche energy rating prevents failure during coil flyback; low R_DS(on) minimizes power loss in duty-cycle-intensive injection cycles.

Use Scenario: Driving HVAC blower motors, seat heaters, and door lock actuators in passenger compartments.

IC Role / Device Role / Timing Role: Robust DC power switch interfacing directly with microcontroller GPIO or dedicated driver ICs.

Use Value: AEC-Q101 compliance ensures reliability over 15-year vehicle lifetime; mounting base connection simplifies thermal management in compact BCM housings.

Electric Power Steering (EPS)

Commercial Vehicle Lighting

Use Scenario: Controlling assist motor phase currents and auxiliary hydraulic pump drives in steer-by-wire systems.

IC Role / Device Role / Timing Role: High-current MOSFET in H-bridge or half-bridge configurations requiring fast switching and low conduction loss.

Use Value: 73 A continuous rating supports peak assist torque demands; tight C_iss/C_oss specs enable clean commutation at >20 kHz PWM frequencies.

Use Scenario: Managing LED headlamp arrays and trailer lighting loads in trucks and buses with 24 V nominal systems.

IC Role / Device Role / Timing Role: Load switch protecting downstream circuitry from reverse polarity, overvoltage, and short-circuit faults.

Use Value: 55 V V_DS withstands 36 V load dump events; internal source-drain diode provides freewheeling path for inductive lamp ballasts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP75NF55	Higher R_DS(on) (14 mΩ min), same 55 V rating, TO-220FP package with insulated tab	Non-AEC-Q101; suitable for industrial but not automotive safety-critical use	Select when insulation from heatsink is required and AEC qualification is unnecessary
IRFZ44NPBF	Lower voltage rating (55 V max), higher R_DS(on) (17.5 mΩ typ), no avalanche rating specified	Not qualified for automotive; limited thermal robustness (R_th(j-mb) not specified)	Consider only for cost-sensitive non-automotive applications where transient immunity is secondary

Compared with STP75NF55 and IRFZ44NPBF, the BUK7514-55A offers verified AEC-Q101 qualification, superior avalanche ruggedness (125 mJ), and lower R_DS(on), making it the preferred choice for automotive power switching where reliability under harsh transients is mandatory.

Availability

BUK7514-55A is available at Aetrix Electronics and suitable for automotive engine control, body electronics, and commercial vehicle power distribution requiring stable component supply across long production lifecycles.

Supply support for BUK7514-55A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The BUK7514-55A belongs to NXP's TrenchMOS standard-level power MOSFET product line, engineered specifically for high-reliability automotive power switching applications demanding AEC-Q101 compliance and robust avalanche performance.

FAQ

What is the maximum junction temperature rating for the BUK7514-55A?

The BUK7514-55A has a maximum junction temperature (T_j) of 175 °C, validated per AEC-Q101 stress testing. This rating enables operation in under-hood environments where ambient temperatures exceed 125 °C, provided thermal design maintains T_j ≤ 175 °C using the specified R_th(j-mb) = 0.9 K/W path to the mounting base. Derating curves in the datasheet show continuous current reduction above T_mb = 25 °C.

Is the BUK7514-55A pin-compatible with other TO-220AB N-channel MOSFETs?

The BUK7514-55A uses standard TO-220AB (SOT78A) pinout: Pin 1 = Gate, Pin 2 = Drain (connected to mounting base), Pin 3 = Source. While physical footprint and lead spacing match industry-standard TO-220AB, electrical compatibility depends on R_DS(on), V_GS(th), and avalanche rating - the BUK7514-55A is not a drop-in replacement for non-AEC-Q101 or non-avalanche-rated variants without circuit validation.

Does the BUK7514-55A have an integrated body diode, and what are its characteristics?

Yes, the BUK7514-55A includes an inherent source-drain body diode. At I_S = 25 A and T_j = 25 °C, forward voltage (V_SD) is 0.85–1.2 V; at I_S = 73 A, it rises to 1.1 V. Reverse recovery time (t_rr) is 54 ns with Q_r = 0.12 µC under specified test conditions (I_S = 73 A, dI_S/dt = −100 A/µs), supporting moderate-frequency freewheeling in inductive load circuits.

What gate drive voltage is required to fully enhance the BUK7514-55A?

The BUK7514-55A achieves its specified R_DS(on) of 12–14 mΩ at V_GS = 10 V. Gate threshold voltage (V_GS(th)) ranges from 2–4 V at T_j = 25 °C, meaning it begins conducting significantly above ~3 V. For reliable saturation and minimal conduction loss across temperature, a minimum V_GS of 10 V is recommended; operation at 5 V yields higher R_DS(on) and increased power dissipation.

How does the mounting base connection affect PCB layout for the BUK7514-55A?

The mounting base (tab) of the BUK7514-55A is internally connected to the drain terminal, so PCB copper pour or heatsink interface must be electrically isolated from source and gate traces. This eliminates need for a separate drain trace but requires careful isolation of the heatsink from other potentials. Thermal vias under the tab and direct screw-mounting to chassis improve heat transfer, while minimizing loop area between drain and source reduces EMI in high-di/dt switching.

BUK7514-55A,127 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: TrenchMOS™

Package/Case:: TO-220-3

Packaging:: Tube

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 55 V

Current - Continuous Drain (Id) @ 25°C:: 73A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 14mOhm @ 25A, 10V

Vgs(th) (Max) @ Id:: 4V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: -

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 2464 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 166W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-220AB

BUK7514-55A,127 FAQ

1.How can I place an order for BUK7514-55A,127 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK7514-55A,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK7514-55A,127 reliable?

The price and inventory of BUK7514-55A,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7514-55A,127 is usually 5 days.

3.What payment methods are accepted for BUK7514-55A,127?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7514-55A,127 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK7514-55A,127?

BUK7514-55A,127 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK7514-55A,127 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK7514-55A,127?

For technical support, including BUK7514-55A,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7514-55A,127 requirements.

6.How does Aetrix verify that BUK7514-55A,127 is sourced from the original manufacturer or authorized distributors?

All BUK7514-55A,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7514-55A,127 meets industry standards.

7.What is the process for return or replacement of BUK7514-55A,127?

All BUK7514-55A,127 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7514-55A,127, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK7514-55A,127 part is unused and in its original packaging.

Return procedure for BUK7514-55A,127:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…