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NXP Semiconductors BUK752R3-40C,127

Part No.:
BUK752R3-40C,127
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixBUK752R3-40C,127.pdf
Description:
MOSFET N-CH 40V 100A TO220AB
Quantity:
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Payment
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Inventory:4,791

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Product details

Overview

BUK752R3-40C from Nexperia is an AEC-Q101 qualified N-channel TrenchMOS standard-level power MOSFET in TO-220AB (SOT78A) package, designed for automotive 12V load switching. It delivers 100 A continuous drain current at 25 °C mounting base temperature, features 2.3 mΩ maximum RDS(on) at VGS = 10 V and Tj = 25 °C, supports 175 °C junction operation, and withstands 40 V drain-source voltage - enabling robust control of motors, lamps, and solenoids in engine compartments.

For engineers reviewing the BUK752R3-40C datasheet, BUK752R3-40C pinout, BUK752R3-40C application, or BUK752R3-40C equivalent, this page provides verified technical context, thermal performance data, avalanche energy rating (1.2 J), gate charge (175 nC), and validated alternatives for high-reliability automotive power design.

Technical Context

This device uses TrenchMOS technology to achieve low on-resistance and high avalanche ruggedness. Its standard-level gate drive (VGS(th) = 2–4 V) enables direct interface with 5 V/3.3 V microcontrollers without level-shifting, while its 0.45 K/W junction-to-mounting-base thermal resistance ensures efficient heat transfer to external heatsinks.

The MOSFET supports unclamped inductive switching with 1.2 J non-repetitive avalanche energy at 100 A and 40 V supply. Its dynamic characteristics include 67 nC gate-drain charge and 133 ns rise time, making it suitable for high-frequency PWM in motor control and DC-DC conversion stages.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum drain-source blocking voltage; defines safe operation in 12V automotive systems with load-dump transients.
RDS(on) 1.96–2.3 mΩ @ VGS = 10 V, Tj = 25 °C - Enables <1.5 W conduction loss at 60 A, critical for thermally constrained modules.
ID 100 A @ Tmb = 25 °C - Continuous current rating limited by TO-220AB package thermal capability, not silicon.
EDS(AL)S 1.2 J - Non-repetitive avalanche energy; allows reliable operation during inductive turn-off without external snubbers.
QG(tot) 175 nC - Total gate charge determines driver strength requirement; compatible with standard 1 A peak gate drivers.
Tj(max) 175 °C - Junction temperature rating enables use in under-hood environments without derating penalties.
Rth(j-mb) 0.45 K/W - Low thermal resistance from die to mounting base; enables >300 W dissipation with 100 K/W heatsink.

Pinout & Package

Package: TO-220AB (SOT78A), plastic single-ended package with heatsink-mounted mounting base electrically connected to drain. Dimensions: 15.8 × 10.3 × 4.5 mm (L × W × H), 1 mounting hole, 3 leads.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal; requires 10 V for full enhancement; threshold range 2–4 V enables TTL/CMOS compatibility.
2 (D) Drain Main power output; internally bonded to mounting base - must be isolated from chassis unless circuit design permits common-drain configuration.
3 (S) Source Power return path; referenced to gate drive ground; internal source inductance (7.5 nH) affects high-speed switching stability.
Mounting base (mb) Drain connection Electrically tied to drain pin; primary thermal path to heatsink; requires insulating washer if chassis isolation is needed.

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive-grade reliability including temperature cycling, humidity testing, and mechanical shock per AEC standard.
Avalanche robust Rated for 1.2 J unclamped inductive energy - eliminates need for external clamping diodes in solenoid/motor drive circuits.
Standard-level gate drive Operates fully enhanced with 10 V gate voltage - directly drivable by MCU GPIOs or low-voltage logic buffers without level shifters.
175 °C junction rating Enables uninterrupted operation in engine bay environments where ambient exceeds 125 °C, reducing thermal derating overhead.
Low RDS(on) × QG figure-of-merit ~400 mΩ·nC - balances conduction and switching losses for high-efficiency 10–100 kHz PWM applications.

Applications

Engine Cooling Fan Control Headlamp Beam Switching

Use Scenario: PWM-controlled 12V DC brushless fan driving up to 80W load in engine compartment.

IC Role / Device Role / Timing Role: High-side power switch managing current flow to fan motor windings; handles 10–20 kHz PWM with minimal thermal rise.

Use Value: 2.3 mΩ RDS(on) limits conduction loss to <1.3 W at 70 A, while 175 °C rating prevents thermal shutdown during sustained high-load operation.

Use Scenario: Fast-switching headlamp high/low beam selection using dual 12V filament loads.

IC Role / Device Role / Timing Role: Low-side load switch enabling <100 µs transition between beams via microcontroller I/O.

Use Value: 133 ns rise time and 119 ns fall time ensure crisp beam transitions; avalanche rating absorbs inductive kickback from filament cold-resistance surge.

Fuel Injector Driver Transmission Solenoid Actuation

Use Scenario: Driving peak-current 12V fuel injectors requiring 5–10 A pulses at 1–5 ms duration.

IC Role / Device Role / Timing Role: Saturated switch controlling injector coil energization; operates in linear region during current ramp-up.

Use Value: 1104 A peak drain current rating accommodates 10× nominal coil current during turn-on; 75 ns reverse recovery time minimizes body diode conduction loss.

Use Scenario: Controlling hydraulic solenoids in automatic transmission valve bodies under high-temperature conditions.

IC Role / Device Role / Timing Role: High-reliability power switch handling 12V/3A steady-state and 100 A transient surges during gear shifts.

Use Value: AEC-Q101 qualification ensures lifetime reliability across -40 °C to 175 °C; 1.2 J avalanche energy protects against inductive spikes during rapid de-energization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP110N4F6 40 V VDS, 110 A ID, 2.4 mΩ RDS(on), TO-220FP package (no mounting base); higher Rth(j-a) (65 K/W). Lacks mounting base; unsuitable for high-power heatsink mounting; better for PCB-constrained space-limited designs. Select when board-level thermal management suffices and chassis mounting is unnecessary.
IRF1404ZLPBF 40 V VDS, 180 A ID, 3.8 mΩ RDS(on), TO-220AB package; not AEC-Q101 qualified; lower avalanche rating (0.8 J). Higher current rating but no automotive qualification; less robust under repetitive inductive stress. Select for cost-sensitive industrial motor drives where AEC compliance is not required.

Compared with STP110N4F6 and IRF1404ZLPBF, BUK752R3-40C uniquely combines AEC-Q101 qualification, 0.45 K/W thermal resistance, and 1.2 J avalanche energy in a TO-220AB package - making it the only option among the three validated for under-hood automotive solenoid and motor control with zero layout compromise.

Availability

BUK752R3-40C is available at Aetrix Electronics and suitable for automotive engine control units, transmission control modules, and body electronics requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for BUK752R3-40C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products division. It focuses on high-volume, high-reliability components for automotive, industrial, and computing markets.

BUK752R3-40C belongs to Nexperia's TrenchMOS automotive power portfolio, engineered specifically for robust 12V load switching in harsh environments - emphasizing AEC-Q101 compliance, thermal resilience, and avalanche ruggedness over generic switching performance.

FAQ

What is the maximum junction temperature rating for BUK752R3-40C?

The BUK752R3-40C has a maximum junction temperature (Tj) rating of 175 °C, confirmed in Table 4 (Limiting Values) of its datasheet. This rating enables operation in high-ambient automotive environments such as engine bays, and is supported by its 175 °C storage temperature limit and thermal characterization up to that temperature. The BUK752R3-40C maintains specified RDS(on) and avalanche performance within this full range.

Is BUK752R3-40C pin-compatible with other TO-220AB N-channel MOSFETs?

BUK752R3-40C uses standard TO-220AB (SOT78A) pinout: Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source, with the mounting base electrically connected to the drain. While physical footprint matches industry-standard TO-220AB devices, electrical compatibility depends on RDS(on), gate charge, and avalanche rating - not just pin count or position. The BUK752R3-40C should not be assumed drop-in without verifying these parameters against the target replacement.

Does BUK752R3-40C require a gate resistor for automotive applications?

Yes - a gate resistor is recommended for BUK752R3-40C to control dV/dt and prevent oscillation during switching. The datasheet specifies test conditions with RG(ext) = 10 Ω for timing measurements (e.g., td(on), tr). For automotive PWM at 10–50 kHz, a 10–47 Ω series resistor is typical; lower values increase switching speed but risk EMI and shoot-through, especially with fast microcontroller outputs driving the BUK752R3-40C gate.

What is the avalanche energy rating of BUK752R3-40C and how is it tested?

The BUK752R3-40C is rated for 1.2 J non-repetitive drain-source avalanche energy (EDS(AL)S), measured under conditions of ID = 100 A, Vsup ≤ 40 V, RGS = 50 Ω, VGS = 10 V, and Tj(init) = 25 °C in unclamped inductive switching. This value is confirmed in Table 1 (Quick reference) and Table 4 (Limiting values). It reflects single-pulse robustness - not repetitive operation - and is validated per AEC-Q101 stress requirements.

Can BUK752R3-40C be used in high-side switching configurations?

BUK752R3-40C is an N-channel MOSFET optimized for low-side switching due to its standard-level gate drive and TO-220AB package where the mounting base connects to drain. High-side use requires a gate voltage ≥ VDS + VGS(th), typically needing a charge pump or bootstrap circuit. While possible, it adds complexity - the BUK752R3-40C datasheet does not characterize or recommend high-side operation, and its thermal path assumes drain-to-heatsink mounting, which conflicts with most high-side layouts.

BUK752R3-40C,127 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
TrenchMOS™
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.3mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
175 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
11323 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
333W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

BUK752R3-40C,127 FAQ

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Please submit a Request for Quotation (RFQ) for BUK752R3-40C,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of BUK752R3-40C,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK752R3-40C,127 is usually 5 days.

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For technical support, including BUK752R3-40C,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK752R3-40C,127 requirements.

6.How does Aetrix verify that BUK752R3-40C,127 is sourced from the original manufacturer or authorized distributors?

All BUK752R3-40C,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK752R3-40C,127 meets industry standards.

7.What is the process for return or replacement of BUK752R3-40C,127?

All BUK752R3-40C,127 units undergo pre-shipment inspection (PSI). If there is an issue with BUK752R3-40C,127, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK752R3-40C,127 part is unused and in its original packaging.

Return procedure for BUK752R3-40C,127:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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