My Inquiry
My Account
NXP Semiconductors BUK7605-30A,118
- Part No.:
- BUK7605-30A,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
BUK7605-30A,118.pdf
- Description:
- MOSFET N-CH 30V 75A D2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:2,269
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK7605-30A from NXP (formerly Philips Semiconductors) is an N-channel enhancement-mode TrenchMOS™ power transistor in SOT404 (D2PAK) package, rated for 30 V VDS, 75 A continuous drain current at Tmb = 25 °C, and 5 mΩ RDS(ON) at VGS = 10 V. It serves as a high-current, low-loss switching element in automotive load switching and industrial DC power control circuits.
For engineers reviewing the BUK7605-30A datasheet, BUK7605-30A pinout, BUK7605-30A application, or BUK7605-30A equivalent, key selection factors include its 0.65 K/W junction-to-mounting-base thermal resistance, unclamped inductive avalanche energy rating of 500 mJ, and integrated body diode with 75 A reverse current capability under continuous conduction.
Technical Context
This standard-level MOSFET uses trench-gate technology to achieve ultra-low on-resistance while maintaining robust gate oxide integrity and stable threshold voltage (VGS(TO) = 2–4 V). Its gate drive requires only 10 V for full enhancement, and it supports fast switching with typical turn-on delay of 35 ns and turn-off delay of 155 ns under defined test conditions.
The device integrates a monolithic body diode with VSD = 0.85–1.2 V at IF = 25 A and exhibits controlled reverse recovery (trr = 400 ns, Qrr = 1.0 µC), enabling reliable operation in inductive switching topologies without external freewheeling diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage before breakdown; defines safe operating range in 24 V automotive and 28 V industrial systems. |
| ID (DC) | 75 A at Tmb = 25 °C - Continuous current handling capacity when mounted on thermally optimized PCB copper area. |
| RDS(ON) | 5 mΩ at VGS = 10 V - Low conduction loss yielding <0.3 W dissipation at 25 A, critical for thermal management in high-current switches. |
| Ptot | 230 W at Tmb = 25 °C - Total power dissipation limit under ideal heatsinking; derates linearly above 25 °C mounting base temperature. |
| Rth j-mb | 0.65 K/W - Junction-to-mounting-base thermal resistance; enables direct thermal path to heatsink via exposed drain pad. |
| Qrr | 1.0 µC - Reverse recovery charge of integrated body diode; determines switching loss and EMI in flyback/inductive turn-off. |
| trr | 400 ns - Body diode reverse recovery time; impacts minimum dead-time requirements in half-bridge configurations. |
| WDSS | 500 mJ - Non-repetitive unclamped inductive avalanche energy; supports robustness against load dump or inductive kick events. |
Pinout & Package
SOT404 (D2PAK) surface-mount plastic package with exposed metal mounting base (drain-connected); center pin (pin 2) and mounting base both serve as drain terminals; pin 1 is gate; pin 3 is source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Receives 10 V logic-level gate drive; requires static protection during handling due to sensitive oxide layer. |
| 2 (Drain) | High-side power terminal | Electrically connected to mounting base; primary heat transfer path to heatsink; carries full load current. |
| 3 (Source) | Reference node / return path | Common reference for gate drive and current sensing; low-inductance connection critical for switching stability. |
| Mounting base (mb) | Drain extension | Exposed copper pad soldered to PCB thermal plane; provides mechanical anchoring and dominant thermal conduction path. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ technology | Enables 5 mΩ RDS(ON) at 30 V rating-reducing conduction losses by >40% vs. planar MOSFETs in same package. |
| Integrated body diode | Rated for 75 A continuous reverse current with 1.0 µC Qrr, eliminating need for external freewheeling diode in DC motor drives. |
| 0.65 K/W Rth j-mb | Allows >200 W power dissipation with modest heatsinking-enabling compact designs in space-constrained automotive ECUs. |
| Unclamped avalanche rating | 500 mJ energy tolerance supports reliable operation during inductive load disconnection without snubber networks. |
| SOT404 mechanical design | Center-drain pin + exposed mounting base ensures low-inductance, high-current paths and repeatable thermal performance across production units. |
Applications
| Automotive Body Control Module | Industrial DC Motor Driver |
|---|---|
Use Scenario: Switching 12–24 V loads such as headlights, HVAC fans, and window lift motors in vehicle body electronics. IC Role / Device Role / Timing Role: High-side power switch controlling load current with PWM duty cycle modulation. Use Value: 5 mΩ RDS(ON) minimizes voltage drop and self-heating during sustained 50–75 A peak loads, extending module lifetime. | Use Scenario: Driving brushed DC motors in factory automation equipment requiring bidirectional control and regenerative braking. IC Role / Device Role / Timing Role: Low-side switching element in H-bridge configuration, conducting reverse current through integrated body diode during freewheeling. Use Value: 400 ns trr and 1.0 µC Qrr reduce switching loss and EMI during 20 kHz PWM commutation. |
| Truck Trailer Lighting Controller | Power Distribution Unit (PDU) |
Use Scenario: Managing multiple 24 V trailer lighting circuits subject to load dump transients up to ±60 V. IC Role / Device Role / Timing Role: Protected load switch with built-in overvoltage clamping via avalanche-rated drain-source junction. Use Value: 500 mJ unclamped avalanche energy withstands repeated 12 V battery disconnect events without degradation. | Use Scenario: Solid-state replacement for electromechanical relays in server rack PDUs delivering 30 A per channel. IC Role / Device Role / Timing Role: Main current-handling switch activated by microcontroller GPIO with 10 V gate drive. Use Value: 0.65 K/W Rth j-mb enables 75 A operation with passive heatsinking-eliminating fan cooling and reducing system noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STB75NF3L-1 | 30 V, 75 A, RDS(ON) = 4.5 mΩ @ 10 V; TO-220FP package; higher Rth j-a (60 K/W). | Requires larger heatsink for same power; not surface-mount compatible; better suited for prototyping or low-volume assemblies. | Select when through-hole assembly or legacy footprint compatibility is required; avoid for high-density SMT designs. |
| IRF1404ZPBF | 40 V, 130 A, RDS(ON) = 4.7 mΩ @ 10 V; TO-220AB package; no specified avalanche rating. | Higher voltage margin but lacks documented unclamped avalanche capability; unsuitable for automotive load-dump environments. | Choose only for 36–40 V systems where avalanche robustness is not critical; verify thermal interface for 130 A rating. |
Compared with STB75NF3L-1 and IRF1404ZPBF, the BUK7605-30A uniquely combines SOT404 surface-mount compatibility, 0.65 K/W thermal resistance, and certified 500 mJ avalanche energy-making it optimal for space-constrained, thermally demanding automotive and industrial switching applications.
Availability
BUK7605-30A is available at Aetrix Electronics and suitable for automotive body control modules, industrial DC motor drivers, and power distribution units requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.
Supply support for BUK7605-30A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The BUK7605-30A belongs to NXP's TrenchMOS™ standard-level power MOSFET family, engineered specifically for high-current, low-voltage switching in harsh automotive environments where reliability, thermal efficiency, and avalanche ruggedness are mandatory.
FAQ
What is the maximum continuous drain current rating for the BUK7605-30A?
The BUK7605-30A is rated for 75 A continuous drain current (ID) at mounting base temperature (Tmb) of 25 °C. This rating decreases with rising temperature-derating to approximately 50 A at Tmb = 100 °C per the normalized current derating curve in the datasheet. The actual usable current depends on PCB copper area, heatsinking, and ambient conditions.
Does the BUK7605-30A require a gate resistor for safe switching?
Yes, a gate resistor is recommended to control dV/dt and prevent oscillation during switching. The datasheet specifies test conditions using RG = 10 Ω for dynamic parameter measurements. For most 24 V automotive applications, a 10–47 Ω series gate resistor balances switching speed and EMI suppression. Lower values increase peak gate current and risk ringing; higher values slow switching and raise conduction time losses.
Can the BUK7605-30A be used in a high-side switch configuration?
Yes, the BUK7605-30A can operate as a high-side switch, but requires a gate drive voltage ≥10 V referenced to the source (i.e., floating gate driver or charge pump). Its standard-level gate threshold (2–4 V) and 20 V maximum ±VGS rating make it compatible with common 12 V or 15 V high-side drivers. Layout must minimize source inductance (Ls = 7.5 nH) to avoid shoot-through during transitions.
What is the significance of the 500 mJ avalanche energy rating for the BUK7605-30A?
The 500 mJ unclamped inductive avalanche energy (WDSS) means the BUK7605-30A can safely absorb single-pulse inductive energy up to that level without failure-critical for automotive load-dump events or relay coil de-energization. This rating is measured under strict conditions (ID = 75 A, VDD ≤ 25 V, VGS = 10 V) and does not imply repetitive avalanche capability. System design must still limit event frequency and magnitude.
Is the BUK7605-30A RoHS compliant and halogen-free?
Yes, the BUK7605-30A manufactured by NXP meets RoHS Directive 2011/65/EU and is halogen-free per IEC 61249-2-21. The plastic package conforms to UL94 V0 flammability rating, and the device is supplied in anti-static packaging. Full compliance documentation-including material declarations and test reports-is available through NXP's official product page and authorized distributors.
BUK7605-30A,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 6000 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 230W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
BUK7605-30A,118 FAQ
1.How can I place an order for BUK7605-30A,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7605-30A,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7605-30A,118 reliable?
The price and inventory of BUK7605-30A,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7605-30A,118 is usually 5 days.
3.What payment methods are accepted for BUK7605-30A,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7605-30A,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7605-30A,118?
BUK7605-30A,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7605-30A,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7605-30A,118?
For technical support, including BUK7605-30A,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7605-30A,118 requirements.
6.How does Aetrix verify that BUK7605-30A,118 is sourced from the original manufacturer or authorized distributors?
All BUK7605-30A,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7605-30A,118 meets industry standards.
7.What is the process for return or replacement of BUK7605-30A,118?
All BUK7605-30A,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7605-30A,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7605-30A,118 part is unused and in its original packaging.
Return procedure for BUK7605-30A,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK7605-30A,118 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
