Nexperia USA Inc. BUK7618-55,118

Overview

BUK7618-55 from Nexperia is an AEC-Q101-qualified N-channel TrenchMOS FET in D2PAK (SOT404) package, designed for automotive power switching. It delivers 57 A continuous drain current at 25 °C mounting base temperature, 55 V drain-source voltage rating, and 15 mΩ typical R_DS(on) at V_GS = 10 V and T_j = 25 °C - enabling high-efficiency 12 V/24 V battery-fed motor control and load management.

For engineers reviewing the BUK7618-55 datasheet, BUK7618-55 pinout, BUK7618-55 application, or BUK7618-55 equivalent, this device is selected for its avalanche ruggedness (125 mJ), electrostatic robustness (2 kV HBM), and thermal performance (1.2 K/W R_th(j-mb)) in under-hood automotive modules requiring reliable high-current switching.

Technical Context

This standard-level MOSFET uses trench gate technology to achieve low on-resistance while maintaining robust gate oxide integrity and fast switching dynamics. Its gate threshold voltage (2–4 V at T_j = 25 °C) ensures compatibility with 3.3 V and 5 V logic-level drivers without level-shifting circuitry.

The integrated source-drain diode supports freewheeling in inductive loads, with 0.95 V forward voltage at 25 A and 48 ns reverse recovery time. Thermal design leverages the exposed mounting base (connected to drain) for direct heatsink attachment, enabling stable operation up to 175 °C junction temperature.

Key Specifications

Pinout & Package

Package: D2PAK (SOT404), plastic single-ended surface-mounted package with exposed metal mounting base electrically connected to drain. Dimensions per IEC/JEDEC outline: 15.8 × 10.3 × 4.5 mm (L × W × H), lead pitch 2.54 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive power switching applications.

Compared with STP110N55F7 and IRF1404ZPBF, the BUK7618-55 trades absolute current headroom for automotive qualification, D2PAK thermal efficiency, and guaranteed avalanche ruggedness - making it the preferred choice for production ECU designs where reliability, thermal density, and compliance are mandatory.

Availability

BUK7618-55 is available at Aetrix Electronics and suitable for automotive engine control, HVAC motor drives, and battery disconnect systems requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant traceability.

Supply support for BUK7618-55 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD-protected components.

The BUK7618-55 belongs to Nexperia's TrenchMOS automotive power portfolio, engineered specifically for under-hood switching applications demanding AEC-Q101 compliance, low R_DS(on), and robust thermal performance in compact surface-mount packages.

FAQ

Is the BUK7618-55 suitable for high-frequency PWM applications above 100 kHz?

Yes - with 15–22 ns turn-on delay, 30–60 ns rise time, and 35–50 ns turn-off delay, the BUK7618-55 supports PWM frequencies up to 200 kHz in motor control and DC-DC converter topologies. Its 1500–2000 pF C_iss and 170–250 pF C_rss enable efficient gate driving using standard 1 A peak drivers without excessive losses.

What is the maximum allowable mounting base temperature for continuous operation?

The maximum continuous mounting base temperature is 100 °C, beyond which drain current must be linearly derated to 40 A (per Table 4). At T_mb = 100 °C, the device maintains full 55 V V_DS rating and retains 125 mJ avalanche energy capability, provided junction temperature remains ≤175 °C.

Does the mounting base require electrical isolation from the heatsink?

No - the mounting base is electrically connected to the drain terminal, so heatsink isolation is required only if the heatsink is at a different potential than the drain node. In low-side configurations, the heatsink must be isolated; in high-side or floating configurations, direct thermal contact without electrical isolation is permissible and recommended.

Can the BUK7618-55 replace older BUK7618-55A or BUK7618-55B variants?

Yes - the BUK7618-55 (Rev. 2, 2011) supersedes earlier revisions with identical pinout, electrical specs, and package. No design changes or layout modifications are needed for drop-in replacement; all limiting values, thermal characteristics, and qualification status remain unchanged per the official Nexperia product change notice.