My Inquiry
My Account
Nexperia USA Inc. BUK762R6-40E,118
- Part No.:
- BUK762R6-40E,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
BUK762R6-40E,118.pdf
- Description:
- MOSFET N-CH 40V 100A D2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:3,985
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK762R6-40E from Nexperia is a standard-level N-channel TrenchMOS FET in SOT404 (D2PAK) package, rated for 40 V VDS, 100 A continuous drain current at Tmb = 25 °C, and 2.2 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C. It is AEC-Q101 qualified and designed for high-reliability automotive power switching including start-stop micro-hybrid systems.
For engineers reviewing the BUK762R6-40E datasheet, BUK762R6-40E pinout, BUK762R6-40E application, or BUK762R6-40E equivalent, key selection criteria include its 175 °C junction rating, repetitive avalanche capability, true standard-level gate drive (VGS(th) > 1 V at 175 °C), and thermal resistance of 0.57 K/W from junction to mounting base.
Technical Context
This MOSFET employs TrenchMOS technology to achieve low on-resistance and robust switching performance under thermally demanding conditions. Its gate threshold voltage remains functional up to 175 °C, enabling reliable operation in engine bay environments without requiring elevated gate drive.
The device features integrated source-drain diode with 39.5 ns reverse recovery time and 45.9 nC recovered charge, supporting fast commutation in inductive load control. Its 5350 pF typical input capacitance and 35 nC gate-drain charge support predictable turn-on/turn-off timing with external gate resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V maximum - supports 12 V automotive systems with margin against load dump transients |
| RDS(on) | 2.2 mΩ typ @ VGS = 10 V, Tj = 25 °C - enables <1 W conduction loss at 50 A |
| ID cont. | 100 A @ Tmb = 25 °C - limited by package thermal capacity, not silicon |
| Tj max | 175 °C - qualified for under-hood automotive use per AEC-Q101 |
| Rth(j-mb) | 0.57 K/W - enables high-power dissipation when mounted on copper heatsink |
| QGD | 35 nC - determines Miller plateau duration and switching loss sensitivity to gate drive strength |
| EAS | 574 mJ non-repetitive avalanche energy - provides single-pulse fault tolerance in inductive switching |
Pinout & Package
SOT404 (D2PAK) plastic single-ended surface-mounted package with 3 leads (one lead cropped); mounting base (mb) is electrically connected to drain and serves as primary thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G | Gate terminal - accepts standard 10 V logic-level drive; threshold >1 V at 175 °C ensures turn-on stability |
| 2 | D | Drain terminal - internally bonded to mounting base; carries full load current and dissipates heat via PCB copper |
| 3 | S | Source terminal - reference node for gate drive and current sensing; low-inductance layout critical for EMI control |
| mb | Mounting base | Drain-connected thermal interface - must be soldered to ≥100 mm² copper pour for rated power handling |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive-grade reliability across temperature cycling, humidity, and mechanical shock |
| Repetitive avalanche rating | Enables robust operation in inductive switching without external snubbers in motor/solenoid control |
| 175 °C junction rating | Supports direct placement near heat sources (e.g., transmission control units) without derating |
| True standard-level gate | VGS(th) > 1 V at 175 °C ensures gate remains fully enhanced even at peak operating temperature |
| Low QGD/QG ratio | 35 nC / 107 nC ≈ 0.33 - improves switching efficiency and reduces susceptibility to dv/dt-induced turn-on |
Applications
| Engine Start-Stop Control | Transmission Solenoid Driver |
|---|---|
|
Use Scenario: High-current switching of starter motor solenoid during automatic engine restart in micro-hybrid vehicles. IC Role / Device Role / Timing Role: Main power switch controlling 12 V battery-to-solenoid path; handles 100 A pulses with <100 µs turn-on. Use Value: 2.2 mΩ RDS(on) limits I²R loss to <22 W at 100 A, reducing thermal stress versus higher-RDS(on) alternatives. |
Use Scenario: PWM-controlled hydraulic pressure modulation in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Low-side driver for 12 V solenoid coils requiring precise 1–20 kHz switching and fast fall time (<36 ns). Use Value: 36 ns fall time and 62 ns turn-off delay enable accurate duty-cycle control without coil current overshoot. |
| Electric Power Steering (EPS) Motor Phase Switch | Body Control Module Lamp Driver |
|
Use Scenario: Half-bridge phase leg in 12 V EPS motor inverter, switching up to 80 A peak current. IC Role / Device Role / Timing Role: High-side or low-side switching element; operates with synchronous rectification and 175 °C ambient exposure. Use Value: 0.57 K/W Rth(j-mb) allows direct heatsinking to aluminum housing, eliminating need for isolated thermal pads. |
Use Scenario: On/off control of LED headlamps and interior lighting in body control modules. IC Role / Device Role / Timing Role: Robust load switch replacing electromechanical relays; handles inrush and hot-swap events. Use Value: 574 mJ avalanche energy absorbs inductive kickback from lamp filaments without clamping diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 220 A, RDS(on) = 1.4 mΩ @ 10 V, Tj = 25 °C; PowerFLAT 5x6 package; lower RDS(on) but higher QG (140 nC) | Better conduction efficiency at >150 A, but requires stronger gate driver and larger PCB area | Select when system prioritizes ultra-low conduction loss over gate drive simplicity and thermal footprint |
| IRFB4115PBF | 150 V, 115 A, RDS(on) = 4.5 mΩ @ 10 V, Tj = 25 °C; TO-220AB; not AEC-Q101 qualified | Higher voltage margin for 24 V commercial vehicles, but lacks automotive qualification and thermal performance | Select only for non-automotive industrial 12–24 V systems where qualification is not required |
Compared with STL220N4F7AG and IRFB4115PBF, BUK762R6-40E delivers optimal balance of AEC-Q101 compliance, 2.2 mΩ conduction loss, and 0.57 K/W thermal resistance in a surface-mount D2PAK - making it ideal for space-constrained, thermally aggressive automotive modules where qualification and reliability are mandatory.
Availability
BUK762R6-40E is available at Aetrix Electronics and suitable for automotive start-stop systems, transmission control units, and electric power steering modules requiring stable component supply across multi-year production cycles.
Supply support for BUK762R6-40E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.
BUK762R6-40E belongs to Nexperia's TrenchMOS automotive power portfolio, engineered specifically for thermally demanding 12 V vehicle subsystems requiring AEC-Q101 compliance and repetitive avalanche ruggedness.
FAQ
Is BUK762R6-40E suitable for 24 V systems?
No - its absolute maximum VDS is 40 V, with recommended operation limited to ≤16 V DC in 24 V nominal systems due to load dump transients exceeding 35 V. It is explicitly designed for 12 V automotive architectures per AEC-Q101 test conditions and thermal derating curves.
What is the role of the mounting base (mb) in thermal design?
Mounting base is electrically connected to drain and serves as the primary thermal conduction path from die to PCB. To achieve rated 263 W power dissipation, it must be soldered to ≥100 mm² of 2 oz copper with thermal vias to internal planes - omitting this reduces usable power by >60%.
Does BUK762R6-40E require a gate resistor for safe operation?
Yes - a 5 Ω external gate resistor is used in the datasheet's SOA and avalanche test conditions (Fig. 3, Fig. 4). Omitting it increases dv/dt-induced turn-on risk and can cause oscillation due to 2.5 nH internal drain inductance interacting with gate loop inductance.
Can the source-drain diode replace an external freewheeling diode?
Yes - its 39.5 ns trr and 45.9 nC Qr support efficient flyback in solenoid/motor control, but only when operated within its 100 A continuous and 920 A pulsed current ratings. Layout must minimize source inductance (<7.5 nH) to avoid voltage overshoot during recovery.
BUK762R6-40E,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 2.6mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 91 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 7130 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 263W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
BUK762R6-40E,118 FAQ
1.How can I place an order for BUK762R6-40E,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK762R6-40E,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK762R6-40E,118 reliable?
The price and inventory of BUK762R6-40E,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK762R6-40E,118 is usually 5 days.
3.What payment methods are accepted for BUK762R6-40E,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK762R6-40E,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK762R6-40E,118?
BUK762R6-40E,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK762R6-40E,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK762R6-40E,118?
For technical support, including BUK762R6-40E,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK762R6-40E,118 requirements.
6.How does Aetrix verify that BUK762R6-40E,118 is sourced from the original manufacturer or authorized distributors?
All BUK762R6-40E,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK762R6-40E,118 meets industry standards.
7.What is the process for return or replacement of BUK762R6-40E,118?
All BUK762R6-40E,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK762R6-40E,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK762R6-40E,118 part is unused and in its original packaging.
Return procedure for BUK762R6-40E,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK762R6-40E,118 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
