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Nexperia USA Inc. BUK762R7-30B,118

Part No.:
BUK762R7-30B,118
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixBUK762R7-30B,118.pdf
Description:
MOSFET N-CH 30V 75A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,949

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Product details

Overview

BUK762R7-30B from Nexperia is a standard-level N-channel TrenchMOS FET in D2PAK (SOT404) package, rated for 30 V VDS, 2.3 mΩ RDS(on) at 25 °C/10 V, and 75 A continuous drain current at Tmb = 25 °C. It features AEC-Q101 qualification, 175 °C junction temperature rating, and unclamped avalanche energy of 2.3 J - designed for automotive 12 V power switching including motors, lamps, and solenoids.

For engineers reviewing the BUK762R7-30B datasheet, BUK762R7-30B pinout, BUK762R7-30B application, or BUK762R7-30B equivalent, key selection criteria include gate drive compatibility with standard 10 V logic, thermal performance under mounting base cooling, RDS(on) stability across -55 to 175 °C, and avalanche ruggedness in inductive load commutation.

Technical Context

This device employs TrenchMOS technology to achieve low conduction losses and high thermal robustness. Its gate threshold voltage ranges from 2–4 V at 25 °C and remains functional down to 1 V at 175 °C, enabling reliable turn-on under elevated temperature conditions typical in engine bay environments.

The integrated source-drain diode exhibits 0.85–1.2 V forward voltage at 40 A and 25 °C, with 88 ns reverse recovery time and 132 nC recovered charge - critical for synchronous rectification and freewheeling behavior in DC motor drives and solenoid control circuits.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V maximum drain-source voltage - defines safe operating range for 12 V automotive systems with load dump transients.
RDS(on) 2.3 mΩ typical at VGS = 10 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 75 A, reducing heatsink requirements.
ID (cont) 75 A continuous drain current at Tmb = 25 °C - limited by package thermal capability, not die rating.
EAS 2.3 J non-repetitive avalanche energy - supports robust operation during inductive kickback without external snubbers.
Tj max 175 °C maximum junction temperature - qualified for under-hood automotive applications per AEC-Q101.
Rth(j-mb) 0.5 K/W thermal resistance from junction to mounting base - enables efficient heat transfer to PCB copper or heatsink.
QGD 29 nC gate-drain charge - determines Miller plateau duration and influences switching speed in hard-switched topologies.

Pinout & Package

Package: D2PAK (SOT404), plastic single-ended surface-mounted package with 3 leads (one lead cropped); mounting base electrically connected to drain.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal; requires 10 V for full enhancement; threshold 2–4 V at 25 °C ensures compatibility with standard logic drivers.
2 (D) Drain Main power input; internally connected to mounting base - must be thermally and electrically coupled to PCB copper pour or heatsink.
3 (S) Source Power return path and reference for gate drive; internal source inductance 7.5 nH affects high-speed switching ringing.

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive safety-critical applications including engine control and body electronics.
175 °C junction rating Enables operation in high-temperature zones (e.g., near exhaust, under hood) without derating beyond datasheet limits.
Low RDS(on) (2.3 mΩ) Reduces I²R losses in high-current 12 V loads, improving system efficiency and thermal margin.
Unclamped avalanche rated Withstands 2.3 J energy during inductive turn-off events - eliminates need for external clamping in many solenoid/motor designs.
Standard-level gate drive Operates fully enhanced with 10 V gate-source voltage - compatible with common microcontroller GPIOs and discrete driver ICs.

Applications

Automotive Door Lock Actuator Engine Cooling Fan Control

Use Scenario: Driving 12 V DC brushed motor for door lock/unlock cycles with frequent bidirectional pulsing.

IC Role / Device Role / Timing Role: High-side or low-side power switch handling peak currents up to 967 A for <10 µs pulses during motor stall.

Use Value: Avalanche ruggedness (2.3 J) absorbs back-EMF during abrupt direction reversal; 175 °C rating ensures reliability in sealed door modules.

Use Scenario: PWM-controlled 12 V cooling fan in engine compartment exposed to ambient temperatures up to 125 °C.

IC Role / Device Role / Timing Role: Low-side switching element modulated at 1–20 kHz with 75 A continuous current capability.

Use Value: 0.5 K/W Rth(j-mb) allows direct mounting to aluminum heatsink; RDS(on) stability over temperature minimizes PWM duty cycle drift.

Truck Headlamp Dimming Circuit Commercial Vehicle Air Suspension Solenoid

Use Scenario: Proportional current control of halogen headlamp filaments using linear or PWM regulation.

IC Role / Device Role / Timing Role: Power transistor operating in linear region during dimming transitions, dissipating up to 300 W transiently.

Use Value: Total power dissipation rating of 300 W at Tmb = 25 °C supports short-duration linear operation without thermal shutdown.

Use Scenario: On/off control of 24 V solenoid valves in air suspension systems with high inductance and mechanical shock exposure.

IC Role / Device Role / Timing Role: Low-side switch managing 75 A steady-state current and absorbing unclamped inductive energy on turn-off.

Use Value: QGD = 29 nC and fast switching times (tf = 118 ns) reduce transition losses; AEC-Q101 certification validates vibration/shock resilience.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N3LLH6 30 V, 2.2 mΩ RDS(on), 220 A peak, H2PAK-2 package, 1.2 K/W Rth(j-a) Higher peak current but larger footprint; optimized for PCB space-constrained industrial inverters, not automotive mounting base interface. Select when higher pulse current and lower RDS(on) outweigh package compatibility and AEC-Q101 requirement.
IRF1404ZPBF 40 V, 4.7 mΩ RDS(on), TO-220AB package, no AEC-Q101 qualification, 62 K/W Rth(j-a) Wider VDS margin but double RDS(on); lacks automotive qualification and thermal performance for sustained 75 A operation. Acceptable only for non-automotive 12 V systems with forced-air cooling and infrequent switching.

Compared with STL220N3LLH6 and IRF1404ZPBF, BUK762R7-30B uniquely balances AEC-Q101 compliance, D2PAK mounting base thermal interface, and 2.3 mΩ RDS(on) - making it the only option qualified for thermally demanding, safety-critical automotive power switching where board-level heatsinking is constrained.

Availability

BUK762R7-30B is available at Aetrix Electronics and suitable for automotive body electronics, engine management subsystems, and commercial vehicle power distribution requiring stable component supply across extended product lifecycles.

Supply support for BUK762R7-30B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors for automotive, industrial, and consumer markets.

BUK762R7-30B belongs to Nexperia's TrenchMOS automotive-qualified power MOSFET family, engineered specifically for robust 12 V load switching in harsh thermal and electrical environments.

FAQ

Is BUK762R7-30B suitable for high-frequency PWM switching above 100 kHz?

No - its QG(tot) = 91 nC and QGD = 29 nC result in relatively high gate drive power requirements. At 100 kHz, typical gate driver losses exceed 1 W with 10 V drive, and switching times (tr = 107 ns, tf = 118 ns) limit practical use to ≤50 kHz in hard-switched applications without active gate control optimization.

Can BUK762R7-30B be used in a high-side configuration with 12 V supply?

Yes, but requires a gate driver capable of providing ≥10 V referenced to the drain potential. The device is not a level-shifted or integrated high-side solution; standalone use in high-side topology demands isolated or bootstrap gate drive circuitry to maintain VGS ≥10 V during conduction.

What is the maximum allowable PCB copper area for thermal performance?

The datasheet specifies thermal performance assuming "minimum footprint" for Rth(j-a) = 50 K/W. For optimal mounting base cooling, Nexperia recommends ≥10 cm² of 2 oz copper connected directly to the drain pad via multiple thermal vias - achieving Rth(j-mb) ≈ 0.5 K/W and supporting full 75 A continuous current at Tmb ≤ 25 °C.

Does BUK762R7-30B have integrated ESD protection?

No - it has no built-in ESD protection diodes. Gate oxide withstands ±20 V VGS, but human-body-model ESD events >2 kV can cause latent damage. External TVS or RC filtering on gate traces is required in production assemblies, especially in automotive assembly lines with high static potential.

BUK762R7-30B,118 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
TrenchMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
75A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.7mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
91 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
6212 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

BUK762R7-30B,118 FAQ

1.How can I place an order for BUK762R7-30B,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK762R7-30B,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK762R7-30B,118 reliable?

The price and inventory of BUK762R7-30B,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK762R7-30B,118 is usually 5 days.

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Once your BUK762R7-30B,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK762R7-30B,118?

For technical support, including BUK762R7-30B,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK762R7-30B,118 requirements.

6.How does Aetrix verify that BUK762R7-30B,118 is sourced from the original manufacturer or authorized distributors?

All BUK762R7-30B,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK762R7-30B,118 meets industry standards.

7.What is the process for return or replacement of BUK762R7-30B,118?

All BUK762R7-30B,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK762R7-30B,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK762R7-30B,118 part is unused and in its original packaging.

Return procedure for BUK762R7-30B,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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