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NXP Semiconductors BUK764R3-40B,118

Part No.:
BUK764R3-40B,118
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixBUK764R3-40B,118.pdf
Description:
MOSFET N-CH 40V 75A D2PAK
Quantity:
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Payment
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Inventory:7,959

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Product details

Overview

BUK764R3-40B from Nexperia is an AEC-Q101-qualified N-channel TrenchMOS standard-level power MOSFET in D2PAK (SOT404) package, designed for automotive 12 V load switching. It delivers 75 A continuous drain current at Tmb = 25 °C, features 4.3 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C, and supports junction temperatures up to 175 °C - enabling robust operation in engine bay and body control modules.

For engineers reviewing the BUK764R3-40B datasheet, BUK764R3-40B pinout, BUK764R3-40B application, or BUK764R3-40B equivalent, this page provides verified specifications, thermal performance data, gate drive compatibility notes, avalanche energy rating (961 mJ), and validated alternatives for automotive power switching design-in.

Technical Context

This MOSFET uses TrenchMOS technology to achieve low on-state resistance while maintaining standard-level gate drive compatibility (VGS(th) = 2–4 V, max gate voltage ±20 V). Its 40 V VDS rating and 75 A package-limited continuous current make it suitable for 12 V automotive systems where high-current loads require thermally resilient switching.

The device integrates a source-drain diode with 0.85–1.2 V forward voltage at 25 A and exhibits 68 ns reverse recovery time. Its thermal resistance from junction to mounting base is 0.59 K/W, enabling efficient heatsinking in compact automotive PCB layouts without forced airflow.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum drain-source blocking voltage; compatible with 12 V automotive battery systems including load dump transients.
RDS(on) 3.8–4.3 mΩ (typ/max @ VGS = 10 V, ID = 25 A, Tj = 25 °C) - Enables <1 W conduction loss at 75 A, reducing thermal stress in high-current paths.
ID (cont) 75 A @ Tmb = 25 °C - Package-limited continuous current; derates to 176 A peak (10 µs pulse) for solenoid or motor inrush handling.
EAS 961 mJ (unclamped avalanche) - Supports robust operation during inductive load switching without external snubbers in automotive applications.
Tj max 175 °C - Qualified for under-hood environments; enables reliable operation without active cooling in space-constrained ECUs.
Rth(j-mb) 0.59 K/W - Low thermal resistance to mounting base allows direct heatsink attachment for efficient power dissipation in high-power switching nodes.
QG(tot) 69 nC - Gate charge optimized for standard 10 V gate drivers; enables fast turn-on/turn-off with minimal driver power consumption.

Pinout & Package

Package: D2PAK (SOT404), plastic single-ended surface-mounted package with 3 leads (one lead cropped); mounting base electrically connected to drain terminal.

Pin/Terminal Circuit Role Design Meaning
1 G (gate) Control input; requires 10 V for full enhancement; threshold voltage 2–4 V enables compatibility with standard microcontroller GPIOs.
2 D (drain) Main power output; internally connected to mounting base - must be isolated from PCB ground unless drain-referenced topology is used.
3 S (source) Power return path; referenced to system ground in low-side switch configurations; carries full load current and influences gate drive loop integrity.

Key Features

Feature Design Value
AEC-Q101 qualification Validated for automotive critical applications including engine control, lighting, and body electronics per industry reliability standards.
175 °C junction rating Enables uninterrupted operation in high-ambient environments such as near engines or exhaust systems without thermal shutdown.
Low RDS(on) (3.8 mΩ typ) Reduces conduction losses by >30% vs. comparable 40 V MOSFETs, lowering board temperature rise and improving system efficiency.
Standard-level gate drive Operates fully enhanced with 10 V gate voltage - eliminates need for level-shifters or dedicated gate drivers in 12 V systems.
961 mJ avalanche energy Withstands unclamped inductive switching events common in motor and solenoid control, reducing external protection component count.

Applications

Automotive Body Control Module 12 V DC Motor Drive

Use Scenario: Switching headlamps, HVAC actuators, and door locks in modern vehicle body control units.

IC Role / Device Role / Timing Role: Low-side power switch controlling 12 V loads with PWM dimming or timed actuation.

Use Value: 75 A rating and 175 °C operation ensure stable switching across wide ambient temperature ranges (-40 °C to +125 °C ambient).

Use Scenario: Driving brushed DC motors in power seats, sunroofs, and window lift mechanisms.

IC Role / Device Role / Timing Role: High-current, bidirectional (with external diode) or unidirectional motor driver in H-bridge or half-bridge topologies.

Use Value: 961 mJ avalanche ruggedness absorbs back-EMF spikes during motor commutation, eliminating need for discrete flyback diodes in many designs.

Automotive Lighting Control Engine Bay Solenoid Driver

Use Scenario: Controlling LED headlamp arrays and halogen fog lamps via PWM-based brightness regulation.

IC Role / Device Role / Timing Role: High-efficiency, thermally stable switch delivering precise current control with minimal thermal drift.

Use Value: 4.3 mΩ RDS(on) limits power loss to <2.5 W at 75 A, supporting compact heatsink integration directly on PCB copper pour.

Use Scenario: Activating fuel injectors, turbocharger wastegate actuators, and transmission solenoids in engine management systems.

IC Role / Device Role / Timing Role: Fast-switching, high-reliability power stage handling repetitive 10–100 ms pulses with high peak currents.

Use Value: 706 A peak drain current capability supports solenoid inrush demands while maintaining safe SOA margins at elevated junction temperatures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N4F7AG 40 V, 220 A (Tc = 25 °C), RDS(on) = 1.7 mΩ - higher current, lower RDS(on), but requires gate drive ≥12 V for full enhancement. Preferred for high-power solenoid or dual-motor applications where board space allows larger TO-263 package and higher gate voltage is available. Select when needing >100 A continuous current and can support 12 V gate drive; not drop-in due to different pinout and thermal footprint.
IRF1404ZPBF 40 V, 184 A (Tc = 25 °C), RDS(on) = 3.8 mΩ - similar on-resistance but lacks AEC-Q101 qualification and 175 °C rating. Suitable for industrial or consumer-grade 12 V switching where automotive qualification is not required. Use only in non-automotive applications; not recommended for safety-critical or high-temperature automotive use due to missing qualification and lower thermal margin.

Compared with STL220N4F7AG and IRF1404ZPBF, the BUK764R3-40B offers the unique combination of AEC-Q101 compliance, 175 °C operation, and standard 10 V gate drive - making it the only qualified option for thermally demanding automotive body and engine control functions without gate voltage overhead.

Availability

BUK764R3-40B is available at Aetrix Electronics and suitable for automotive body control modules, 12 V motor drives, lighting systems, and solenoid actuation requiring stable component supply and long-term lifecycle assurance.

Supply support for BUK764R3-40B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, spun off from NXP in 2017 and focused on automotive, industrial, computing, and consumer markets.

The BUK764R3-40B belongs to Nexperia's TrenchMOS automotive-qualified PowerMOS family, engineered specifically for high-reliability 12 V load switching in harsh thermal and electrical environments.

FAQ

What is the maximum continuous drain current for BUK764R3-40B at 100 °C mounting base temperature?

The BUK764R3-40B supports 75 A continuous drain current at Tmb = 100 °C, as specified in Table 4 (Limiting Values) of the datasheet. This value is package-limited and remains constant across Tmb = 25 °C to 100 °C, with further derating beyond that point per Figure 1. The BUK764R3-40B maintains stable conduction performance in thermally constrained automotive locations such as fuse boxes or ECU enclosures.

Is BUK764R3-40B suitable for use with 5 V microcontroller GPIOs without a gate driver?

No - the BUK764R3-40B is a standard-level MOSFET with VGS(th) = 2–4 V and requires 10 V gate drive for full enhancement and minimal RDS(on). At 5 V, RDS(on) increases significantly (see Figure 6), causing excessive conduction loss and thermal risk. A gate driver or level shifter is required when using 5 V controllers. The BUK764R3-40B is optimized for 10 V gate sources like automotive 12 V rails or dedicated driver ICs.

Does BUK764R3-40B have integrated avalanche protection, and what is its rated energy?

Yes - the BUK764R3-40B is rated for 961 mJ non-repetitive drain-source avalanche energy (EDS(AL)S) under defined test conditions (ID = 75 A, Vsup ≤ 40 V, RGS = 50 Ω, Tj(init) = 25 °C, unclamped). This ruggedness enables reliable inductive load switching in automotive applications without external clamping components. The BUK764R3-40B leverages TrenchMOS process stability to sustain repeated avalanche events within datasheet limits.

What is the thermal resistance from junction to mounting base for BUK764R3-40B, and how does it impact heatsinking?

The BUK764R3-40B has Rth(j-mb) = 0.59 K/W (max), measured from silicon junction to the exposed mounting base (pin 2/drain). This low value allows direct mechanical and thermal attachment to an external heatsink, enabling >200 W power dissipation with modest ΔT. In practice, the BUK764R3-40B achieves full 254 W Ptot only when the mounting base is actively cooled; passive PCB copper alone yields ~40 W. Proper thermal interface material and mounting pressure are essential for achieving the rated Rth.

Can BUK764R3-40B be used in high-frequency PWM applications above 100 kHz?

Yes - the BUK764R3-40B has QG(tot) = 69 nC and fast switching times (td(on) = 27 ns, tf = 65 ns), supporting PWM frequencies up to 200 kHz in well-designed gate drive circuits. However, switching losses increase significantly above 100 kHz due to QGD = 22 nC and Ciss = 3618–4824 pF. For optimal efficiency at high frequency, minimize gate loop inductance and use a 1–2 Ω series gate resistor. The BUK764R3-40B remains thermally viable in such applications when RDS(on) dominates conduction loss and layout minimizes dynamic loss contributors.

BUK764R3-40B,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
TrenchMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
75A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
4.3mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
69 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4824 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
254W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

BUK764R3-40B,118 FAQ

1.How can I place an order for BUK764R3-40B,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK764R3-40B,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of BUK764R3-40B,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK764R3-40B,118 is usually 5 days.

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5.How can I obtain technical support or documentation for BUK764R3-40B,118?

For technical support, including BUK764R3-40B,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK764R3-40B,118 requirements.

6.How does Aetrix verify that BUK764R3-40B,118 is sourced from the original manufacturer or authorized distributors?

All BUK764R3-40B,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK764R3-40B,118 meets industry standards.

7.What is the process for return or replacement of BUK764R3-40B,118?

All BUK764R3-40B,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK764R3-40B,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK764R3-40B,118 part is unused and in its original packaging.

Return procedure for BUK764R3-40B,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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