Nexperia USA Inc. BUK764R4-60E,118

Overview

BUK764R4-60E from Nexperia is a standard-level N-channel TrenchMOS FET in SOT404 (D2PAK) package, rated for 60 V V_DS, 100 A continuous drain current at T_mb = 25 °C, and 175 °C junction temperature. It features 3.23 mΩ typical R_DS(on) at V_GS = 10 V and ID = 25 A, repetitive avalanche rating, and AEC-Q101 qualification for automotive power switching.

For engineers reviewing the BUK764R4-60E datasheet, BUK764R4-60E pinout, BUK764R4-60E application, or BUK764R4-60E equivalent, this device is selected for high-current, thermally demanding 12 V automotive loads where gate drive simplicity (standard-level V_GS(th) > 1 V at 175 °C), ruggedness, and package thermal performance are critical.

Technical Context

This MOSFET uses TrenchMOS technology to achieve low R_DS(on) and high current density in a surface-mount D2PAK package with integrated mounting base connected to drain. Its true standard-level gate enables direct drive from 5 V or 3.3 V microcontrollers without level-shifting, while maintaining threshold stability up to 175 °C.

The device supports unclamped inductive switching with 273 mJ single-pulse avalanche energy and exhibits low dynamic parameters: 26.1 nC Q_GD, 82 nC Q_G(tot), and 39 ns t_r, enabling efficient high-frequency PWM control in motor and solenoid drivers.

Key Specifications

Pinout & Package

SOT404 (D2PAK) plastic single-ended surface-mounted package with isolated leads and integral copper mounting base electrically connected to drain. The mounting base provides low-thermal-resistance path to heatsink (R_th(j-mb) = 0.64 K/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Compared with STL220N6F7 and IRFB4115PBF, BUK764R4-60E uniquely combines AEC-Q101 compliance, standard-level gate drive, and D2PAK thermal performance-making it optimal for space-constrained, thermally aggressive automotive power stages where qualification and ease of drive are mandatory.

Availability

BUK764R4-60E is available at Aetrix Electronics and suitable for automotive start-stop systems, transmission control units, electric power steering modules, and HVAC blower drivers requiring stable component supply across extended vehicle lifecycles.

Supply support for BUK764R4-60E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with leadership in automotive-qualified components and advanced packaging.

BUK764R4-60E belongs to Nexperia's TrenchMOS automotive power portfolio, engineered specifically for high-current, high-temperature 12 V automotive power switching where AEC-Q101 compliance and thermal robustness are non-negotiable.

FAQ

Is BUK764R4-60E suitable for high-frequency PWM applications above 100 kHz?

Yes - with 39 ns rise time, 40 ns fall time, and 26.1 nC Q_GD, it supports efficient switching up to 200 kHz in hard-switched topologies. However, gate drive strength must deliver ≥2 A peak current to fully exploit these dynamics, and PCB layout must minimize source inductance (LS = 7.5 nH) to prevent oscillation.

What is the maximum continuous drain current at 100 °C mounting base temperature?

Per Figure 2 in the datasheet, the continuous drain current is capped at 100 A even at T_mb = 100 °C due to package limitation - not silicon derating. This reflects the thermal saturation of the D2PAK copper leadframe and mounting base, not junction temperature limits.

Can BUK764R4-60E be used in parallel configurations?

Yes - its positive temperature coefficient of R_DS(on) (normalized factor rises with T_j, Fig. 12) enables inherent current sharing. For stable paralleling, match gate drive loop inductance and use individual gate resistors (≥5 Ω) to damp oscillations; ensure identical PCB copper area and heatsinking per device.

Does the mounting base require electrical isolation from the heatsink?

No - the mounting base is electrically connected to the drain terminal (Pin 2). If the heatsink is grounded, a dielectric insulator (e.g., mica washer + thermal grease) is mandatory. Alternatively, use an isolated heatsink or design the mechanical mount to avoid unintended drain-to-chassis shorts.