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NXP Semiconductors BUK7E2R7-30B,127

Part No.:
BUK7E2R7-30B,127
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixBUK7E2R7-30B,127.pdf
Description:
MOSFET N-CH 30V 75A I2PAK
Quantity:
Payment:
Payment
Shipping:
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Inventory:6,391

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Product details

Overview

BUK7E2R7-30B from Nexperia is an AEC-Q101 qualified N-channel TrenchMOS standard-level power MOSFET in I2PAK (SOT226) package, rated for 30 V VDS, 2.3 mΩ RDS(on) at 10 V VGS and 25 A, and 175 °C junction temperature - designed for high-current 12 V automotive load switching including motors, lamps, and solenoids.

For engineers reviewing the BUK7E2R7-30B datasheet, BUK7E2R7-30B pinout, BUK7E2R7-30B application, or BUK7E2R7-30B equivalent, this page delivers verified electrical specs, thermal performance data, mounting-base–referenced thermal resistance (0.5 K/W), avalanche energy rating (2.3 J), and real-world design context for thermally demanding automotive power switching.

Technical Context

This device uses TrenchMOS technology to achieve low on-state resistance while maintaining robust gate oxide integrity and stable threshold voltage across -55 °C to +175 °C. Its standard-level gate drive compatibility (VGS(th) = 2–4 V typ.) enables direct interfacing with 5 V and 3.3 V microcontrollers without level-shifting.

The integrated source-drain diode supports freewheeling in inductive loads, with 0.85–1.2 V forward voltage at 40 A and 88 ns reverse recovery time. Its unclamped avalanche capability (2.3 J at 75 A) provides transient overvoltage resilience in motor-control and solenoid-drive circuits.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 30 V maximum drain-source voltage - defines safe operating ceiling for 12 V automotive systems with load-dump transients.
RDS(on) 2.3 mΩ typical at VGS = 10 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 75 A continuous current (package-limited).
ID (cont) 75 A at Tmb = 25 °C - continuous current rating constrained by I2PAK package thermal limits, not silicon.
EAS 2.3 J non-repetitive avalanche energy - supports reliable operation during inductive turn-off spikes without external snubbers.
Rth(j-mb) 0.5 K/W junction-to-mounting-base thermal resistance - enables high-power dissipation when mounted on heatsinked PCB copper or chassis.
VGS(th) 2–4 V typical threshold voltage - ensures full enhancement with standard logic-level gate drivers and avoids partial turn-on in noisy environments.
QG(tot) 91 nC total gate charge - determines required gate driver peak current for fast switching in PWM motor control (e.g., ~9 A for 10 ns rise time).

Pinout & Package

Package: I2PAK (SOT226), plastic single-ended TO-262 variant with isolated mounting base electrically connected to drain. Requires thermal interface material and mechanical clamping for optimal heat transfer.

Pin/Terminal Circuit Role Design Meaning
1 (G) Gate Control terminal; accepts standard-level 10 V drive; gate leakage <100 nA at ±20 V ensures low standby power.
2 (D) Drain Main high-side power path; internally bonded to mounting base - must be electrically isolated from PCB ground unless system topology requires drain-referenced heatsinking.
3 (S) Source Power return node; referenced to gate drive common; internal source inductance 7.5 nH affects high-speed switching ringing.
Mounting Base (mb) Drain Connection Electrically tied to drain pin; primary thermal path to heatsink; critical for achieving 0.5 K/W Rth(j-mb).

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive safety-critical applications including engine control, body electronics, and ADAS power stages.
175 °C junction rating Enables operation in under-hood environments without derating in ambient temperatures up to 125 °C.
Low RDS(on) × QG figure of merit 2.3 mΩ × 91 nC = 209 mΩ·nC - balances conduction and switching losses for high-efficiency 12 V DC-DC and motor drives.
Unclamped avalanche ruggedness 2.3 J energy handling allows safe operation during inductive flyback without external protection components.
Standard-level gate drive Operates fully enhanced with 5 V or 10 V logic sources - eliminates need for gate driver ICs in many microcontroller-based designs.

Applications

Automotive Body Control Module (BCM) 12 V Electric Power Steering (EPS) Auxiliary Loads

Use Scenario: Switching headlamps, fog lamps, and HVAC blowers in modern BCMs with CAN/LIN communication.

IC Role / Device Role / Timing Role: High-side load switch controlling up to 75 A resistive/inductive loads; driven by 5 V MCU GPIO with external pull-down.

Use Value: Low RDS(on) minimizes heat generation in confined BCM enclosures; 175 °C rating ensures reliability during prolonged lamp-on operation.

Use Scenario: Driving auxiliary solenoids and cooling fans in EPS systems where space and thermal margin are constrained.

IC Role / Device Role / Timing Role: Low-inductance power switch enabling fast PWM control (up to 20 kHz) with minimal EMI due to controlled dV/dt.

Use Value: 2.5 nH internal drain inductance and 7.5 nH source inductance reduce switching overshoot; avalanche rating handles solenoid flyback.

Commercial Vehicle Starter Relay Replacement Industrial 12 V DC Motor Control

Use Scenario: Solid-state replacement for electromechanical starter relays in trucks and buses, eliminating contact wear and bounce.

IC Role / Device Role / Timing Role: High-current (75 A continuous) main power switch activated via ignition signal; mounted directly to vehicle chassis for thermal sinking.

Use Value: Mounting base–to–drain connection enables direct bolt-down heatsinking; 0.5 K/W Rth(j-mb) sustains full current without forced air.

Use Scenario: Controlling brushed DC motors in warehouse automation equipment powered from 12 V battery banks.

IC Role / Device Role / Timing Role: H-bridge half-bridge switch with integrated body diode supporting bidirectional regenerative braking.

Use Value: 88 ns trr and 132 nC Qr enable efficient freewheeling with low diode conduction loss and reduced switching loss during commutation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N3LLH6 30 V, 2.2 mΩ RDS(on), 200 A pulsed, but only 150 °C Tj max and no AEC-Q101 qualification. Targeted at industrial/commercial motor drives, not automotive-critical systems. Select STL220N3LLH6 only if AEC-Q101 compliance is unnecessary and higher pulsed current is prioritized over thermal robustness.
IRF1404ZPBF 40 V, 4.7 mΩ RDS(on), 175 °C, but legacy planar MOSFET with higher QG (133 nC) and no automotive qualification. Suitable for general-purpose 12–24 V power switching where lower cost outweighs efficiency and qualification needs. Choose IRF1404ZPBF for cost-sensitive non-automotive designs accepting higher conduction loss and slower switching.

Compared with STL220N3LLH6 and IRF1404ZPBF, BUK7E2R7-30B uniquely combines AEC-Q101 qualification, 175 °C operation, 2.3 mΩ on-resistance, and 0.5 K/W thermal resistance - making it the only option among the three validated for thermally aggressive automotive power switching with zero derating at 125 °C ambient.

Availability

BUK7E2R7-30B is available at Aetrix Electronics and suitable for automotive body control modules, 12 V electric power steering auxiliary loads, and commercial vehicle starter relay replacements requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for BUK7E2R7-30B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and power MOSFET semiconductors, spun off from NXP in 2017 and focused on high-volume, high-reliability components for automotive, industrial, and computing markets.

The BUK7E2R7-30B belongs to Nexperia's TrenchMOS automotive-qualified power MOSFET family, engineered specifically for robust, low-loss 12 V load switching in harsh under-hood and chassis-mounted environments.

FAQ

What is the maximum continuous drain current for BUK7E2R7-30B at 100 °C mounting base temperature?

The BUK7E2R7-30B supports 75 A continuous drain current at Tmb = 25 °C, but this is package-limited and decreases with rising temperature. At Tmb = 100 °C, the normalized current drops to approximately 45 A per Figure 1 in the datasheet - confirming that thermal management of the mounting base is essential to sustain high current in real-world applications.

Is BUK7E2R7-30B suitable for high-frequency PWM motor control above 20 kHz?

Yes, BUK7E2R7-30B supports high-frequency PWM operation due to its 91 nC total gate charge and low output capacitance (Coss = 1691–2029 pF). With appropriate gate driver strength (e.g., >5 A peak), it achieves 107 ns rise time and 118 ns fall time, enabling clean switching up to 20–50 kHz in 12 V brushed DC motor control without excessive switching loss.

Does BUK7E2R7-30B have an integrated body diode, and what are its key parameters?

Yes, BUK7E2R7-30B includes an integrated source-drain diode optimized for freewheeling. At 40 A and 25 °C, VSD is 0.85–1.2 V; reverse recovery time trr is 88 ns with recovered charge Qr = 132 nC - enabling efficient inductive load commutation with minimal voltage overshoot when used with proper layout and gate control.

What is the gate-source voltage limit for BUK7E2R7-30B, and why does it matter for MCU interfacing?

The BUK7E2R7-30B has a VGS rating of ±20 V. Its VGS(th) range (2–4 V typ.) ensures reliable turn-on with standard 3.3 V or 5 V microcontroller outputs, while the ±20 V absolute maximum prevents gate oxide damage during transient coupling - critical in noisy automotive environments where ESD or load dump may induce gate spikes.

How does the mounting base connection affect PCB layout for BUK7E2R7-30B?

The mounting base of BUK7E2R7-30B is electrically connected to the drain (Pin 2), so PCB layout must isolate the base from ground planes unless the system design intentionally references the drain to chassis. Thermal vias under the base pad and solder mask-defined copper area are required to achieve the specified 0.5 K/W Rth(j-mb) - improper isolation or insufficient copper will cause thermal runaway at high current.

BUK7E2R7-30B,127 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
TrenchMOS™
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
75A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.7mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
91 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
6212 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
I2PAK

BUK7E2R7-30B,127 FAQ

1.How can I place an order for BUK7E2R7-30B,127 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK7E2R7-30B,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK7E2R7-30B,127 reliable?

The price and inventory of BUK7E2R7-30B,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7E2R7-30B,127 is usually 5 days.

3.What payment methods are accepted for BUK7E2R7-30B,127?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7E2R7-30B,127 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK7E2R7-30B,127?

BUK7E2R7-30B,127 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK7E2R7-30B,127 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK7E2R7-30B,127?

For technical support, including BUK7E2R7-30B,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7E2R7-30B,127 requirements.

6.How does Aetrix verify that BUK7E2R7-30B,127 is sourced from the original manufacturer or authorized distributors?

All BUK7E2R7-30B,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7E2R7-30B,127 meets industry standards.

7.What is the process for return or replacement of BUK7E2R7-30B,127?

All BUK7E2R7-30B,127 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7E2R7-30B,127, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK7E2R7-30B,127 part is unused and in its original packaging.

Return procedure for BUK7E2R7-30B,127:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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