My Inquiry
My Account
Nexperia USA Inc. BUK7K12-60EX
- Part No.:
- BUK7K12-60EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-1205, 8-LFPAK56
- Datasheet:
-
BUK7K12-60EX.pdf
- Description:
- MOSFET 2N-CH 60V 40A LFPAK56D
- Quantity:
- Payment:
- Shipping:
Inventory:8,652
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK7K12-60EX from Nexperia is a dual N-channel standard-level MOSFET in LFPAK56D (SOT1205) package, rated for 60 V VDS, 9.3 mΩ RDS(on) at 10 V VGS and 25 °C, and qualified to AEC-Q101 for automotive use. It integrates two independent power switches with true standard-level gate drive (VGS(th) > 1 V at 175 °C), repetitive avalanche rating, and 175 °C junction temperature capability - deployed in 12 V automotive motor, lamp, and solenoid control circuits.
For engineers reviewing the BUK7K12-60EX datasheet, BUK7K12-60EX pinout, BUK7K12-60EX application, or BUK7K12-60EX equivalent, key selection criteria include dual-channel thermal robustness, standard-level gate compatibility with legacy 5 V/12 V controllers, AEC-Q101 qualification status, and LFPAK56D's low Rth(j-mb) of 2.21 K/W for high-power-density automotive PCB layouts.
Technical Context
This dual MOSFET uses TrenchMOS technology to deliver matched channel characteristics across FET1 and FET2, with identical static and dynamic parameters including RDS(on) (7.64–9.3 mΩ typ/max at 10 V, 25 °C), QGD (11 nC), and Ciss (1761–2348 pF). Both channels share common thermal and electrical limits - maximum VDS = 60 V, continuous ID = 40 A (package-limited), and peak IDM = 228 A (10 µs pulse).
Its standard-level gate architecture enables direct drive from microcontrollers or logic-level drivers without level-shifting, while maintaining VGS(th) ≥ 1 V even at Tj = 175 °C - ensuring reliable turn-on under extreme thermal stress. The device supports repetitive avalanche operation up to EAS = 103 mJ per channel, validated per single-pulse test conditions (ID = 40 A, Vsup ≤ 60 V, Tj(init) = 25 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage; defines safe operating range in 12 V automotive systems with load-dump transients. |
| RDS(on) | 9.3 mΩ max at VGS = 10 V, ID = 10 A, Tj = 25 °C - Enables <1 W conduction loss at 30 A, critical for thermally constrained engine bay modules. |
| ID (continuous) | 40 A - Package-limited current per channel; determined by LFPAK56D's thermal performance and mounting base temperature. |
| QGD | 11 nC - Gate-drain charge governing switching speed and Miller-induced shoot-through risk in half-bridge configurations. |
| Rth(j-mb) | 2.21 K/W - Junction-to-mounting-base thermal resistance; enables >30 W dissipation with 65 °C temperature rise above heatsink. |
| VGS(th) | 1 V min at Tj = 175 °C - Ensures guaranteed turn-on with standard 5 V logic drivers under worst-case automotive thermal conditions. |
| EAS | 103 mJ - Non-repetitive avalanche energy per channel; supports robustness against inductive switching faults in solenoid/motor drives. |
Pinout & Package
LFPAK56D (SOT1205) is a thermally enhanced surface-mount package with exposed copper die-pad for low-inductance, high-current routing and superior heat transfer to PCB copper planes. Its 8-lead layout supports dual independent MOSFETs in a compact 4.7 × 5.3 mm footprint with 1.3 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of FET1 - connects to low-side return path; electrically isolated from S2 for independent channel control. |
| 2 | G1 | Gate terminal of FET1 - requires <34.2 nC total gate charge for full enhancement; sensitive to ESD and ringing. |
| 3 | S2 | Source terminal of FET2 - separate return node enabling dual-load or H-bridge topologies without shared source coupling. |
| 4 | G2 | Gate terminal of FET2 - independently controllable; matched timing and threshold to G1 ensures synchronized switching behavior. |
| 5, 6 | D2 | Drain terminals of FET2 - paralleled internally for lower inductance and higher current handling on D2 side. |
| 7, 8 | D1 | Drain terminals of FET1 - paralleled internally; provides symmetrical high-current output routing for both channels. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-channel integration | Two matched N-channel MOSFETs in one LFPAK56D package - reduces PCB area by ~40% vs discrete SO-8 solutions and eliminates inter-device parameter mismatch. |
| AEC-Q101 qualification | Validated for automotive-grade reliability including HTOL, TC, UHAST, and ESD - required for engine control, transmission, and body electronics deployment. |
| 175 °C junction rating | Enables operation in under-hood environments where ambient exceeds 125 °C - eliminates need for derating or external cooling in most 12 V applications. |
| Repetitive avalanche capability | Rated for repeated inductive energy clamping up to 103 mJ - protects against flyback voltage spikes during solenoid de-energization without external snubbers. |
| Standard-level gate drive | VGS(th) > 1 V at 175 °C - ensures compatibility with 3.3 V/5 V MCUs and avoids gate driver ICs in cost-sensitive automotive modules. |
Applications
| Engine Cooling Fan Control | Automatic Transmission Solenoid Driver |
|---|---|
|
Use Scenario: PWM-controlled 12 V DC brushless fan module mounted near engine block with ambient up to 125 °C. IC Role / Device Role / Timing Role: Dual N-channel switch providing high-side and low-side drive for fan motor commutation; replaces discrete MOSFET pairs. Use Value: LFPAK56D's 2.21 K/W Rth(j-mb) sustains 35 A continuous current at Tmb = 100 °C, eliminating forced-air cooling in fan ECU designs. |
Use Scenario: Precision current-regulated 12 V solenoid actuator in 8-speed automatic transmission valve body. IC Role / Device Role / Timing Role: Dual-channel switch delivering fast, matched turn-on/turn-off for pressure modulation valves requiring <100 ns timing accuracy. Use Value: Matched QGD (11 nC) and RDS(on) between FET1/FET2 minimize current imbalance and torque ripple during rapid duty-cycle transitions. |
| LED Headlamp Matrix Switching | Start-Stop System Load Management |
|
Use Scenario: High-brightness LED cluster (12 V, 5–10 A per segment) with adaptive beam shaping and thermal foldback. IC Role / Device Role / Timing Role: Dual-channel high-side switch controlling individual LED segments; operates in constant-current mode with PWM dimming. Use Value: 9.3 mΩ RDS(on) limits conduction loss to <0.5 W per segment at 7 A, enabling passive thermal management on multilayer headlamp PCBs. |
Use Scenario: Load shedding and battery protection circuit in 12 V start-stop system managing HVAC, infotainment, and lighting loads. IC Role / Device Role / Timing Role: Dual-channel power switch isolating non-critical loads during cranking; handles 40 A surges during engine restart. Use Value: 228 A peak drain current (10 µs) and 103 mJ avalanche energy ensure survival during 100 ms load dump events without external TVS diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | 60 V, 2.2 mΩ RDS(on), PowerFLAT 5x6 package, 175 °C rated, but single-channel only - requires two devices for dual functionality. | Higher efficiency per channel but larger board area and no intrinsic channel matching; lacks integrated dual configuration. | Select when lowest RDS(on) is prioritized over integration and thermal coupling between channels. |
| ON Semiconductor NTMFS5C675NL | 60 V, 5.8 mΩ RDS(on), SO-8 package, AEC-Q101 qualified, dual N-channel, but rated only to 150 °C junction temperature. | Lower thermal margin than BUK7K12-60EX - unsuitable for sustained operation above 150 °C ambient or high-power density layouts. | Select when cost sensitivity outweighs extreme thermal requirements and 175 °C operation is not mandated. |
Compared with STL220N6F7 and NTMFS5C675NL, BUK7K12-60EX uniquely delivers dual-channel integration, 175 °C operation, and AEC-Q101 qualification in a single LFPAK56D package - making it optimal for space-constrained, thermally aggressive automotive modules where channel matching and reliability are non-negotiable.
Availability
BUK7K12-60EX is available at Aetrix Electronics and suitable for automotive engine control units, transmission control modules, and LED headlamp systems requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.
Supply support for BUK7K12-60EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors - high-volume, high-reliability components for automotive, industrial, and consumer applications.
BUK7K12-60EX belongs to Nexperia's Automotive Logic and Power portfolio, engineered specifically for high-reliability 12 V automotive power switching - emphasizing thermal resilience, AEC-Q101 compliance, and integration for reduced system complexity.
FAQ
What is the maximum continuous drain current per channel at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current per channel is 40 A - capped by package thermal limits, not silicon capability. This value is confirmed in Figure 1 of the datasheet and applies identically to both FET1 and FET2 under VGS = 10 V bias and proper PCB copper pour.
Does BUK7K12-60EX support paralleling of its internal drain terminals, and how does that affect layout?
Yes - pins 5 & 6 are internally connected to D2, and pins 7 & 8 to D1, enabling low-inductance, high-current routing. Layout must use symmetric copper pours for each drain pair to balance current sharing; asymmetry causes uneven thermal stress and localized hot spots exceeding 175 °C junction limit.
Can BUK7K12-60EX be used in a synchronous buck converter topology?
No - it is not optimized for synchronous rectification due to lack of specified body diode reverse recovery time (trr) under hard-switching conditions and absence of dedicated gate drive timing specs for complementary switching. Its design targets switching loads like motors and solenoids, not high-frequency DC-DC conversion.
Is the gate threshold voltage guaranteed at elevated temperature, and what is the minimum value at 175 °C?
Yes - VGS(th) is guaranteed ≥ 1 V at Tj = 175 °C (per Table 7, ID = 1 mA, VDS = VGS). This ensures reliable turn-on with standard 5 V microcontroller outputs even under worst-case thermal stress, a key differentiator versus logic-level-only MOSFETs.
BUK7K12-60EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1205, 8-LFPAK56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 60V
- Current - Continuous Drain (Id) @ 25°C:
- 40A
- Rds On (Max) @ Id, Vgs:
- 9.3mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 34.2nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2348pF @ 25V
- Power - Max:
- 68W
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56D
BUK7K12-60EX FAQ
1.How can I place an order for BUK7K12-60EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7K12-60EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7K12-60EX reliable?
The price and inventory of BUK7K12-60EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7K12-60EX is usually 5 days.
3.What payment methods are accepted for BUK7K12-60EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7K12-60EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7K12-60EX?
BUK7K12-60EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7K12-60EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7K12-60EX?
For technical support, including BUK7K12-60EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7K12-60EX requirements.
6.How does Aetrix verify that BUK7K12-60EX is sourced from the original manufacturer or authorized distributors?
All BUK7K12-60EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7K12-60EX meets industry standards.
7.What is the process for return or replacement of BUK7K12-60EX?
All BUK7K12-60EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7K12-60EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7K12-60EX part is unused and in its original packaging.
Return procedure for BUK7K12-60EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK7K12-60EX Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
