Nexperia USA Inc. BUK7K18-40EX
- Part No.:
- BUK7K18-40EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-1205, 8-LFPAK56
- Datasheet:
-
BUK7K18-40EX.pdf
- Description:
- MOSFET 2N-CH 40V 24.2A LFPAK56D
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK7K18-40EX from Nexperia is a dual N-channel standard-level MOSFET in LFPAK56D (SOT1205) package, rated for 40 V drain-source voltage, 19 mΩ RDS(on) at 10 VGS/25 °C, and qualified to AEC-Q101 for automotive use. It integrates two independent power switches in one thermally robust package, enabling compact high-current switching in 12 V vehicle subsystems such as transmission control and lamp drivers.
For engineers reviewing the BUK7K18-40EX datasheet, BUK7K18-40EX pinout, BUK7K18-40EX application, or BUK7K18-40EX equivalent, key selection criteria include its 175 °C junction rating, repetitive avalanche capability, true standard-level gate threshold (>1 V at 175 °C), and dual-drain configuration optimized for space-constrained automotive PCB layouts.
Technical Context
This device implements TrenchMOS technology in a dual-die LFPAK56D package with shared mounting base, delivering low thermal resistance (Rth(j-mb) = 3.96 K/W) and high power density (38 W at Tmb = 25 °C). Its dual-channel architecture supports independent gate control (G1/S1/D1 and G2/S2/D2), enabling synchronous or complementary switching without cross-conduction risk.
The MOSFET features a robust 40 V VDS rating with 26.3 mJ non-repetitive avalanche energy, 127 A peak drain current, and stable RDS(on) performance up to 175 °C (30.5–37.4 mΩ). Gate charge parameters-QG(tot) = 11.8 nC, QGD = 4.3 nC-support fast, efficient switching in PWM-driven loads like solenoids and motors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum continuous drain-source blocking voltage compatible with 12 V automotive systems including load dump transients. |
| RDS(on) | 15.5–19 mΩ @ 10 VGS, 25 °C - Low conduction loss enabling <1.9 W dissipation at 10 A DC, critical for thermally demanding under-hood applications. |
| ID | 24.2 A @ Tmb = 25 °C - Continuous drain current rating defined at mounting base temperature, not ambient, reflecting real-world heatsink-coupled operation. |
| Tj max | 175 °C - Junction temperature limit supporting operation in engine bay environments without derating below full current. |
| QGD | 4.3 nC - Gate-drain charge determining Miller plateau duration; enables predictable 7.9 ns turn-off delay and 10 ns fall time with 5 Ω gate resistor. |
| EAS | 26.3 mJ - Single-pulse avalanche energy rating, allowing safe operation during inductive flyback events in motor/solenoid drive without external snubbers. |
| Rth(j-mb) | 3.96 K/W - Thermal resistance from junction to mounting base, enabling direct thermal coupling to metal-core PCBs or heatsinks for high-power density designs. |
Pinout & Package
Package: LFPAK56D (SOT1205), 8-lead plastic surface-mount package with exposed copper mounting base for enhanced thermal and electrical performance. Dimensions: 4.7 × 3.5 × 1.3 mm (L × W × H), with 1.27 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of FET1 - electrically isolated from S2; connects to low-side return path for first channel. |
| 2 | G1 | Gate terminal of FET1 - controls turn-on/turn-off of first MOSFET independently; requires standard 10 V drive. |
| 3 | S2 | Source terminal of FET2 - separate from S1; enables dual independent low-side switches or half-bridge configurations. |
| 4 | G2 | Gate terminal of FET2 - fully independent gate input; allows asynchronous or phase-shifted control of second channel. |
| 5 & 6 | D2 | Drain terminals of FET2 - internally paralleled pins (pins 5 and 6) reduce package inductance and improve current sharing for high-frequency switching. |
| 7 & 8 | D1 | Drain terminals of FET1 - internally paralleled pins (pins 7 and 8) provide low-inductance, high-current drain connection for first channel. |
Key Features
| Feature | Design Value |
|---|---|
| Dual N-channel topology | Two independent MOSFETs in single LFPAK56D package reduce board area by >40% vs discrete SO-8 solutions while maintaining isolation between channels. |
| AEC-Q101 qualification | Validated for automotive-grade reliability including temperature cycling, humidity testing, and mechanical shock-enabling use in transmission control modules and body ECUs. |
| Repetitive avalanche rated | Guaranteed operation under repeated inductive switching stress (e.g., solenoid coil de-energization), eliminating need for external clamping diodes in many designs. |
| 175 °C junction rating | Enables uninterrupted 24.2 A operation at mounting base temperatures up to 100 °C, supporting placement near heat sources without forced cooling. |
| True standard-level gate | VGS(th) >1 V at 175 °C ensures reliable turn-on with standard 5 V or 10 V microcontroller GPIOs-even under worst-case thermal conditions. |
Applications
| Transmission Control Valve Driver | Lamp Load Switching Module |
|---|---|
|
Use Scenario: Driving 12 V hydraulic solenoid valves in automatic transmission control units where space, thermal margin, and EMI are critical. IC Role / Device Role / Timing Role: Dual low-side switch controlling two independent valve coils; each FET handles 15–20 A pulsed current with 100 µs–10 ms on-time. Use Value: Integrated dual configuration eliminates layout complexity of two discrete MOSFETs; 3.96 K/W Rth(j-mb) sustains 100 °C Tmb during sustained duty cycles. |
Use Scenario: High-reliability headlight and fog lamp switching in modern LED+halogen hybrid lighting systems. IC Role / Device Role / Timing Role: Low-side power switch managing up to 24 A resistive load; handles cold inrush and PWM dimming up to 2 kHz. Use Value: 40 V VDS withstands ISO 7637-2 pulse 5a (load dump); 26.3 mJ EAS absorbs inductive kickback from filament lamp filaments. |
| Engine Cooling Fan Controller | Start-Stop System Solenoid Interface |
|
Use Scenario: PWM-controlled radiator fan driver in 12 V start-stop vehicles requiring silent, variable-speed operation across wide temperature range. IC Role / Device Role / Timing Role: High-efficiency half-bridge low-side switch (with external high-side) operating at 20 kHz switching frequency. Use Value: Low QGD (4.3 nC) and fast switching (tf = 10 ns) minimize switching losses; 175 °C rating prevents thermal shutdown during summer idle conditions. |
Use Scenario: Engagement/disengagement control of starter motor solenoid and battery disconnect relays in micro-hybrid architectures. IC Role / Device Role / Timing Role: Robust low-side driver handling 127 A peak inrush current during cranking, with precise timing control for relay coil energization. Use Value: 127 A IDM peak rating and 19 mΩ RDS(on) ensure minimal voltage drop (<0.25 V) during cranking, preserving control logic supply stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STLD200N4F6AG | Single-channel 40 V, 2.2 mΩ MOSFET in PowerFLAT 5x6; no dual configuration; lower RDS(on) but requires two devices for same functionality. | Requires duplicated layout and gate drive circuitry; lacks integrated thermal coupling between channels. | Select when ultra-low conduction loss dominates over board area and thermal synergy requirements. |
| ONSEMI NTMFS4C023NT1G | Dual N-channel 30 V, 2.3 mΩ in PowerSO-8; lower voltage rating limits use to ≤16 V systems; higher gate charge (QG = 22 nC). | Not suitable for 40 V load dump compliance; slower switching increases losses in high-frequency PWM. | Consider only for non-automotive 12 V industrial applications where AEC-Q101 is not required. |
Compared with STLD200N4F6AG and NTMFS4C023NT1G, the BUK7K18-40EX uniquely delivers dual-channel integration, AEC-Q101 qualification, and 40 V ruggedness in a thermally optimized LFPAK56D package-making it the only solution that simultaneously satisfies space, reliability, and transient immunity requirements in automotive power distribution modules.
Availability
BUK7K18-40EX is available at Aetrix Electronics and suitable for automotive transmission control, engine cooling fan management, headlamp load switching, and start-stop solenoid interface applications requiring stable component supply across extended production lifecycles.
Supply support for BUK7K18-40EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors-including MOSFETs, diodes, ESD protection, and logic ICs-with manufacturing rooted in process excellence and automotive-grade quality systems.
The BUK7K series belongs to Nexperia's AEC-Q101-qualified standard-level MOSFET product line, engineered specifically for thermally aggressive 12 V automotive power switching applications where dual-channel integration, avalanche ruggedness, and long-term reliability are mandatory.
FAQ
What is the maximum continuous drain current for BUK7K18-40EX at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is 22 A per channel, as specified in Table 5 (Limiting values) of the datasheet. This derating reflects thermal constraints of the LFPAK56D package and ensures junction temperature remains ≤175 °C under steady-state conduction.
Can BUK7K18-40EX be used in a half-bridge configuration?
Yes-BUK7K18-40EX supports half-bridge topologies when used as the low-side switch paired with an external high-side driver. Its dual independent channels allow one FET to serve as low-side switch while the other remains unused or implements auxiliary functions such as current sensing or redundancy.
Is the gate threshold voltage stable across temperature?
Yes-the gate-source threshold voltage remains >1 V up to 175 °C junction temperature (Fig. 10), confirming true standard-level behavior. At 25 °C, VGS(th) ranges from 2.4 V to 4.5 V (min to max), ensuring compatibility with 3.3 V and 5 V logic controllers even under thermal stress.
Does BUK7K18-40EX include integrated body diodes?
Yes-each channel includes a monolithic source-drain diode with typical forward voltage of 0.83 V at 10 A and 25 °C (Table 7). These diodes support freewheeling in inductive loads and are characterized for reverse recovery time (trr = 16.8 ns) and recovered charge (Qr = 9.1 nC).
BUK7K18-40EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1205, 8-LFPAK56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 40V
- Current - Continuous Drain (Id) @ 25°C:
- 24.2A
- Rds On (Max) @ Id, Vgs:
- 19mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 11.8nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 808pF @ 25V
- Power - Max:
- 38W
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56D
BUK7K18-40EX FAQ
1.How can I place an order for BUK7K18-40EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7K18-40EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7K18-40EX reliable?
The price and inventory of BUK7K18-40EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7K18-40EX is usually 5 days.
3.What payment methods are accepted for BUK7K18-40EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7K18-40EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7K18-40EX?
BUK7K18-40EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7K18-40EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7K18-40EX?
For technical support, including BUK7K18-40EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7K18-40EX requirements.
6.How does Aetrix verify that BUK7K18-40EX is sourced from the original manufacturer or authorized distributors?
All BUK7K18-40EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7K18-40EX meets industry standards.
7.What is the process for return or replacement of BUK7K18-40EX?
All BUK7K18-40EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7K18-40EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7K18-40EX part is unused and in its original packaging.
Return procedure for BUK7K18-40EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK7K18-40EX Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

