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Nexperia USA Inc. BUK7M19-60EX
- Part No.:
- BUK7M19-60EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK7M19-60EX.pdf
- Description:
- MOSFET N-CH 60V 35.8A LFPAK33
- Quantity:
- Payment:
- Shipping:
Inventory:946
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Product details
Overview
BUK7M19-60EX from Nexperia is a standard-level N-channel MOSFET in LFPAK33 (SOT1210) package, rated for 60 V drain-source voltage, 19 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and qualified to AEC-Q101 for automotive use. It delivers 36 A continuous drain current at Tmb = 25 °C and supports thermally demanding environments up to 175 °C junction temperature - deployed in 12 V automotive motor and solenoid control circuits.
For engineers reviewing the BUK7M19-60EX datasheet, BUK7M19-60EX pinout, BUK7M19-60EX application, or BUK7M19-60EX equivalent, key selection criteria include its true standard-level gate (VGS(th) > 1 V at 175 °C), repetitive avalanche rating, 2.46 K/W junction-to-mounting-base thermal resistance, and LFPAK33 package's high power density for space-constrained automotive PCBs.
Technical Context
This MOSFET employs TrenchMOS technology and features a monolithic mounting base connected directly to the drain terminal, enabling low-inductance, high-current switching with minimized thermal impedance. Its gate threshold voltage remains functional across -55 °C to 175 °C, and it sustains non-repetitive avalanche energy of 21.1 mJ under unclamped inductive load conditions.
The device exhibits 5.9 nC gate-drain charge (QGD) and 17.3 nC total gate charge (QG(tot)) at VDS = 48 V, supporting fast switching with controlled dV/dt. Its source-drain diode has 18.8 ns reverse recovery time and 16.3 nC recovered charge, making it suitable for synchronous rectification and freewheeling in DC-DC converters and motor drives.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum blocking voltage compatible with 12 V automotive systems with transient overvoltage margin. |
| RDS(on) | 15–19 mΩ @ VGS = 10 V, Tj = 25 °C - Low conduction loss enabling <1.8 W dissipation at 10 A continuous. |
| ID | 36 A @ Tmb = 25 °C - High current capability supported by LFPAK33's copper-clip construction and thermal pad. |
| Ptot | 55 W @ Tmb = 25 °C - Power handling enabled by 2.46 K/W Rth(j-mb), allowing direct heatsinking via mounting base. |
| VGS(th) | >1 V @ Tj = 175 °C - Ensures reliable turn-on with standard 5 V or 3.3 V logic drivers even at maximum operating temperature. |
| EAS | 21.1 mJ - Repetitive avalanche ruggedness enables robust operation in inductive load switching without external snubbers. |
| QGD | 5.9 nC - Low gate-drain charge reduces Miller effect, improving switching speed and reducing drive power requirements. |
Pinout & Package
LFPAK33 (SOT1210) is a surface-mount, single-ended power package with an exposed copper mounting base for enhanced thermal and electrical performance. It integrates three parallel source terminals and one gate terminal on the top side, with the drain electrically and thermally connected to the bottom-side mounting base.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source leads reduce bond-wire inductance and improve current sharing; tied internally to source die region. |
| 4 | Gate (G) | Single gate input with low capacitance (Ciss = 794–1055 pF); designed for standard-level logic drive compatibility. |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically connected to drain; serves as primary thermal path and high-current return node. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD per ISO 10605. |
| 175 °C maximum junction temperature | Enables operation in engine bay and transmission control modules without derating in ambient up to 125 °C. |
| True standard-level gate | VGS(th) > 1 V at 175 °C ensures turn-on margin with 3.3 V/5 V microcontrollers without level-shifting circuitry. |
| Repetitive avalanche rated | Supports unclamped inductive switching in motor control without external protection components. |
| Low Rth(j-mb) | 2.46 K/W thermal resistance allows >20 W dissipation with 50 °C rise above board temperature. |
Applications
| Engine Cooling Fan Control | Automatic Transmission Solenoid Driver |
|---|---|
|
Use Scenario: PWM-controlled 12 V brushless fan module in engine compartment with ambient temperatures up to 125 °C. IC Role / Device Role / Timing Role: High-side or low-side power switch regulating fan speed via 20–25 kHz PWM, leveraging fast turn-off (tf = 6.7 ns) and low QGD. Use Value: 19 mΩ RDS(on) minimizes conduction loss (<0.5 W at 5 A), while 175 °C rating eliminates need for thermal derating in under-hood placement. |
Use Scenario: Driving 12 V transmission shift solenoids requiring precise current regulation and fast response during gear changes. IC Role / Device Role / Timing Role: Low-side switch controlling solenoid coil current with 143 A peak pulsed capability (tp ≤ 10 µs) and 21.1 mJ avalanche energy absorption. Use Value: Repetitive avalanche ruggedness prevents failure during coil flyback transients; 36 A continuous rating supports multiple solenoids in parallel. |
| Start-Stop System Battery Disconnect | Electric Power Steering (EPS) Motor Phase Switch |
|
Use Scenario: Bidirectional battery isolation switch in 12 V start-stop systems, managing load dump and reverse polarity events. IC Role / Device Role / Timing Role: Standard-level MOSFET used in back-to-back configuration with integrated body diode forward conduction (VSD = 0.83 V @ 10 A). Use Value: 60 V VDS withstands ISO 7637-2 pulse 5a (up to 60 V), and 175 °C rating ensures stability during repeated cranking cycles. |
Use Scenario: Half-bridge phase leg in 12 V EPS motor driver, switching at 10–20 kHz with high dv/dt immunity. IC Role / Device Role / Timing Role: Low-inductance LFPAK33 package minimizes parasitic ringing; QGD = 5.9 nC enables clean commutation with minimal shoot-through risk. Use Value: 2.46 K/W Rth(j-mb) maintains Tj < 150 °C at 25 A RMS, avoiding thermal shutdown during sustained steering assist. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | 60 V, 2.2 mΩ RDS(on) @ 10 V, Tj = 25 °C; PowerFLAT 5x6 package; higher current but requires gate driver due to logic-level threshold. | Targeted at high-efficiency 48 V mild-hybrid systems; not AEC-Q101 qualified in all variants. | Select when lower RDS(on) and higher ID (>100 A) are required, and gate drive voltage ≥ 10 V is available. |
| IRF3205PbF | 55 V, 8 mΩ RDS(on); TO-220 package; no AEC-Q101 qualification; higher Rth(j-c) (1.5 K/W) limits power density. | Legacy industrial motor control; unsuitable for space-constrained automotive PCBs or extended temperature operation. | Use only for cost-sensitive non-automotive prototypes where LFPAK33 footprint and AEC compliance are not required. |
Compared with STL220N6F7 and IRF3205PbF, BUK7M19-60EX uniquely balances AEC-Q101 compliance, standard-level gate drive, 175 °C operation, and LFPAK33's thermal efficiency - making it optimal for production automotive modules where reliability, layout density, and system-level thermal management are co-constrained.
Availability
BUK7M19-60EX is available at Aetrix Electronics and suitable for engine cooling fan control, automatic transmission solenoid driving, and start-stop battery disconnect applications requiring stable component supply across automotive production lifecycles.
Supply support for BUK7M19-60EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.
BUK7M19-60EX belongs to Nexperia's Automotive Logic Level and Standard Level MOSFET product line, engineered specifically for robust, thermally efficient power switching in 12 V automotive subsystems - emphasizing AEC-Q101 compliance, avalanche ruggedness, and LFPAK packaging for superior power density.
FAQ
Is BUK7M19-60EX pin-compatible with other LFPAK33 MOSFETs?
Yes - BUK7M19-60EX uses the standardized SOT1210 footprint with identical 3-source, 1-gate, drain-mounted-base pinout. It shares mechanical and solder-reflow compatibility with all Nexperia LFPAK33 N-channel MOSFETs, enabling drop-in replacement within the same voltage and RDS(on) class, provided gate drive and thermal design margins are verified.
What is the maximum recommended gate resistor for 20 kHz PWM switching?
A 5 Ω external gate resistor is validated per datasheet Figure 3 for VGS = 10 V drive, yielding tf = 6.7 ns and td(off) = 13.3 ns. For 20 kHz operation with 50% duty cycle, this ensures <0.1% switching loss contribution at 36 A, while maintaining EMI control and preventing gate oscillation in typical automotive PCB layouts.
Does BUK7M19-60EX require a negative gate voltage for safe turn-off in inductive loads?
No - the device's standard-level gate (VGS(th) > 1 V at 175 °C) and 20 V absolute maximum VGS rating allow safe, robust turn-off using 0 V gate drive. Its 21.1 mJ avalanche rating handles unclamped inductive energy without requiring active gate pull-down below 0 V, simplifying driver design in automotive solenoid and motor control.
How does the LFPAK33 package improve thermal performance versus SO-8 or DPAK?
LFPAK33 reduces junction-to-mounting-base thermal resistance to 2.46 K/W - 40% lower than equivalent DPAK devices - by replacing bond wires with copper clips and exposing a large copper drain pad. This enables >20 W power dissipation with only 50 °C temperature rise above PCB, critical for under-hood automotive modules where airflow and heatsink area are severely limited.
BUK7M19-60EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 35.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 19mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 17.3 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1055 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 55W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK7M19-60EX FAQ
1.How can I place an order for BUK7M19-60EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7M19-60EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7M19-60EX reliable?
The price and inventory of BUK7M19-60EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7M19-60EX is usually 5 days.
3.What payment methods are accepted for BUK7M19-60EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7M19-60EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7M19-60EX?
BUK7M19-60EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7M19-60EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7M19-60EX?
For technical support, including BUK7M19-60EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7M19-60EX requirements.
6.How does Aetrix verify that BUK7M19-60EX is sourced from the original manufacturer or authorized distributors?
All BUK7M19-60EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7M19-60EX meets industry standards.
7.What is the process for return or replacement of BUK7M19-60EX?
All BUK7M19-60EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7M19-60EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7M19-60EX part is unused and in its original packaging.
Return procedure for BUK7M19-60EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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