Nexperia USA Inc. BUK7M9R5-40HX
- Part No.:
- BUK7M9R5-40HX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK7M9R5-40HX.pdf
- Description:
- MOSFET N-CH 40V 40A LFPAK33
- Quantity:
- Payment:

- Shipping:

Inventory:2,679
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK7M9R5-40HX from Nexperia is an AEC-Q101 qualified N-channel standard-level MOSFET in LFPAK33 (SOT1210) package, featuring 40 V VDS, 9.5 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, 40 A continuous drain current capability, and repetitive avalanche rating - deployed in automotive powertrain and body control modules for high-reliability 12 V system switching.
For engineers reviewing the BUK7M9R5-40HX datasheet, BUK7M9R5-40HX pinout, BUK7M9R5-40HX application, or BUK7M9R5-40HX equivalent, key selection criteria include its AEC-Q101 qualification at 175 °C junction temperature, LFPAK33 thermal resistance of 2.51 K/W (j-mb), gull-wing lead manufacturability, and source-drain diode softness factor of 0.58 for low EMI in motor drive commutation.
Technical Context
This MOSFET employs Trench 9 superjunction technology to achieve low conduction loss and high power density, with a gate threshold voltage (VGS(th)) of 2.4–3.6 V at 25 °C and 1–4.3 V across -55 °C to 175 °C. Its LFPAK33 copper clip construction enables robust thermal transfer from die to mounting base.
The device integrates a monolithic source-drain diode with 14 nC recovered charge (Qr) and 0.58 softness factor at dIS/dt = −100 A/µs, supporting reliable freewheeling in DC-DC converters and brushed motor H-bridges without external snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum drain-source blocking voltage compatible with 12 V automotive battery systems including load dump transients. |
| RDS(on) | 9.5 mΩ @ VGS = 10 V, ID = 15 A, Tj = 25 °C - Enables <1.5 W conduction loss at 40 A, critical for thermally constrained PCB layouts. |
| ID (cont) | 40 A @ Tmb = 25 °C - Validated continuous current under ideal heatsinking; real-world limit set by PCB copper area and ambient conditions. |
| EAS | 19 mJ - Non-repetitive avalanche energy rating supports robustness against inductive switching spikes in solenoid and relay drivers. |
| Rth(j-mb) | 2.51 K/W - Low junction-to-mounting-base thermal resistance allows direct thermal coupling to heatsink or copper plane for efficient power dissipation. |
| QGD | 2.5 nC typ - Low gate-drain charge minimizes Miller effect, enabling fast, stable switching up to 500 kHz in synchronous buck stages. |
| Softness factor | 0.58 - Diode recovery behavior reduces voltage overshoot and EMI during turn-off, easing EMC compliance in infotainment power supplies. |
Pinout & Package
LFPAK33 (SOT1210) is a surface-mount, single-ended package with gull-wing leads, 0.65 mm pitch, and integrated copper clip connecting the die to the exposed mounting base (drain). The package provides high power density and AOI-compatible solder joints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond wire inductance and improve current sharing in high-di/dt applications like motor phase switching. |
| 4 | Gate (G) | Single gate input with 0.9 Ω typical gate resistance - optimized for standard 5–10 V logic-level drive without external gate resistor tuning. |
| Mounting base (mb) | Drain (D) | Exposed copper pad electrically connected to drain; serves as primary thermal path and high-current return node in PCB layout. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified at 175 °C | Validated for automotive under-hood environments including engine control units and transmission control modules. |
| Trench 9 superjunction architecture | Delivers 20% lower RDS(on) × QG figure-of-merit vs. prior-generation TrenchMOS, improving efficiency in 100–500 kHz DC-DC stages. |
| Repetitive avalanche rated | Withstands repeated inductive energy dumps without degradation - eliminates need for external clamping diodes in valve and pump drivers. |
| LFPAK copper clip construction | Reduces package inductance to <1.5 nH and improves thermal cycling reliability over wire-bonded SO-8 alternatives. |
| Gull-wing lead form | Enables automated optical inspection (AOI) and high-yield reflow soldering on dense automotive PCBs with tight spacing requirements. |
Applications
| Engine Control Unit (ECU) Solenoid Driver | Automotive LED Headlamp Dimming |
|---|---|
Use Scenario: Switching 12 V fuel injector or turbocharger VGT solenoids with 20–50 ms pulse widths and 1–2 A average current. IC Role / Device Role / Timing Role: High-side or low-side power switch controlling inductive load current; handles flyback energy via internal avalanche-rated drain-source path. Use Value: Eliminates external TVS/clamp diode due to 19 mJ non-repetitive avalanche rating and 0.58 soft diode recovery, reducing BOM count and board space. | Use Scenario: PWM dimming of 30–60 W LED arrays in adaptive front lighting systems (AFS), operating at 1–20 kHz. IC Role / Device Role / Timing Role: Low-side switching element in constant-current LED driver stage; conducts up to 40 A peak during short-circuit fault events. Use Value: 9.5 mΩ RDS(on) limits conduction loss to <1.5 W at full load, enabling compact thermal design without active cooling in headlamp housing. |
| 12 V DC-DC Converter Primary Switch | Body Control Module (BCM) Window Lift Motor Driver |
Use Scenario: Synchronous rectifier or high-side switch in 12 V → 5/3.3 V buck converter powering ADAS camera modules. IC Role / Device Role / Timing Role: Fast-switching power transistor with 3.1 ns rise time and 3.5 ns fall time; driven by dedicated gate driver IC. Use Value: Low QGD (2.5 nC) and Ciss (833 pF) enable clean zero-voltage switching transitions, reducing switching losses below 0.3 W at 300 kHz. | Use Scenario: Half-bridge leg in reversible 12 V window lift motor controller, handling bidirectional 25 A stall current. IC Role / Device Role / Timing Role: N-channel MOSFET used in low-side position of H-bridge; leverages low RDS(on) and robust SOA for safe operation during motor stall and direction reversal. Use Value: LFPAK33's 218 A pulsed drain current rating ensures immunity to 200 A+ inrush currents during cold cranking, preventing latch-up or failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 2.2 mΩ RDS(on), PowerFLAT 5x6 package, higher current but larger footprint and no AEC-Q101 documentation publicly available. | Targeted at industrial motor drives; lacks explicit automotive qualification evidence and soft diode data. | Select only if ultra-low RDS(on) outweighs qualification traceability and thermal performance per mm². |
| ON Semiconductor NTMFS4C09NT1G | 40 V, 9.0 mΩ RDS(on), SO-8FL package, AEC-Q101 qualified, but Rth(j-mb) = 3.5 K/W - 40% higher thermal resistance than BUK7M9R5-40HX. | Used in infotainment power rails where moderate thermal demand exists; less suitable for sustained 40 A operation. | Prefer when SO-8FL footprint compatibility is mandatory and peak power dissipation remains below 35 W. |
Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK7M9R5-40HX uniquely balances AEC-Q101 validation, 2.51 K/W thermal resistance, and gull-wing manufacturability - making it optimal for space-constrained, thermally demanding automotive body and powertrain modules where long-term reliability is non-negotiable.
Availability
BUK7M9R5-40HX is available at Aetrix Electronics and suitable for automotive powertrain control, body electronics, and infotainment power management requiring stable component supply across extended vehicle lifecycles.
Supply support for BUK7M9R5-40HX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, and consumer markets.
The LFPAK MOSFET product line targets high-efficiency, high-reliability power switching in automotive subsystems - engineered specifically for AEC-Q101 compliance, thermal robustness, and manufacturability in automated SMT lines.
FAQ
Is BUK7M9R5-40HX pin-compatible with standard SO-8 or PowerSO-8 MOSFETs?
No. BUK7M9R5-40HX uses the LFPAK33 (SOT1210) package with four terminals (three sources, one gate) and an exposed drain mounting base - incompatible with SO-8 footprints. Its gull-wing leads require the specific 0.65 mm pitch land pattern shown in Figure 18 of the datasheet.
What is the maximum recommended PCB copper area for thermal relief at 40 A continuous operation?
For 40 A continuous current at Tmb ≤ 100 °C, Nexperia recommends ≥ 400 mm² of 2 oz copper connected directly to the mounting base, with thermal vias spaced ≤ 1.2 mm apart beneath the pad. This achieves the rated 38.5 A at Tmb = 100 °C per Figure 2.
Does the source-drain diode support synchronous rectification in buck converters?
Yes - the integrated diode has 14 nC Qr and 0.58 softness factor, enabling controlled reverse recovery in 100–500 kHz buck topologies. However, for best efficiency above 200 kHz, external Schottky or GaN FETs are preferred; this MOSFET is optimized for cost-sensitive, reliability-critical automotive applications.
Can BUK7M9R5-40HX be driven directly by a 3.3 V microcontroller GPIO?
No. With VGS(th) min = 2.4 V and RDS(on) strongly dependent on VGS, 3.3 V drive yields >50 mΩ on-resistance - causing excessive loss. A dedicated gate driver (e.g., TC4427) or level-shifter is required to deliver ≥10 V to ensure 9.5 mΩ performance and fast switching.
BUK7M9R5-40HX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 9.5mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 3.6V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 18 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1166 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 55W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK7M9R5-40HX FAQ
1.How can I place an order for BUK7M9R5-40HX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7M9R5-40HX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7M9R5-40HX reliable?
The price and inventory of BUK7M9R5-40HX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7M9R5-40HX is usually 5 days.
3.What payment methods are accepted for BUK7M9R5-40HX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7M9R5-40HX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7M9R5-40HX?
BUK7M9R5-40HX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7M9R5-40HX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7M9R5-40HX?
For technical support, including BUK7M9R5-40HX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7M9R5-40HX requirements.
6.How does Aetrix verify that BUK7M9R5-40HX is sourced from the original manufacturer or authorized distributors?
All BUK7M9R5-40HX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7M9R5-40HX meets industry standards.
7.What is the process for return or replacement of BUK7M9R5-40HX?
All BUK7M9R5-40HX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7M9R5-40HX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7M9R5-40HX part is unused and in its original packaging.
Return procedure for BUK7M9R5-40HX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK7M9R5-40HX Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

