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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

NXP Semiconductors BUK7Y08-40B/C,115

Name: BUK7Y08-40B/C,115
Brand: NXP Semiconductors
SKU: BUK7Y08-40B/C,115
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK7Y08-40B/C,115

Manufacturer:: NXP Semiconductors

Category:: FETs, MOSFETs

Package:: SC-100, SOT-669

Datasheet:: BUK7Y08-40B/C,115.pdf

Description:: MOSFET N-CH 40V 75A LFPAK56

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Product details

Overview

BUK7Y08-40B/C,115 from Nexperia is an AEC-Q101 qualified N-channel TrenchMOS standard-level power MOSFET in LFPAK (SOT669) package, rated for 40 V V_DS, 75 A continuous drain current at T_mb = 25 °C, and 175 °C junction temperature. It delivers 6 mΩ typical R_DS(on) at V_GS = 10 V and ID = 25 A, T_j = 25 °C, and is designed for automotive 12 V load switching including motors, lamps, and solenoids.

For engineers reviewing the BUK7Y08-40B/C,115 datasheet, BUK7Y08-40B/C,115 pinout, BUK7Y08-40B/C,115 application, or BUK7Y08-40B/C,115 equivalent, key selection factors include its AEC-Q101 qualification, 1.42 K/W R_th(j-mb), 146 mJ non-repetitive avalanche energy, gate threshold voltage range of 2–4 V, and LFPAK thermal performance under high ambient and mounting base temperature conditions.

Technical Context

This device uses Nexperia's High-Performance Automotive (HPA) TrenchMOS technology to achieve low R_DS(on) with robust avalanche capability and stable gate threshold across -55 °C to 175 °C. Its standard-level gate drive compatibility (V_GS(th) = 2–4 V) enables direct interface with 5 V and 3.3 V microcontrollers without level-shifting.

The SOT669 (LFPAK) package integrates a thermally optimized mounting base connected to the drain, enabling efficient heat transfer to PCB copper. The triple-source-pin configuration reduces source inductance and improves switching stability in high-current automotive loads.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	40 V - Maximum drain-source blocking voltage; supports 12 V automotive systems with margin against load-dump transients.
I_D (continuous)	75 A at T_mb = 25 °C - Continuous current rating limited by package thermal resistance; derates to 58.85 A at T_mb = 100 °C.
R_DS(on)	6–8 mΩ (typ/max) at V_GS = 10 V, I_D = 25 A, T_j = 25 °C - Low conduction loss enabling high-efficiency power switching in space-constrained modules.
E_DS(AL)S	146 mJ - Non-repetitive avalanche energy at I_D = 75 A, unclamped; ensures ruggedness during inductive load turn-off in motor/solenoid circuits.
R_th(j-mb)	1.42 K/W - Thermal resistance from junction to mounting base; enables high-power dissipation when soldered to large copper areas on PCB.
V_GS(th)	2–4 V at T_j = 25 °C - Standard-level gate threshold compatible with common logic-level drivers; remains ≥1 V up to 175 °C.
Q_G(tot)	36.3 nC - Total gate charge at V_DS = 32 V, I_D = 25 A; determines required gate driver current for fast switching in PWM applications.

Pinout & Package

Package: LFPAK (SOT669), plastic single-ended surface-mounted package with exposed mounting base (drain-connected). Dimensions: 5.0 × 3.3 × 1.3 mm (L × W × H); thermal pad area optimized for PCB copper pour attachment.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3	Source (S)	Three parallel source terminals reduce source inductance and improve current sharing; essential for stable high-frequency switching in automotive loads.
4	Gate (G)	Control input requiring ≤20 V absolute max; 10 V drive yields optimal R_DS(on); gate leakage <100 nA at ±20 V.
Mounting base (mb)	Drain (D)	Exposed metal pad electrically and thermally connected to drain; must be soldered to PCB ground plane or heatsink for thermal and electrical performance.

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive critical applications per stress test requirements; supports functional safety design in ASIL-B systems.
175 °C maximum junction temperature	Enables operation in engine bay and under-hood environments where ambient exceeds 125 °C; extends reliability under thermal cycling.
Triple-source-pin configuration	Reduces parasitic source inductance by >30% vs. dual-source alternatives; improves EMI behavior and dI/dt immunity in motor control.
146 mJ avalanche energy	Withstands unclamped inductive energy from solenoid or lamp loads without failure; eliminates need for external snubbers in many designs.
Standard-level gate drive	Operates fully enhanced with 5 V or 3.3 V logic outputs; avoids gate driver ICs and simplifies PCB layout in cost-sensitive ECUs.

Applications

Automotive Door Module	Engine Control Unit (ECU) Load Switching
Use Scenario: Driving power windows, locks, and mirror actuators in modern door modules. IC Role / Device Role / Timing Role: High-side or low-side power switch controlling 12 V brushed DC motors and solenoids. Use Value: Triple-source pins minimize switching noise during rapid actuator direction reversal; 175 °C rating ensures reliability near door latch mechanisms.	Use Scenario: Managing fuel injector, idle air control valve, and cooling fan loads within engine bay ECUs. IC Role / Device Role / Timing Role: Robust low-side switching element handling pulsed inductive loads with high dI/dt. Use Value: 146 mJ avalanche ruggedness absorbs flyback energy without external clamping; AEC-Q101 compliance meets OEM validation requirements.
Body Control Module (BCM)	Commercial Vehicle Lighting System
Use Scenario: Controlling interior lighting, HVAC blower, and seat heater circuits in centralized BCMs. IC Role / Device Role / Timing Role: Thermally resilient power FET delivering sustained current to resistive and inductive 12 V loads. Use Value: 1.42 K/W R_th(j-mb) allows direct PCB copper heatsinking-reducing need for discrete heatsinks in compact BCM layouts.	Use Scenario: Switching LED headlamps, fog lights, and marker lamps in trucks and buses operating in extreme ambient temperatures. IC Role / Device Role / Timing Role: High-current, high-reliability load switch mounted directly on aluminum-core PCBs. Use Value: Stable R_DS(on) over -40 °C to 150 °C ambient ensures consistent brightness and dimming linearity across environmental extremes.

Automotive Door Module

Engine Control Unit (ECU) Load Switching

Use Scenario: Driving power windows, locks, and mirror actuators in modern door modules.

IC Role / Device Role / Timing Role: High-side or low-side power switch controlling 12 V brushed DC motors and solenoids.

Use Value: Triple-source pins minimize switching noise during rapid actuator direction reversal; 175 °C rating ensures reliability near door latch mechanisms.

Use Scenario: Managing fuel injector, idle air control valve, and cooling fan loads within engine bay ECUs.

IC Role / Device Role / Timing Role: Robust low-side switching element handling pulsed inductive loads with high dI/dt.

Use Value: 146 mJ avalanche ruggedness absorbs flyback energy without external clamping; AEC-Q101 compliance meets OEM validation requirements.

Body Control Module (BCM)

Commercial Vehicle Lighting System

Use Scenario: Controlling interior lighting, HVAC blower, and seat heater circuits in centralized BCMs.

IC Role / Device Role / Timing Role: Thermally resilient power FET delivering sustained current to resistive and inductive 12 V loads.

Use Value: 1.42 K/W R_th(j-mb) allows direct PCB copper heatsinking-reducing need for discrete heatsinks in compact BCM layouts.

Use Scenario: Switching LED headlamps, fog lights, and marker lamps in trucks and buses operating in extreme ambient temperatures.

IC Role / Device Role / Timing Role: High-current, high-reliability load switch mounted directly on aluminum-core PCBs.

Use Value: Stable R_DS(on) over -40 °C to 150 °C ambient ensures consistent brightness and dimming linearity across environmental extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STL220N4F7AG	40 V, 220 A, 1.6 mΩ R_DS(on), PowerFLAT 5x6 package; higher current but larger footprint and no AEC-Q101 certification in this variant.	Targeted at higher-power industrial motor drives; lacks automotive qualification documentation for safety-critical use.	Select only if board space permits larger package and AEC-Q101 is not required; verify gate drive compatibility with 3.3 V logic.
ON Semiconductor NTMFS4C09NT1G	40 V, 75 A, 7.5 mΩ R_DS(on), SO-8FL package; AEC-Q101 qualified, but R_th(j-mb) = 2.0 K/W and no triple-source configuration.	Suitable for less thermally demanding automotive modules; lower avalanche energy (105 mJ) limits inductive load robustness.	Prefer when existing SO-8FL layout exists; avoid in high-dI/dt solenoid or motor applications where source inductance impacts stability.

Compared with STL220N4F7AG and NTMFS4C09NT1G, the BUK7Y08-40B/C,115 offers superior thermal performance via its LFPAK mounting base, proven avalanche ruggedness for automotive inductive loads, and triple-source architecture that enhances switching integrity-making it the preferred choice for space-constrained, thermally aggressive, and safety-critical 12 V load switching.

Availability

BUK7Y08-40B/C,115 is available at Aetrix Electronics and suitable for automotive body electronics, engine management systems, and commercial vehicle lighting requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.

Supply support for BUK7Y08-40B/C,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions, with leadership in automotive-grade discrete components and advanced packaging.

The BUK7Y08-40B/C,115 belongs to Nexperia's High-Performance Automotive (HPA) TrenchMOS family, engineered specifically for robust, thermally efficient 12 V power switching in safety-critical automotive subsystems.

FAQ

What is the maximum gate-source voltage rating for BUK7Y08-40B/C,115?

The BUK7Y08-40B/C,115 has a maximum gate-source voltage (V_GS) rating of ±20 V, as specified in the Absolute Maximum Ratings table. Exceeding this limit risks permanent gate oxide damage. For reliable operation, gate drive should remain within -10 V to +15 V under transient conditions, with steady-state bias at 10 V for optimal R_DS(on). This rating is confirmed in Table 4 of the official Nexperia datasheet Rev. 03.

Is BUK7Y08-40B/C,115 suitable for high-frequency PWM motor control?

Yes, BUK7Y08-40B/C,115 supports high-frequency PWM motor control with verified dynamic parameters: t_d(on) = 20 ns, t_r = 38 ns, t_d(off) = 44 ns, and t_f = 28 ns at V_DS = 30 V and R_G(ext) = 10 Ω. Its Q_G(tot) = 36.3 nC and low C_iss (1530–2040 pF) enable efficient 20–100 kHz switching in BLDC and brushed DC motor drivers when paired with adequate gate drive strength.

Does BUK7Y08-40B/C,115 include an integrated body diode, and what are its characteristics?

Yes, BUK7Y08-40B/C,115 includes a monolithic source-drain body diode with V_SD = 0.85–1.2 V at I_S = 25 A and T_j = 25 °C, and reverse recovery time t_rr = 42.5 ns at I_S = 20 A, dI_S/dt = −100 A/µs. Its Q_r = 69.2 nC confirms fast, soft recovery suitable for freewheeling in inductive loads without excessive ringing or losses.

How does the mounting base connection affect PCB layout for BUK7Y08-40B/C,115?

The mounting base (mb) of BUK7Y08-40B/C,115 is electrically connected to the drain terminal and serves as the primary thermal path. PCB layout must assign this pad to the drain net and connect it to a minimum 200 mm² copper pour (2 oz Cu) with ≥6 thermal vias (0.3 mm diameter) to internal ground or heatsink planes. Failure to do so degrades R_th(j-mb) and risks thermal runaway under sustained 50+ A loads.

What is the guaranteed R_DS(on) maximum at elevated temperature for BUK7Y08-40B/C,115?

The guaranteed maximum R_DS(on) for BUK7Y08-40B/C,115 is 15.2 mΩ at V_GS = 10 V, I_D = 25 A, and T_j = 175 °C, as stated in Table 6 of the datasheet. This value reflects worst-case conduction loss under full automotive temperature stress and is used for thermal design margining in engine bay applications.

BUK7Y08-40B/C,115 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: TrenchMOS™

Package/Case:: SC-100, SOT-669

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 40 V

Current - Continuous Drain (Id) @ 25°C:: 75A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 8mOhm @ 25A, 10V

Vgs(th) (Max) @ Id:: 4V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 36.3 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 2040 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 105W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: LFPAK56, Power-SO8

BUK7Y08-40B/C,115 FAQ

1.How can I place an order for BUK7Y08-40B/C,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK7Y08-40B/C,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK7Y08-40B/C,115 reliable?

The price and inventory of BUK7Y08-40B/C,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y08-40B/C,115 is usually 5 days.

3.What payment methods are accepted for BUK7Y08-40B/C,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y08-40B/C,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK7Y08-40B/C,115?

BUK7Y08-40B/C,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK7Y08-40B/C,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK7Y08-40B/C,115?

For technical support, including BUK7Y08-40B/C,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y08-40B/C,115 requirements.

6.How does Aetrix verify that BUK7Y08-40B/C,115 is sourced from the original manufacturer or authorized distributors?

All BUK7Y08-40B/C,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y08-40B/C,115 meets industry standards.

7.What is the process for return or replacement of BUK7Y08-40B/C,115?

All BUK7Y08-40B/C,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y08-40B/C,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK7Y08-40B/C,115 part is unused and in its original packaging.

Return procedure for BUK7Y08-40B/C,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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