My Inquiry
My Account
Nexperia USA Inc. BUK7Y10-30B,115
- Part No.:
- BUK7Y10-30B,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK7Y10-30B,115.pdf
- Description:
- MOSFET N-CH 30V 67A LFPAK56
- Quantity:
- Payment:
- Shipping:
Inventory:5,259
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK7Y10-30B from Nexperia is an AEC-Q101 qualified N-channel TrenchMOS standard-level power MOSFET in LFPAK (SOT669) package, rated for 30 V VDS, 67 A continuous drain current at Tmb = 25 °C, 7.8 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and 175 °C maximum junction temperature - deployed as a high-reliability 12 V load switch in automotive body control modules.
For engineers reviewing the BUK7Y10-30B datasheet, BUK7Y10-30B pinout, BUK7Y10-30B application, or BUK7Y10-30B equivalent, this device is selected for thermally demanding automotive power switching where standard gate drive compatibility, avalanche ruggedness (101 mJ), and mounting-base thermal resistance (1.76 K/W) are critical selection criteria.
Technical Context
This MOSFET uses Nexperia's High-Performance Automotive (HPA) TrenchMOS technology to deliver low RDS(on) with robust short-circuit and unclamped inductive switching capability. Its gate threshold voltage (2–4 V at Tj = 25 °C) ensures reliable turn-on with standard 10 V logic-level drivers while maintaining safe margin against spurious conduction at elevated temperatures.
The LFPAK SOT669 package integrates a thermally optimized mounting base directly connected to the drain, enabling efficient heat transfer to PCB copper or heatsinks. Its 4-terminal structure separates source (pins 1–3) and gate (pin 4), minimizing source inductance and supporting fast, stable switching up to 268 A peak drain current under pulsed conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage compatible with 12 V automotive systems including load dump transients. |
| ID (continuous) | 67 A at Tmb = 25 °C - Sustained current handling for high-power solenoids, motors, and lighting loads without forced cooling. |
| RDS(on) | 7.8 mΩ (typ) at VGS = 10 V, ID = 25 A, Tj = 25 °C - Low conduction loss enabling <1 W dissipation at 40 A DC, reducing thermal design burden. |
| EAS | 101 mJ (non-repetitive) - Energy-handling capability during unclamped inductive switching events (e.g., relay or motor coil de-energization). |
| Rth(j-mb) | 1.76 K/W - Thermal resistance from junction to mounting base, enabling direct thermal path to PCB copper pour or heatsink for high-power operation. |
| QGD | 5.6 nC - Gate-drain charge determining Miller plateau duration; supports clean, controllable turn-off in high-dV/dt environments. |
| VGS(th) | 2–4 V at Tj = 25 °C - Threshold voltage range ensuring robust turn-on with 5 V/10 V microcontroller outputs while avoiding false triggering at cold start. |
Pinout & Package
Package: LFPAK (SOT669) - plastic single-ended surface-mounted package with exposed mounting base (drain-connected) for enhanced thermal performance and mechanical robustness in automotive vibration environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 (S) | Source | Three parallel source terminals reduce bond-wire inductance and increase current-carrying capacity; electrically tied internally. |
| 4 (G) | Gate | Single gate terminal with low input capacitance (Ciss = 887–1183 pF); designed for standard gate drivers without requiring external gate resistors for basic switching. |
| Mounting Base (mb) | Drain | Exposed metal pad soldered to PCB copper; serves as primary drain connection and thermal interface - must be routed to system ground plane or heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive safety-critical applications including engine management, chassis, and body electronics per stress test requirements. |
| 175 °C maximum junction temperature | Enables operation in under-hood environments (e.g., near exhaust manifolds or alternators) without derating or active cooling. |
| Standard-level gate drive (VGS = 10 V) | Compatible with common 10 V automotive supply rails and microcontroller GPIOs via simple level-shifting, eliminating need for dedicated gate drivers. |
| Low RDS(on) × QG figure of merit | Combined 7.8 mΩ RDS(on) and 18.8 nC QG(tot) enables high-efficiency switching in 10–100 kHz PWM applications like fan speed control. |
| Unclamped avalanche energy rating | 101 mJ EAS allows safe operation in inductive load circuits without snubber networks in many automotive implementations. |
Applications
| Automotive Body Control Module (BCM) | Engine Cooling Fan Driver |
|---|---|
Use Scenario: Switching 12 V power to door locks, window lifters, and interior lighting in modern BCMs. IC Role / Device Role / Timing Role: High-side or low-side power switch controlling load current with precise on/off timing and fault tolerance. Use Value: AEC-Q101 compliance and 175 °C rating ensure long-term reliability in sealed, thermally constrained BCM enclosures. |
Use Scenario: PWM-controlled driving of brushless DC cooling fans in engine bays. IC Role / Device Role / Timing Role: Low-side switching element handling 40–60 A peak currents with fast turn-on/turn-off (td(on)/td(off) ≤ 30 ns). Use Value: Low RDS(on) minimizes conduction loss at 100% duty cycle; avalanche rating absorbs back-EMF during abrupt shutdown. |
| Start-Stop System Solenoid Control | Truck Trailer Lighting Interface |
Use Scenario: Driving high-current starter solenoids in 12 V start-stop systems subject to frequent cycling and wide ambient temperature swings. IC Role / Device Role / Timing Role: Robust power switch delivering >200 A pulsed current (IDM = 268 A) with minimal voltage drop during cranking. Use Value: Mounting-base thermal design sustains repeated high-current pulses without thermal runaway; Q101 qualification covers full vehicle lifecycle. |
Use Scenario: Isolating and switching 12 V trailer lighting circuits (brake, turn, tail) in commercial vehicle towing interfaces. IC Role / Device Role / Timing Role: Load switch protecting main vehicle wiring harness from trailer short circuits and reverse polarity faults. Use Value: 30 V VDS withstands ISO 7637-2 pulse 5a (load dump up to 40 V); integrated source diode handles inductive kickback from lamp filaments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N3LLH6 | 30 V, 220 A, 1.8 mΩ RDS(on), PowerFLAT 5x6 package, higher current but larger footprint and cost. | Better suited for high-current, space-tolerant designs (e.g., battery disconnect); less optimal for compact LFPAK-replacement layouts. | Select when peak current >100 A is required and PCB area permits larger package; verify gate drive strength for 22 nC QG. |
| IRL8721PBF | 30 V, 61 A, 8.3 mΩ RDS(on), TO-220AB package, non-AEC-Q101, lower thermal resistance to case but no mounting base. | Acceptable for industrial 12 V switching but not certified for automotive safety-critical use; requires heatsink mounting. | Choose only for non-automotive applications where AEC-Q101 is not mandated; avoid in BCM or engine bay deployments. |
Compared with STL220N3LLH6 and IRL8721PBF, BUK7Y10-30B delivers optimal balance of AEC-Q101 compliance, LFPAK thermal efficiency, and 67 A capability in a compact surface-mount form - making it preferred for space-constrained, thermally aggressive automotive modules where certification and reliability are mandatory.
Availability
BUK7Y10-30B is available at Aetrix Electronics and suitable for automotive body control modules, engine cooling fan drivers, start-stop solenoid controllers, and commercial vehicle trailer lighting interfaces requiring stable component supply across multi-year production cycles.
Supply support for BUK7Y10-30B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors for automotive, industrial, and consumer applications, with leadership in MOSFETs, logic, and ESD protection devices.
BUK7Y10-30B belongs to Nexperia's High-Performance Automotive (HPA) TrenchMOS product line, engineered specifically for AEC-Q101-compliant power switching in harsh automotive environments - emphasizing thermal resilience, avalanche robustness, and gate-drive simplicity.
FAQ
Is BUK7Y10-30B suitable for high-side switching configurations?
Yes - its standard-level gate drive (VGS(th) = 2–4 V) and 30 V VDS rating allow implementation in high-side configurations using bootstrap or charge-pump gate drivers. The LFPAK mounting base must be isolated from system ground when used high-side, and layout must minimize source inductance to prevent shoot-through during transitions.
What is the maximum allowable PCB copper area for thermal performance?
Nexperia recommends ≥200 mm² of 2 oz copper connected to the mounting base for optimal thermal performance. With this layout, the device achieves its rated 67 A continuous current at Tmb = 25 °C; reducing copper area proportionally increases Rth(j-mb) and requires current derating per Figure 2 in the datasheet.
Does BUK7Y10-30B include integrated ESD protection?
No - BUK7Y10-30B does not integrate ESD protection circuitry. It relies on external TVS diodes or layout-level guarding for HBM/CDM protection. Gate leakage (≤100 nA at ±20 V) and VGS rating (±20 V) indicate sensitivity to overvoltage; proper handling and board-level protection are required per AEC-Q100 guidelines.
Can this MOSFET replace older BUK7K10-30B designs?
Yes - BUK7Y10-30B is a direct drop-in replacement for BUK7K10-30B with identical pinout, package (SOT669), and electrical specifications. It offers improved thermal resistance (1.76 K/W vs. 1.85 K/W) and updated AEC-Q101 qualification to Rev G, making it suitable for new designs and legacy refreshes without layout changes.
BUK7Y10-30B,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 67A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 10mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 18.8 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1183 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 85W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK7Y10-30B,115 FAQ
1.How can I place an order for BUK7Y10-30B,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7Y10-30B,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7Y10-30B,115 reliable?
The price and inventory of BUK7Y10-30B,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y10-30B,115 is usually 5 days.
3.What payment methods are accepted for BUK7Y10-30B,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y10-30B,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7Y10-30B,115?
BUK7Y10-30B,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7Y10-30B,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7Y10-30B,115?
For technical support, including BUK7Y10-30B,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y10-30B,115 requirements.
6.How does Aetrix verify that BUK7Y10-30B,115 is sourced from the original manufacturer or authorized distributors?
All BUK7Y10-30B,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y10-30B,115 meets industry standards.
7.What is the process for return or replacement of BUK7Y10-30B,115?
All BUK7Y10-30B,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y10-30B,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7Y10-30B,115 part is unused and in its original packaging.
Return procedure for BUK7Y10-30B,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK7Y10-30B,115 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
