NXP Semiconductors BUK7Y25-40B/C,115
- Part No.:
- BUK7Y25-40B/C,115
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK7Y25-40B/C,115.pdf
- Description:
- MOSFET N-CH 40V 35.3A LFPAK56
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BUK7Y25-40B/C,115 from Nexperia is an AEC-Q101 qualified N-channel TrenchMOS standard-level power MOSFET in LFPAK (SOT669) package, rated for 40 V VDS, 35.3 A continuous drain current at Tmb = 25 °C, and 175 °C junction temperature. It serves as a robust high-current switch in automotive 12 V systems for motors, lamps, and solenoids.
For engineers reviewing the BUK7Y25-40B/C,115 datasheet, BUK7Y25-40B/C,115 pinout, BUK7Y25-40B/C,115 application, or BUK7Y25-40B/C,115 equivalent, key selection criteria include its 20–25 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, 37 mJ non-repetitive avalanche energy, thermal resistance of 2.53 K/W (junction-to-mounting base), gate-drive compatibility with standard 10 V logic, and LFPAK package's low-inductance source connection.
Technical Context
This MOSFET employs Nexperia's High-Performance Automotive (HPA) TrenchMOS technology to deliver stable on-resistance across -55 °C to 175 °C operating range and withstand unclamped inductive switching events up to 37 mJ. Its gate threshold voltage (VGS(th)) ranges from 1 V at Tj = 175 °C to 4.4 V at Tj = -55 °C, ensuring reliable turn-on under thermal extremes.
The device features a 4-pin LFPAK package with three parallel source terminals and one gate terminal, enabling low-stray-inductance PCB layout and efficient heat transfer via the exposed mounting base connected to drain. Its dynamic parameters-QGD = 5.12 nC, QG(tot) = 12.1 nC, and Ciss = 520–693 pF-support fast, controlled switching in thermally demanding automotive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V maximum drain-source voltage - supports full 12 V automotive battery transients including load dump. |
| RDS(on) | 20–25 mΩ at VGS = 10 V, ID = 20 A, Tj = 25 °C - enables low conduction loss in high-current switching paths. |
| ID (continuous) | 35.3 A at Tmb = 25 °C - delivers high steady-state current capability with minimal heatsinking. |
| Ptot | 59.4 W at Tmb = 25 °C - reflects high power handling enabled by low Rth(j-mb) = 2.53 K/W. |
| EDS(AL)S | 37 mJ non-repetitive avalanche energy - ensures ruggedness against inductive kickback in motor/solenoid drive. |
| VGS(th) | 2–4 V typical gate threshold - compatible with standard 5 V/10 V microcontroller outputs without level shifting. |
| QGD | 5.12 nC gate-drain charge - determines Miller plateau duration and influences switching speed and EMI behavior. |
Pinout & Package
Package: SOT669 (LFPAK), plastic single-ended surface-mounted package with exposed mounting base (drain-connected) and 4 leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel low-inductance source connections - reduce loop inductance and improve switching stability. |
| 4 | Gate (G) | Control input for standard-level 10 V drive - no external gate driver required in most 12 V automotive MCU interfaces. |
| Mounting base (mb) | Drain (D) | Exposed copper pad electrically connected to drain - provides primary thermal path and mechanical anchoring. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive safety-critical applications per stress test requirements, including temperature cycling and HTRB. |
| 175 °C maximum junction temperature | Enables operation in engine bay and other thermally harsh locations without derating penalties beyond ambient limits. |
| Standard-level gate drive (VGS = 10 V) | Direct interface with common 5 V/10 V logic and MCU GPIOs - eliminates need for gate driver ICs in many designs. |
| Low Rth(j-mb) = 2.53 K/W | Maximizes thermal efficiency by minimizing junction-to-PCB thermal resistance - critical for compact, high-power modules. |
| Three-source-pin configuration | Reduces source inductance and improves current sharing - enhances dv/dt immunity and reduces switching overshoot. |
Applications
| Automotive Body Control Module (BCM) | Engine Cooling Fan Driver |
|---|---|
|
Use Scenario: Switching 12 V resistive and inductive loads such as door locks, window lifts, and interior lighting in vehicle body control units. IC Role / Device Role / Timing Role: High-side or low-side power switch controlling load current with fast turn-on/turn-off and avalanche energy absorption. Use Value: 35.3 A continuous rating and 37 mJ avalanche ruggedness ensure reliable operation during frequent load switching and inductive flyback events. |
Use Scenario: Driving brushed DC cooling fans in engine compartments where ambient temperatures exceed 100 °C. IC Role / Device Role / Timing Role: Low-side switching element delivering PWM-controlled current with minimal conduction loss and thermal rise. Use Value: 175 °C junction rating and 20–25 mΩ RDS(on) maintain efficiency and reliability even at elevated mounting base temperatures. |
| Automotive HVAC Blower Motor | Trailer Light Load Switch |
|
Use Scenario: Controlling variable-speed blower motors in heating, ventilation, and air conditioning systems. IC Role / Device Role / Timing Role: Power stage switch modulated via PWM to regulate airflow; handles stall currents and startup surges. Use Value: Peak drain current of 141 A (10 µs pulse) and robust SOA support safe motor startup and stall conditions without failure. |
Use Scenario: Replacing mechanical relays for trailer brake lights, turn signals, and running lights in towing systems. IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays - provides silent, bounce-free, and long-life switching. Use Value: Standard-level gate drive and AEC-Q101 qualification ensure drop-in compatibility with existing relay driver circuits and automotive durability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BUK7K25-40E,115 | Enhancement-mode variant with identical 40 V/35.3 A rating but optimized for 4.5 V gate drive; RDS(on) = 22–28 mΩ at VGS = 4.5 V. | Better suited for low-voltage MCU interfaces (e.g., 3.3 V logic with gate driver); less margin at 10 V than BUK7Y25-40B/C,115. | Select when system uses <4.5 V gate drive or requires tighter RDS(on) tolerance at lower VGS. |
| IPB180N04S4-02 | 40 V TrenchFET with 180 A pulsed rating, 2.0 mΩ RDS(on), TO-263 package; higher current density but larger footprint and different thermal path. | Targeted at high-power industrial inverters or EV auxiliary systems - not AEC-Q101 qualified and lacks LFPAK's mounting-base thermal advantage. | Choose only if >35 A continuous current or sub-5 mΩ RDS(on) is mandatory and automotive qualification is not required. |
Compared with BUK7Y25-40B/C,115, the BUK7K25-40E,115 offers better low-VGS performance but sacrifices some 10 V drive margin, while the IPB180N04S4-02 delivers vastly superior RDS(on) and current capability at the cost of automotive qualification, package size, and thermal interface design complexity.
Availability
BUK7Y25-40B/C,115 is available at Aetrix Electronics and suitable for automotive body electronics, engine bay power distribution, and industrial 12 V DC load switching requiring stable component supply, long-term lifecycle assurance, and AEC-Q101 compliance.
Supply support for BUK7Y25-40B/C,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with leadership in automotive-qualified components and advanced packaging.
The BUK7Y25-40B/C,115 belongs to Nexperia's High-Performance Automotive (HPA) TrenchMOS family, engineered specifically for robust, thermally resilient power switching in automotive 12 V systems where reliability under extreme temperature and transient stress is mandatory.
FAQ
What is the maximum continuous drain current rating for BUK7Y25-40B/C,115?
The BUK7Y25-40B/C,115 supports 35.3 A continuous drain current at mounting base temperature (Tmb) = 25 °C, derating to 25 A at Tmb = 100 °C. This rating assumes proper PCB copper area for thermal dissipation and is validated per Figure 1 in the official datasheet. The BUK7Y25-40B/C,115 achieves this with its low Rth(j-mb) = 2.53 K/W and LFPAK package's direct mounting base thermal path.
Is BUK7Y25-40B/C,115 qualified for automotive use?
Yes, the BUK7Y25-40B/C,115 is fully AEC-Q101 qualified and designed to the Nexperia High-Performance Automotive (HPA) standard for use in safety-critical automotive applications. It has undergone rigorous stress testing including temperature cycling, high-temperature reverse bias, and humidity testing, and is rated for operation from -55 °C to +175 °C junction temperature.
What is the gate threshold voltage range of BUK7Y25-40B/C,115?
The BUK7Y25-40B/C,115 exhibits a gate-source threshold voltage (VGS(th)) ranging from 1 V (minimum) at Tj = 175 °C to 4.4 V (maximum) at Tj = -55 °C, with a typical value of 3 V at Tj = 25 °C. This wide operational window ensures consistent turn-on behavior across automotive temperature extremes and compatibility with standard 10 V gate drive sources.
Does BUK7Y25-40B/C,115 have avalanche capability?
Yes, the BUK7Y25-40B/C,115 is rated for non-repetitive drain-source avalanche energy (EDS(AL)S) of 37 mJ under specified conditions (ID = 35.3 A, Vsup ≤ 40 V, RGS = 50 Ω, VGS = 10 V, Tj(init) = 25 °C, unclamped). This ruggedness is essential for driving inductive loads like motors and solenoids where flyback voltage spikes occur.
What package type does BUK7Y25-40B/C,115 use, and how is it mounted?
The BUK7Y25-40B/C,115 uses the SOT669 (LFPAK) package - a plastic single-ended surface-mounted outline with four leads and an exposed copper mounting base. The mounting base is electrically connected to the drain and serves as the primary thermal interface; it must be soldered to a large PCB copper pour for optimal heat dissipation and mechanical stability.
BUK7Y25-40B/C,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 35.3A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 25mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.1 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 693 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 59.4W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK7Y25-40B/C,115 FAQ
1.How can I place an order for BUK7Y25-40B/C,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7Y25-40B/C,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7Y25-40B/C,115 reliable?
The price and inventory of BUK7Y25-40B/C,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y25-40B/C,115 is usually 5 days.
3.What payment methods are accepted for BUK7Y25-40B/C,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y25-40B/C,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7Y25-40B/C,115?
BUK7Y25-40B/C,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7Y25-40B/C,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7Y25-40B/C,115?
For technical support, including BUK7Y25-40B/C,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y25-40B/C,115 requirements.
6.How does Aetrix verify that BUK7Y25-40B/C,115 is sourced from the original manufacturer or authorized distributors?
All BUK7Y25-40B/C,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y25-40B/C,115 meets industry standards.
7.What is the process for return or replacement of BUK7Y25-40B/C,115?
All BUK7Y25-40B/C,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y25-40B/C,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7Y25-40B/C,115 part is unused and in its original packaging.
Return procedure for BUK7Y25-40B/C,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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