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NXP Semiconductors BUK7Y25-40B/C,115

Part No.:
BUK7Y25-40B/C,115
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
SC-100, SOT-669
Datasheet:
AetrixBUK7Y25-40B/C,115.pdf
Description:
MOSFET N-CH 40V 35.3A LFPAK56
Quantity:
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Inventory:8,913

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Product details

Overview

BUK7Y25-40B/C,115 from Nexperia is an AEC-Q101 qualified N-channel TrenchMOS standard-level power MOSFET in LFPAK (SOT669) package, rated for 40 V VDS, 35.3 A continuous drain current at Tmb = 25 °C, and 175 °C junction temperature. It serves as a robust high-current switch in automotive 12 V systems for motors, lamps, and solenoids.

For engineers reviewing the BUK7Y25-40B/C,115 datasheet, BUK7Y25-40B/C,115 pinout, BUK7Y25-40B/C,115 application, or BUK7Y25-40B/C,115 equivalent, key selection criteria include its 20–25 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, 37 mJ non-repetitive avalanche energy, thermal resistance of 2.53 K/W (junction-to-mounting base), gate-drive compatibility with standard 10 V logic, and LFPAK package's low-inductance source connection.

Technical Context

This MOSFET employs Nexperia's High-Performance Automotive (HPA) TrenchMOS technology to deliver stable on-resistance across -55 °C to 175 °C operating range and withstand unclamped inductive switching events up to 37 mJ. Its gate threshold voltage (VGS(th)) ranges from 1 V at Tj = 175 °C to 4.4 V at Tj = -55 °C, ensuring reliable turn-on under thermal extremes.

The device features a 4-pin LFPAK package with three parallel source terminals and one gate terminal, enabling low-stray-inductance PCB layout and efficient heat transfer via the exposed mounting base connected to drain. Its dynamic parameters-QGD = 5.12 nC, QG(tot) = 12.1 nC, and Ciss = 520–693 pF-support fast, controlled switching in thermally demanding automotive environments.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V maximum drain-source voltage - supports full 12 V automotive battery transients including load dump.
RDS(on) 20–25 mΩ at VGS = 10 V, ID = 20 A, Tj = 25 °C - enables low conduction loss in high-current switching paths.
ID (continuous) 35.3 A at Tmb = 25 °C - delivers high steady-state current capability with minimal heatsinking.
Ptot 59.4 W at Tmb = 25 °C - reflects high power handling enabled by low Rth(j-mb) = 2.53 K/W.
EDS(AL)S 37 mJ non-repetitive avalanche energy - ensures ruggedness against inductive kickback in motor/solenoid drive.
VGS(th) 2–4 V typical gate threshold - compatible with standard 5 V/10 V microcontroller outputs without level shifting.
QGD 5.12 nC gate-drain charge - determines Miller plateau duration and influences switching speed and EMI behavior.

Pinout & Package

Package: SOT669 (LFPAK), plastic single-ended surface-mounted package with exposed mounting base (drain-connected) and 4 leads.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3 Source (S) Three parallel low-inductance source connections - reduce loop inductance and improve switching stability.
4 Gate (G) Control input for standard-level 10 V drive - no external gate driver required in most 12 V automotive MCU interfaces.
Mounting base (mb) Drain (D) Exposed copper pad electrically connected to drain - provides primary thermal path and mechanical anchoring.

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive safety-critical applications per stress test requirements, including temperature cycling and HTRB.
175 °C maximum junction temperature Enables operation in engine bay and other thermally harsh locations without derating penalties beyond ambient limits.
Standard-level gate drive (VGS = 10 V) Direct interface with common 5 V/10 V logic and MCU GPIOs - eliminates need for gate driver ICs in many designs.
Low Rth(j-mb) = 2.53 K/W Maximizes thermal efficiency by minimizing junction-to-PCB thermal resistance - critical for compact, high-power modules.
Three-source-pin configuration Reduces source inductance and improves current sharing - enhances dv/dt immunity and reduces switching overshoot.

Applications

Automotive Body Control Module (BCM) Engine Cooling Fan Driver

Use Scenario: Switching 12 V resistive and inductive loads such as door locks, window lifts, and interior lighting in vehicle body control units.

IC Role / Device Role / Timing Role: High-side or low-side power switch controlling load current with fast turn-on/turn-off and avalanche energy absorption.

Use Value: 35.3 A continuous rating and 37 mJ avalanche ruggedness ensure reliable operation during frequent load switching and inductive flyback events.

Use Scenario: Driving brushed DC cooling fans in engine compartments where ambient temperatures exceed 100 °C.

IC Role / Device Role / Timing Role: Low-side switching element delivering PWM-controlled current with minimal conduction loss and thermal rise.

Use Value: 175 °C junction rating and 20–25 mΩ RDS(on) maintain efficiency and reliability even at elevated mounting base temperatures.

Automotive HVAC Blower Motor Trailer Light Load Switch

Use Scenario: Controlling variable-speed blower motors in heating, ventilation, and air conditioning systems.

IC Role / Device Role / Timing Role: Power stage switch modulated via PWM to regulate airflow; handles stall currents and startup surges.

Use Value: Peak drain current of 141 A (10 µs pulse) and robust SOA support safe motor startup and stall conditions without failure.

Use Scenario: Replacing mechanical relays for trailer brake lights, turn signals, and running lights in towing systems.

IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays - provides silent, bounce-free, and long-life switching.

Use Value: Standard-level gate drive and AEC-Q101 qualification ensure drop-in compatibility with existing relay driver circuits and automotive durability requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
BUK7K25-40E,115 Enhancement-mode variant with identical 40 V/35.3 A rating but optimized for 4.5 V gate drive; RDS(on) = 22–28 mΩ at VGS = 4.5 V. Better suited for low-voltage MCU interfaces (e.g., 3.3 V logic with gate driver); less margin at 10 V than BUK7Y25-40B/C,115. Select when system uses <4.5 V gate drive or requires tighter RDS(on) tolerance at lower VGS.
IPB180N04S4-02 40 V TrenchFET with 180 A pulsed rating, 2.0 mΩ RDS(on), TO-263 package; higher current density but larger footprint and different thermal path. Targeted at high-power industrial inverters or EV auxiliary systems - not AEC-Q101 qualified and lacks LFPAK's mounting-base thermal advantage. Choose only if >35 A continuous current or sub-5 mΩ RDS(on) is mandatory and automotive qualification is not required.

Compared with BUK7Y25-40B/C,115, the BUK7K25-40E,115 offers better low-VGS performance but sacrifices some 10 V drive margin, while the IPB180N04S4-02 delivers vastly superior RDS(on) and current capability at the cost of automotive qualification, package size, and thermal interface design complexity.

Availability

BUK7Y25-40B/C,115 is available at Aetrix Electronics and suitable for automotive body electronics, engine bay power distribution, and industrial 12 V DC load switching requiring stable component supply, long-term lifecycle assurance, and AEC-Q101 compliance.

Supply support for BUK7Y25-40B/C,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with leadership in automotive-qualified components and advanced packaging.

The BUK7Y25-40B/C,115 belongs to Nexperia's High-Performance Automotive (HPA) TrenchMOS family, engineered specifically for robust, thermally resilient power switching in automotive 12 V systems where reliability under extreme temperature and transient stress is mandatory.

FAQ

What is the maximum continuous drain current rating for BUK7Y25-40B/C,115?

The BUK7Y25-40B/C,115 supports 35.3 A continuous drain current at mounting base temperature (Tmb) = 25 °C, derating to 25 A at Tmb = 100 °C. This rating assumes proper PCB copper area for thermal dissipation and is validated per Figure 1 in the official datasheet. The BUK7Y25-40B/C,115 achieves this with its low Rth(j-mb) = 2.53 K/W and LFPAK package's direct mounting base thermal path.

Is BUK7Y25-40B/C,115 qualified for automotive use?

Yes, the BUK7Y25-40B/C,115 is fully AEC-Q101 qualified and designed to the Nexperia High-Performance Automotive (HPA) standard for use in safety-critical automotive applications. It has undergone rigorous stress testing including temperature cycling, high-temperature reverse bias, and humidity testing, and is rated for operation from -55 °C to +175 °C junction temperature.

What is the gate threshold voltage range of BUK7Y25-40B/C,115?

The BUK7Y25-40B/C,115 exhibits a gate-source threshold voltage (VGS(th)) ranging from 1 V (minimum) at Tj = 175 °C to 4.4 V (maximum) at Tj = -55 °C, with a typical value of 3 V at Tj = 25 °C. This wide operational window ensures consistent turn-on behavior across automotive temperature extremes and compatibility with standard 10 V gate drive sources.

Does BUK7Y25-40B/C,115 have avalanche capability?

Yes, the BUK7Y25-40B/C,115 is rated for non-repetitive drain-source avalanche energy (EDS(AL)S) of 37 mJ under specified conditions (ID = 35.3 A, Vsup ≤ 40 V, RGS = 50 Ω, VGS = 10 V, Tj(init) = 25 °C, unclamped). This ruggedness is essential for driving inductive loads like motors and solenoids where flyback voltage spikes occur.

What package type does BUK7Y25-40B/C,115 use, and how is it mounted?

The BUK7Y25-40B/C,115 uses the SOT669 (LFPAK) package - a plastic single-ended surface-mounted outline with four leads and an exposed copper mounting base. The mounting base is electrically connected to the drain and serves as the primary thermal interface; it must be soldered to a large PCB copper pour for optimal heat dissipation and mechanical stability.

BUK7Y25-40B/C,115 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
TrenchMOS™
Package/Case:
SC-100, SOT-669
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
35.3A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
25mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
12.1 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
693 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
59.4W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56, Power-SO8

BUK7Y25-40B/C,115 FAQ

1.How can I place an order for BUK7Y25-40B/C,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK7Y25-40B/C,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK7Y25-40B/C,115 reliable?

The price and inventory of BUK7Y25-40B/C,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y25-40B/C,115 is usually 5 days.

3.What payment methods are accepted for BUK7Y25-40B/C,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y25-40B/C,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK7Y25-40B/C,115?

BUK7Y25-40B/C,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK7Y25-40B/C,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK7Y25-40B/C,115?

For technical support, including BUK7Y25-40B/C,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y25-40B/C,115 requirements.

6.How does Aetrix verify that BUK7Y25-40B/C,115 is sourced from the original manufacturer or authorized distributors?

All BUK7Y25-40B/C,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y25-40B/C,115 meets industry standards.

7.What is the process for return or replacement of BUK7Y25-40B/C,115?

All BUK7Y25-40B/C,115 units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y25-40B/C,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK7Y25-40B/C,115 part is unused and in its original packaging.

Return procedure for BUK7Y25-40B/C,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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