Nexperia USA Inc. BUK7Y2R0-40HX

Overview

BUK7Y2R0-40HX from Nexperia is an AEC-Q101 qualified N-channel automotive MOSFET with 40 V V_DS, 2.0 mΩ R_DS(on) at V_GS = 10 V and T_j = 25 °C, housed in LFPAK56 (SOT669) package. It delivers 120 A continuous drain current at T_mb = 25 °C and supports ultra-high-performance power switching in thermally demanding 12 V automotive systems.

For engineers reviewing the BUK7Y2R0-40HX datasheet, BUK7Y2R0-40HX pinout, BUK7Y2R0-40HX application, or BUK7Y2R0-40HX equivalent, key selection criteria include its 175 °C junction rating, Trench 9 Superjunction architecture for enhanced SOA/avalanche ruggedness, LFPAK copper clip thermal performance (R_th(j-mb) = 0.5 K/W typ), and gull-wing lead design enabling AOI inspection and high board-level reliability.

Technical Context

This MOSFET employs Trench 9 low-ohmic superjunction technology to achieve reduced cell pitch, yielding lower R_DS(on) and improved power density within the LFPAK56 footprint. Its tight V_GS(th) limits (2.4–3.6 V at 25 °C) support stable paralleling in high-current designs.

The LFPAK56 package integrates a copper clip connecting die to mounting base (drain), delivering 0.5 K/W typical thermal resistance and enabling 217 W total power dissipation at T_mb = 25 °C. Gull-wing leads provide mechanical stress absorption during thermal cycling and facilitate visual solder joint inspection.

Key Specifications

Pinout & Package

LFPAK56 (SOT669) is a plastic single-ended surface-mounted package with gull-wing leads and internal copper clip connecting die to exposed mounting base (drain). The package provides high board-level reliability, AOI-compatible solder joints, and optimized thermal path to PCB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Compared with STL220N4F7AG, BUK7Y2R0-40HX adds AEC-Q101 qualification and superior thermal performance; versus NTMFS4C09NT1G, it delivers 10% lower R_DS(on) and 33% better thermal resistance - critical for sustained 120 A operation in transmission control modules.

Availability

BUK7Y2R0-40HX is available at Aetrix Electronics and suitable for automotive power distribution, start-stop micro-hybrid systems, and transmission control modules requiring stable component supply across multi-year production lifecycles.

Supply support for BUK7Y2R0-40HX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors for automotive, industrial, and consumer applications, with leadership in MOSFETs, logic, and ESD protection.

This device belongs to Nexperia's Automotive Logic and Power portfolio, engineered specifically for high-reliability 12 V vehicle electrification - emphasizing AEC-Q101 compliance, thermal resilience, and robustness in safety-critical power switching.

FAQ

What is the maximum continuous drain current for BUK7Y2R0-40HX at 100 °C mounting base temperature?

At T_mb = 100 °C, the normalized power derating curve (Fig. 1) shows ~55% P_tot retention. With P_tot = 217 W at 25 °C, this yields ~120 W max dissipation. Using R_DS(on) = 2.33 mΩ at T_j = 105 °C (Table 7), the corresponding continuous I_D is approximately 72 A - confirmed by SOA graph (Fig. 2) intersection at V_DS ≈ 1.7 V.

Does BUK7Y2R0-40HX support gate drive from 3.3 V microcontrollers?

No - its V_GS(th) min is 2.4 V at 25 °C and rises to 1.0 V at 175 °C, but full enhancement requires V_GS ≥ 10 V for rated R_DS(on). At 3.3 V, R_DS(on) exceeds 20 mΩ (per Fig. 6), causing excessive conduction loss. A level-shifting driver or 5–10 V gate supply is mandatory for automotive-grade performance.

How does the LFPAK56 mounting base connect electrically in circuit?

The mounting base (mb) is internally connected to the drain terminal - it is not isolated. This requires PCB layout with a dedicated drain copper pour tied to the high-side or low-side drain net. Thermal vias must be placed under the mb pad, but electrical isolation from other nets is essential to prevent short circuits.

Is BUK7Y2R0-40HX suitable for synchronous rectification in 40 V DC-DC converters?

Yes - its 40 V V_DS, low Q_GD/Q_G ratio (0.21), and 29 ns t_rr enable efficient high-frequency (>200 kHz) synchronous rectification. However, the body diode's softness factor (S = 0.8) and 21 nC Q_r require careful dead-time optimization to avoid cross-conduction losses in buck or half-bridge topologies.