Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Nexperia USA Inc. BUK7Y41-80EX

Name: BUK7Y41-80EX
Brand: Nexperia USA Inc.
SKU: BUK7Y41-80EX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BUK7Y41-80EX

Manufacturer:: Nexperia USA Inc.

Category:: FETs, MOSFETs

Package:: SC-100, SOT-669

Datasheet:: BUK7Y41-80EX.pdf

Description:: MOSFET N-CH 80V 25A LFPAK56

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,869

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BUK7Y41-80EX from Nexperia is an AEC-Q101 qualified N-channel standard-level MOSFET in LFPAK56 (SOT669) package, rated for 80 V V_DS, 41 mΩ R_DS(on) at 10 V V_GS and 25 °C, and 175 °C junction temperature. It delivers 25 A continuous drain current at T_mb = 25 °C and supports repetitive avalanche operation - deployed in automotive transmission control and high-reliability 12–48 V power switching.

For engineers reviewing the BUK7Y41-80EX datasheet, BUK7Y41-80EX pinout, BUK7Y41-80EX application, or BUK7Y41-80EX equivalent, key selection criteria include its true standard-level gate (V_GS(th) > 1 V at 175 °C), low thermal resistance (R_th(j-mb) = 2.31 K/W), and Q101-compliant ruggedness for thermally demanding automotive environments.

Technical Context

This MOSFET uses TrenchMOS technology to achieve stable R_DS(on) performance across -55 °C to 175 °C junction temperature range, with V_GS(th) maintained above 1 V even at maximum rated temperature. Its LFPAK56 package integrates a thermally optimized mounting base directly connected to the drain, enabling efficient heat transfer to PCB copper.

The device features fully characterized dynamic parameters including Q_GD = 5.1 nC, C_iss = 841–1119 pF, and fast switching times (t_r = 6.6 ns, t_f = 7.4 ns), supporting high-frequency PWM control in motor and solenoid drivers without compromising avalanche robustness (E_AS = 23.8 mJ).

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	80 V - Maximum drain-source blocking voltage compatible with 48 V automotive systems and transient overvoltage tolerance.
R_DS(on)	29.6–41 mΩ @ V_GS = 10 V, I_D = 5 A, T_j = 25 °C - Low conduction loss enabling high-efficiency power stage design.
I_D (continuous)	25 A @ T_mb = 25 °C - Sustained current capability suitable for high-power lamp/motor loads with adequate heatsinking.
P_tot	64 W @ T_mb = 25 °C - Total power dissipation limit defining thermal design margin under steady-state operation.
R_th(j-mb)	2.31 K/W - Junction-to-mounting-base thermal resistance enabling direct thermal path to PCB ground plane or heatsink.
V_GS(th)	>1 V @ T_j = 175 °C - Guaranteed turn-on threshold at max operating temperature ensures reliable gate drive in hot under-hood environments.
E_AS	23.8 mJ - Non-repetitive avalanche energy rating confirming ruggedness against inductive switching transients.

Pinout & Package

LFPAK56 (SOT669) is a surface-mount plastic package with exposed mounting base for enhanced thermal and electrical performance. The base is internally connected to the drain terminal, enabling low-inductance, high-current routing and efficient PCB heat spreading.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3	Source (S)	Three parallel source terminals reduce bond wire inductance and improve current sharing in high-di/dt switching.
4	Gate (G)	Single gate input with low Q_G(tot) = 16.4 nC, enabling fast, low-loss switching with standard gate drivers.
Mounting Base (mb)	Drain (D)	Exposed copper pad electrically and thermally connected to drain - must be soldered to large PCB copper area for thermal management and EMI control.

Key Features

Feature	Design Value
AEC-Q101 qualification	Validated for automotive-grade reliability including temperature cycling, HTRB, and humidity testing per JESD22-A108.
Repetitive avalanche rating	Rated for repeated unclamped inductive switching events up to 23.8 mJ, eliminating need for external snubbers in many solenoid/motor circuits.
175 °C maximum junction temperature	Enables operation in engine bay or transmission control modules without derating in ambient temperatures up to 125 °C.
True standard-level gate	V_GS(th) > 1 V at 175 °C ensures compatibility with 3.3 V/5 V microcontroller GPIOs without level-shifting in safety-critical subsystems.
Low R_DS(on) × Q_G figure of merit	~675 mΩ·nC - Balances conduction and switching losses for high-efficiency 100–500 kHz PWM applications.

Applications

Transmission Control Module

Engine Cooling Fan Driver

Use Scenario: High-side switching of electromagnetic actuators and solenoids in automatic transmission valve bodies.

IC Role / Device Role / Timing Role: Power switch controlling 12–24 V, 5–15 A solenoid coils with precise pulse-width modulation for pressure regulation.

Use Value: Repetitive avalanche rating absorbs coil flyback energy without external diodes; 175 °C rating sustains operation near hot gearbox housing.

Use Scenario: PWM-controlled DC brushless fan in engine cooling system with variable speed demand.

IC Role / Device Role / Timing Role: Low-side switching element handling up to 25 A peak current during startup and stall conditions.

Use Value: 41 mΩ R_DS(on) minimizes conduction loss at full load; LFPAK56 thermal performance enables compact heatsink-free PCB layout.

48 V Mild Hybrid Starter-Generator

LED Headlamp Matrix Switch

Use Scenario: High-current power distribution in 48 V battery-fed starter-generator inverters and DC-DC converters.

IC Role / Device Role / Timing Role: Synchronous rectifier or high-side switch in buck/boost stages operating at 100–200 kHz.

Use Value: Low Q_GD (5.1 nC) and fast switching (t_r/t_f < 8 ns) reduce switching losses; 80 V rating accommodates 48 V bus transients.

Use Scenario: Individual pixel-level on/off control in adaptive LED headlamps requiring high reliability and thermal resilience.

IC Role / Device Role / Timing Role: Low-side driver for segmented LED strings with rapid dimming response and fault isolation.

Use Value: Standard-level gate allows direct MCU control; 175 °C rating ensures long-term stability inside sealed headlamp housings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STL220N4F7AG	40 V V_DS, 0.75 mΩ R_DS(on), 220 A I_D, PowerFLAT 5x6 package	Lower voltage rating limits use to 24 V systems only; higher current capacity suits larger motors but requires more gate drive.	Select when ultra-low R_DS(on) and high current are prioritized over 48 V compatibility and thermal robustness at 175 °C.
ON Semiconductor NTMFS4C09NT1G	40 V V_DS, 0.95 mΩ R_DS(on), 120 A I_D, SO-8FL package	Not AEC-Q101 qualified; lacks repetitive avalanche rating and 175 °C V_GS(th) guarantee.	Consider only for non-automotive industrial applications where cost and R_DS(on) dominate over automotive qualification and thermal margin.

Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK7Y41-80EX uniquely balances 80 V capability, AEC-Q101 compliance, 175 °C operation, and proven avalanche ruggedness - making it the preferred choice for safety-critical 12–48 V automotive power switching where qualification and thermal resilience are mandatory.

Availability

BUK7Y41-80EX is available at Aetrix Electronics and suitable for automotive transmission control, engine cooling fan drivers, and 48 V mild hybrid power distribution requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for BUK7Y41-80EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, high-reliability discrete, logic, and MOSFET solutions - with leadership in automotive-qualified components and advanced packaging technologies.

BUK7Y41-80EX belongs to Nexperia's LFPAK automotive MOSFET product line, engineered specifically for high-current, high-temperature automotive power switching applications requiring AEC-Q101 qualification and robust avalanche performance.

FAQ

Is BUK7Y41-80EX pin-compatible with other LFPAK56 MOSFETs?

Yes - BUK7Y41-80EX uses the standard LFPAK56 (SOT669) footprint with pins 1–3 as source, pin 4 as gate, and the mounting base as drain. This matches mechanical and thermal layout requirements of all Nexperia LFPAK56 N-channel devices, enabling drop-in replacement within same voltage/current class.

What gate drive voltage is required for full enhancement?

A minimum V_GS of 10 V is specified for guaranteed R_DS(on) ≤ 41 mΩ at 25 °C. The device remains fully enhanced down to V_GS = 4.5 V (per Fig. 7), and its V_GS(th) > 1 V at 175 °C ensures turn-on with standard 3.3 V or 5 V logic-level drivers under worst-case thermal conditions.

Does BUK7Y41-80EX require an external freewheeling diode in inductive loads?

No - the integrated body diode is rated for 25 A continuous source current and exhibits t_rr = 24 ns and Q_r = 28.6 nC, enabling efficient freewheeling in typical automotive solenoid and motor applications. Its repetitive avalanche rating further eliminates need for external clamping in most designs.

How is thermal performance affected by PCB copper area under the mounting base?

R_th(j-mb) = 2.31 K/W assumes optimal soldering of the mounting base to ≥ 100 mm² of 2 oz copper. Doubling copper area reduces thermal resistance by ~15%; insufficient copper or poor solder voiding can degrade R_th by >50%, risking thermal runaway at high I_D.

BUK7Y41-80EX Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: TrenchMOS™

Package/Case:: SC-100, SOT-669

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 80 V

Current - Continuous Drain (Id) @ 25°C:: 25A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 41mOhm @ 5A, 10V

Vgs(th) (Max) @ Id:: 4V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 16.4 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 1119 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 64W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q101

Mounting Type:: Surface Mount

Supplier Device Package:: LFPAK56, Power-SO8

BUK7Y41-80EX FAQ

1.How can I place an order for BUK7Y41-80EX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK7Y41-80EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK7Y41-80EX reliable?

The price and inventory of BUK7Y41-80EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y41-80EX is usually 5 days.

3.What payment methods are accepted for BUK7Y41-80EX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y41-80EX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK7Y41-80EX?

BUK7Y41-80EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK7Y41-80EX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK7Y41-80EX?

For technical support, including BUK7Y41-80EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y41-80EX requirements.

6.How does Aetrix verify that BUK7Y41-80EX is sourced from the original manufacturer or authorized distributors?

All BUK7Y41-80EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y41-80EX meets industry standards.

7.What is the process for return or replacement of BUK7Y41-80EX?

All BUK7Y41-80EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y41-80EX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK7Y41-80EX part is unused and in its original packaging.

Return procedure for BUK7Y41-80EX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…