Nexperia USA Inc. BUK7Y6R0-60EX
- Part No.:
- BUK7Y6R0-60EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
BUK7Y6R0-60EX.pdf
- Description:
- MOSFET N-CH 60V 100A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:14,855
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK7Y6R0-60EX from Nexperia is a standard-level N-channel MOSFET rated for 60 V drain-source voltage, 4 mΩ typical RDS(on) at 10 VGS and 25 A, and qualified to AEC-Q101 for automotive use. It delivers 100 A continuous drain current at Tmb = 25 °C in LFPAK56 (SOT669) package, with true standard gate drive compatibility (VGS(th) > 1 V at 175 °C), enabling direct replacement of legacy logic-level drivers in high-reliability 12 V systems.
For engineers reviewing the BUK7Y6R0-60EX datasheet, BUK7Y6R0-60EX pinout, BUK7Y6R0-60EX application, or BUK7Y6R0-60EX equivalent, key selection criteria include its 175 °C junction rating, repetitive avalanche capability, low thermal resistance (0.77 K/W j-to-mb), and validated performance in thermally constrained motor/solenoid control circuits.
Technical Context
This MOSFET employs TrenchMOS technology in an LFPAK56 package, integrating a robust source-drain diode with 29 ns reverse recovery time and 29 nC recovered charge. Its gate threshold remains functional up to 175 °C, ensuring stable turn-on behavior across full automotive temperature range without requiring gate voltage boosting.
The device features a mounting-base-connected drain (mb) terminal for direct thermal coupling to heatsinks, and its 4-pin configuration places three parallel source terminals to minimize bond-wire inductance and resistive loss-critical for high-current switching transients and avalanche energy handling (127 mJ unclamped).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V maximum - supports full 12 V automotive battery transient margin (ISO 7637-2 Pulse 5a: +75 V) with safety headroom. |
| RDS(on) | 4 mΩ typ @ VGS = 10 V, ID = 25 A, Tj = 25 °C - enables <1 W conduction loss at 50 A, reducing thermal load in compact modules. |
| ID (cont) | 100 A @ Tmb = 25 °C - limited by package thermal capacity, not silicon, allowing high peak current delivery in short-duty-cycle applications. |
| EAS | 127 mJ non-repetitive avalanche energy - sustains unclamped inductive switching events (e.g., solenoid de-energization) without failure. |
| Rth(j-mb) | 0.77 K/W - enables efficient heat transfer to PCB copper or external heatsink, supporting >85 A continuous operation at Tmb = 100 °C. |
| QGD | 12.1 nC - low gate-drain charge improves switching speed and reduces Miller-induced shoot-through risk in half-bridge configurations. |
| VGS(th) | >1 V @ Tj = 175 °C - ensures reliable turn-on with standard 5 V or 12 V microcontroller GPIOs under worst-case thermal stress. |
Pinout & Package
LFPAK56 (SOT669) is a surface-mount plastic package with exposed mounting base (drain-connected) and four leads: three parallel source pins and one gate pin. Its low-profile design (max height 1.20 mm) and optimized copper clip construction deliver superior power density and thermal performance versus SO-8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 (S) | Source | Three parallel source terminals reduce effective source inductance and resistance, improving current sharing and EMI during fast switching. |
| 4 (G) | Gate | Single gate input with 45.4 nC total gate charge - compatible with standard gate drivers delivering ≥1 A peak output. |
| mb (mounting base) | Drain | Exposed copper pad electrically connected to drain; serves as primary thermal path and high-current return node for PCB layout. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive underhood environments including temperature cycling, humidity, and mechanical shock per JESD47. |
| Repetitive avalanche rated | Rated for repeated unclamped inductive switching without degradation - critical for transmission valve control and fuel injector drivers. |
| 175 °C junction rating | Enables operation in engine bay locations where ambient exceeds 125 °C, eliminating need for derating or forced cooling. |
| True standard-level gate | VGS(th) > 1 V at 175 °C ensures consistent turn-on with 5 V/12 V logic without gate boosters or level shifters. |
| Low RDS(on) × QG figure-of-merit | 4 mΩ × 45.4 nC = 182 mΩ·nC - balances conduction and switching losses for high-efficiency 10–100 kHz PWM motor control. |
Applications
| Engine Control Module (ECM) Solenoid Driver | Automotive HVAC Blower Motor Controller |
|---|---|
Use Scenario: Driving 12 V fuel injectors or transmission shift solenoids with 50–100 ms on-time pulses and high inductive kickback. IC Role / Device Role / Timing Role: High-side or low-side power switch handling 5–15 A DC loads with fast turn-off to suppress back-EMF. Use Value: 127 mJ avalanche energy rating absorbs unclamped inductive energy without snubbers; 175 °C rating ensures reliability near hot exhaust manifolds. |
Use Scenario: PWM-controlled blower motor in passenger cabin, operating continuously at 25–80 A with ambient up to 85 °C. IC Role / Device Role / Timing Role: Low-side switching element in H-bridge or single-FET topology, modulated at 10–25 kHz. Use Value: 0.77 K/W thermal resistance maintains Tj < 150 °C at 80 A with minimal heatsinking; 4 mΩ RDS(on) limits conduction loss to <26 W. |
| 12 V Starter Relay Replacement | Electric Power Steering (EPS) Assist Motor Switch |
Use Scenario: Solid-state replacement for electromechanical starter relays in start-stop systems, handling 100–200 A cranking surges. IC Role / Device Role / Timing Role: High-current, low-duty-cycle power switch activated for ≤500 ms during engine cranking. Use Value: 482 A peak drain current (10 µs pulse) and 195 W Ptot support brief high-power bursts without thermal runaway. |
Use Scenario: Torque assist motor control in EPS systems, requiring precise 1–5 kHz PWM with fault tolerance and thermal resilience. IC Role / Device Role / Timing Role: Half-bridge low-side switch in 3-phase inverter, synchronized with gate driver for torque ripple minimization. Use Value: Low QGD (12.1 nC) and fast switching (tf = 21 ns) reduce dead-time distortion; AEC-Q101 qualification ensures ASIL-B compliance readiness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | 60 V, 2.2 mΩ RDS(on), 220 A ID, PowerFLAT 5x6 package; higher current but larger footprint and no AEC-Q101 certification. | Targeted at industrial motor drives, not automotive-qualified; lacks avalanche rating and 175 °C validation. | Select only if higher current and lower RDS(on) outweigh qualification requirements and board space constraints. |
| IRF1404ZPBF | 40 V, 3.8 mΩ RDS(on), TO-220 package; lower voltage rating and no automotive qualification or thermal performance data above 150 °C. | Suitable for 12 V non-automotive power supplies; cannot withstand ISO 7637-2 transients or extended 175 °C operation. | Use only in cost-sensitive, non-automotive designs where transient immunity and high-temperature reliability are not required. |
Compared with STL220N6F7 and IRF1404ZPBF, BUK7Y6R0-60EX uniquely combines AEC-Q101 qualification, 175 °C operation, 127 mJ avalanche ruggedness, and LFPAK56's superior thermal resistance-making it the only drop-in solution for thermally demanding, safety-critical automotive power switching.
Availability
BUK7Y6R0-60EX is available at Aetrix Electronics and suitable for automotive engine control, HVAC blower systems, and electric power steering requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for Tier 1 OEM programs.
Supply support for BUK7Y6R0-60EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.
BUK7Y6R0-60EX belongs to Nexperia's LFPAK automotive MOSFET product line, engineered specifically for high-current, high-temperature switching in 12 V vehicle subsystems where AEC-Q101 compliance and thermal robustness are mandatory.
FAQ
Is BUK7Y6R0-60EX pin-compatible with other LFPAK56 MOSFETs?
Yes - BUK7Y6R0-60EX uses the standard SOT669 footprint with identical pin 1–4 assignment (S, S, S, G) and mounting base connection. Mechanical compatibility is confirmed per Nexperia's package outline document sot669_po, enabling direct PCB layout reuse across qualified LFPAK56 N-channel devices.
What is the maximum safe operating temperature for continuous use?
The device is rated for continuous operation with junction temperature up to 175 °C, verified per AEC-Q101 stress testing. At Tmb = 100 °C, it supports 85 A continuous drain current; thermal design must ensure Rth(j-mb) ≤ 0.77 K/W and sufficient copper area under the mounting base to avoid exceeding this limit.
Does BUK7Y6R0-60EX require a gate resistor for automotive EMI compliance?
A gate resistor of 5 Ω is specified in the datasheet for switching characterization (Fig. 14), and recommended for EMI control in automotive applications. This value damps gate ringing, controls di/dt during turn-on/off, and aligns with CISPR 25 Class 5 radiated emission requirements when combined with proper PCB layout and shielding.
Can BUK7Y6R0-60EX replace logic-level MOSFETs in existing 5 V gate-drive designs?
No - BUK7Y6R0-60EX is a standard-level device requiring ≥10 VGS for full enhancement; its VGS(th) > 1 V at 175 °C ensures turn-on but does not guarantee low RDS(on) below 4.5 V. For 5 V logic drive, select Nexperia's BUK9Y series (logic-level) instead.
BUK7Y6R0-60EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 6mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 45.4 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4021 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 195W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
BUK7Y6R0-60EX FAQ
1.How can I place an order for BUK7Y6R0-60EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK7Y6R0-60EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK7Y6R0-60EX reliable?
The price and inventory of BUK7Y6R0-60EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y6R0-60EX is usually 5 days.
3.What payment methods are accepted for BUK7Y6R0-60EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y6R0-60EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK7Y6R0-60EX?
BUK7Y6R0-60EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK7Y6R0-60EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK7Y6R0-60EX?
For technical support, including BUK7Y6R0-60EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y6R0-60EX requirements.
6.How does Aetrix verify that BUK7Y6R0-60EX is sourced from the original manufacturer or authorized distributors?
All BUK7Y6R0-60EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y6R0-60EX meets industry standards.
7.What is the process for return or replacement of BUK7Y6R0-60EX?
All BUK7Y6R0-60EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y6R0-60EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK7Y6R0-60EX part is unused and in its original packaging.
Return procedure for BUK7Y6R0-60EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK7Y6R0-60EX Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
