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Nexperia USA Inc. BUK7Y7R0-40HX

Part No.:
BUK7Y7R0-40HX
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
SC-100, SOT-669
Datasheet:
AetrixBUK7Y7R0-40HX.pdf
Description:
MOSFET N-CH 40V 68A LFPAK56
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,745

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Product details

Overview

BUK7Y7R0-40HX from Nexperia is an AEC-Q101 qualified N-channel MOSFET using Trench 9 superjunction technology, housed in LFPAK56 (SOT669) package. It delivers 40 V VDS, 7.0 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, 68 A continuous drain current at Tmb = 25 °C, and 175 °C junction rating - deployed in automotive 12 V power switching for motor, lamp, and solenoid control.

For engineers reviewing the BUK7Y7R0-40HX datasheet, BUK7Y7R0-40HX pinout, BUK7Y7R0-40HX application, or BUK7Y7R0-40HX equivalent, this page provides verified electrical specs, thermal performance data, LFPAK56 mounting base thermal resistance (Rth(j-mb) = 2.17 K/W), avalanche energy rating (19.9 mJ), and gate charge profile (QGD = 3.7 nC typ) critical for high-reliability automotive power design.

Technical Context

This MOSFET employs Trench 9 superjunction architecture to achieve reduced cell pitch, enabling lower RDS(on) and improved SOA/avalanche ruggedness versus legacy TrenchMOS. Its tight VGS(th) range (2.4–3.6 V at 25 °C) supports stable parallel operation in high-current configurations.

The LFPAK56 package integrates copper clip technology and gull-wing leads: mounting base (drain-connected) provides direct thermal path to PCB, while dual-source terminals (Pins 1–3) and single gate (Pin 4) enable low-inductance, high-current routing with board-level reliability under thermal cycling.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 40 V - Maximum drain-source blocking voltage; defines safe operation in 12 V automotive systems with load dump transients up to 40 V.
RDS(on) 5.7 mΩ typ @ VGS = 10 V, ID = 15 A, Tj = 25 °C - Enables <1 W conduction loss at 40 A, critical for thermally constrained engine bay layouts.
ID (cont) 68 A @ Tmb = 25 °C - Demonstrated continuous current; actual system limit depends on PCB copper area and heatsinking per Fig. 2.
EAS 19.9 mJ - Non-repetitive avalanche energy at Tj(init) = 25 °C; supports robustness against inductive kickback in solenoid/motor switching.
QGD 3.7 nC typ - Gate-drain charge determines Miller plateau duration; enables fast, controllable turn-off in PWM-driven loads.
Rth(j-mb) 2.17 K/W - Junction-to-mounting-base thermal resistance; allows direct thermal modeling from die to PCB copper pour without interface material assumptions.
VGS(th) 2.4–3.6 V @ Tj = 25 °C - Tight threshold spread ensures predictable turn-on across temperature and simplifies gate driver selection for multi-MOSFET arrays.

Pinout & Package

LFPAK56 (SOT669) is a plastic, single-ended surface-mounted package with copper clip construction, gull-wing leads, and exposed mounting base (drain-connected). Dimensions: 4.41 × 3.62 × 1.01 mm (L × W × H); lead pitch: 1.27 mm.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3 Source (S) Three parallel source terminals reduce bond wire inductance and improve current sharing; soldered directly to PCB ground plane.
4 Gate (G) Single gate input with low RG (0.7 Ω typ); optimized for standard 10 V logic-level drive without external level shifting.
Mounting Base (mb) Drain (D) Exposed copper pad electrically connected to drain; serves as primary thermal path and high-current return; requires solder mask defined stencil opening per Fig. 19.

Key Features

Feature Design Value
AEC-Q101 qualification Fully qualified to automotive stress test standard including 175 °C operating temperature - validated for engine control, transmission, and start-stop modules.
Trench 9 superjunction technology Enables 7.0 mΩ RDS(on) in LFPAK56 footprint - achieves >20% lower conduction loss vs. comparable TrenchMOS devices at same package size.
LFPAK copper clip + gull-wing leads Eliminates bond wires and reduces parasitic inductance by 40%; gull-wing geometry enables AOI inspection and eliminates need for x-ray in production.
Tight VGS(th) distribution 2.4–3.6 V range at 25 °C - allows reliable paralleling of ≥3 devices without current imbalance or thermal runaway in high-power lamp drivers.
High avalanche ruggedness 19.9 mJ EAS - exceeds typical solenoid flyback energy (5–12 mJ), reducing need for external snubbers in transmission valve control.

Applications

Engine Start-Stop Control Automotive Lamp Driver

Use Scenario: High-cycle switching of starter motor solenoids and battery disconnect relays during micro-hybrid engine stop/start events.

IC Role / Device Role / Timing Role: Main power switch controlling 12 V battery path to starter circuit; handles 272 A pulsed drain current (IDM) during cranking.

Use Value: 175 °C rating and 19.9 mJ avalanche energy prevent failure during repeated inductive turn-off spikes; LFPAK56 mounting base ensures stable thermal performance over 100,000+ cycles.

Use Scenario: PWM dimming and on/off control of LED headlamps, fog lamps, and DRLs in modern vehicle lighting modules.

IC Role / Device Role / Timing Role: Low-side switch driving lamp strings; operates at 100–500 Hz PWM with fast turn-on (tr = 4 ns) and turn-off (tf = 4.4 ns).

Use Value: 5.7 mΩ RDS(on) minimizes heat generation at 15–30 A lamp currents; tight VGS(th) ensures consistent brightness across temperature (-40 to 125 °C ambient).

Transmission Solenoid Valve 12 V DC Motor Control

Use Scenario: Precision current regulation for electro-hydraulic pressure control valves in automatic and dual-clutch transmissions.

IC Role / Device Role / Timing Role: High-side or low-side switch in closed-loop current source; operates continuously at 2–5 A with 10 kHz PWM modulation.

Use Value: Low QGD (3.7 nC) enables clean current ramp control; soft reverse recovery (S = 0.78) suppresses EMI during diode commutation in inductive valve coils.

Use Scenario: Bidirectional or unidirectional drive of cabin blower fans, seat adjusters, and power window motors in passenger compartments.

IC Role / Device Role / Timing Role: Half-bridge low-side switch; sustains 48 A continuous current at Tmb = 100 °C per Fig. 2, supporting peak torque demands.

Use Value: Rth(j-mb) = 2.17 K/W allows direct thermal coupling to aluminum chassis; copper clip construction withstands vibration-induced mechanical stress in moving assemblies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N4F7AG 40 V, 2.2 mΩ RDS(on), PowerFLAT 5x6 package, 175 °C rated; higher current (120 A) but larger footprint and no gull-wing leads. Better for space-tolerant, ultra-low-loss applications; lacks AOI-friendly leadform and requires x-ray for solder joint verification. Select when maximum efficiency outweighs assembly cost and board real estate constraints.
ON Semiconductor NTMFS4C09NT1G 40 V, 4.0 mΩ RDS(on), SO-8FL package, 175 °C rated; uses copper-clip but no mounting base thermal path - Rth(j-a) only. Suitable for non-thermal-critical consumer-grade modules; not qualified to AEC-Q101 Grade 0/1; limited avalanche rating (12 mJ). Choose only for non-safety-critical 12 V subsystems where full automotive qualification is not mandated.

Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK7Y7R0-40HX uniquely balances ultra-low RDS(on), AEC-Q101 compliance, gull-wing AOI compatibility, and direct mounting base thermal management - making it optimal for volume automotive power stages where reliability, manufacturability, and thermal predictability are jointly prioritized.

Availability

BUK7Y7R0-40HX is available at Aetrix Electronics and suitable for automotive start-stop systems, transmission solenoid control, LED lamp drivers, and 12 V DC motor applications requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for BUK7Y7R0-40HX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, and consumer markets.

BUK7Y7R0-40HX belongs to Nexperia's LFPAK automotive MOSFET portfolio, engineered specifically for high-current, high-reliability 12 V power switching in thermally demanding environments such as engine bays and transmission control units.

FAQ

What is the maximum continuous drain current for BUK7Y7R0-40HX at 100 °C mounting base temperature?

At Tmb = 100 °C, the continuous drain current is 48 A, as specified in Table 5 (Limiting values) and confirmed by Fig. 2. This derating reflects thermal limits of the LFPAK56 package and PCB copper area; actual usable current depends on layout thermal resistance and ambient airflow.

Does BUK7Y7R0-40HX require a gate resistor for automotive PWM applications?

Yes - a 5 Ω external gate resistor is recommended for turn-off (per Fig. 3 test condition) to control dV/dt and suppress ringing caused by stray inductance. The device's low intrinsic RG (0.7 Ω typ) makes it sensitive to layout parasitics; proper gate resistor selection ensures stable switching in noisy automotive environments.

How does the LFPAK56 mounting base connect electrically and thermally?

The mounting base is internally connected to the drain terminal and forms the primary thermal interface to the PCB. It must be soldered to a large copper pour (minimum 100 mm² per Fig. 19) and is not isolated - electrical isolation requires external insulation between PCB layer and heatsink if used.

Is BUK7Y7R0-40HX suitable for synchronous rectification in 12 V DC-DC converters?

No - it is a standard-level MOSFET (VGS(th) = 2.4–3.6 V), not logic-level or trench-Schottky optimized for low-VGS drive. Synchronous rectification typically requires ≤2.0 V VGS(th) and ultra-low QRR; this part's Qr = 10 nC and softness factor = 0.78 are designed for hard-switched inductive loads, not high-frequency rectification.

BUK7Y7R0-40HX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SC-100, SOT-669
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
40 V
Current - Continuous Drain (Id) @ 25°C:
68A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
7mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
3.6V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
26 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1630 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
64W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56, Power-SO8

BUK7Y7R0-40HX FAQ

1.How can I place an order for BUK7Y7R0-40HX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK7Y7R0-40HX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK7Y7R0-40HX reliable?

The price and inventory of BUK7Y7R0-40HX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK7Y7R0-40HX is usually 5 days.

3.What payment methods are accepted for BUK7Y7R0-40HX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK7Y7R0-40HX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK7Y7R0-40HX?

BUK7Y7R0-40HX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK7Y7R0-40HX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK7Y7R0-40HX?

For technical support, including BUK7Y7R0-40HX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK7Y7R0-40HX requirements.

6.How does Aetrix verify that BUK7Y7R0-40HX is sourced from the original manufacturer or authorized distributors?

All BUK7Y7R0-40HX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK7Y7R0-40HX meets industry standards.

7.What is the process for return or replacement of BUK7Y7R0-40HX?

All BUK7Y7R0-40HX units undergo pre-shipment inspection (PSI). If there is an issue with BUK7Y7R0-40HX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK7Y7R0-40HX part is unused and in its original packaging.

Return procedure for BUK7Y7R0-40HX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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