Nexperia USA Inc. BUK7Y7R6-40EX

Overview

BUK7Y7R6-40EX from Nexperia is a standard-level N-channel MOSFET designed for high-reliability automotive power switching, featuring 40 V V_DS, 7.6 mΩ R_DS(on) at 10 V_GS/20 A/25 °C, AEC-Q101 qualification, and 175 °C junction rating - deployed in transmission control and solenoid drivers where thermally robust, repetitive-avalanche-capable switching is required.

For engineers reviewing the BUK7Y7R6-40EX datasheet, BUK7Y7R6-40EX pinout, BUK7Y7R6-40EX application, or BUK7Y7R6-40EX equivalent, key selection criteria include gate-threshold stability at 175 °C (V_GS(th) > 1 V), mounting-base thermal resistance (1.58 K/W), and LFPAK56 package current derating above 100 °C.

Technical Context

This MOSFET employs TrenchMOS technology in an LFPAK56 (SOT669) package with three parallel source terminals and a thermally enhanced mounting base connected to drain. Its standard-level gate enables direct drive from 5 V microcontrollers without level-shifting, while true V_GS(th) > 1 V at 175 °C ensures turn-on margin under extreme thermal stress.

The device supports unclamped inductive switching with 43 mJ non-repetitive avalanche energy (ID = 79 A, V_sup ≤ 40 V), and exhibits low dynamic parameters: Q_GD = 8.2 nC, C_iss = 1238–1650 pF, and t_f = 11.3 ns - enabling efficient high-frequency PWM in 12 V automotive subsystems.

Key Specifications

Pinout & Package

LFPAK56 (SOT669) package: plastic surface-mount, 4-terminal layout with integrated copper clip for low-inductance, high-current source connection and exposed drain mounting base for thermal transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Compared with STL220N4F7AG and IRF3205PBF, BUK7Y7R6-40EX uniquely combines AEC-Q101 compliance, guaranteed V_GS(th) > 1 V at 175 °C, and 43 mJ avalanche ruggedness - making it the only option qualified for thermally aggressive, safety-relevant automotive power switching without design compromises.

Availability

BUK7Y7R6-40EX is available at Aetrix Electronics and suitable for automotive transmission control, solenoid actuation, and engine cooling fan systems requiring stable component supply, long-lifecycle support, and traceable AEC-Q101-compliant sourcing.

Supply support for BUK7Y7R6-40EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.

BUK7Y7R6-40EX belongs to Nexperia's LFPAK automotive MOSFET product line, engineered specifically for thermally demanding 12 V vehicle subsystems requiring AEC-Q101 reliability, low R_DS(on), and robust avalanche performance.

FAQ

What is the maximum continuous drain current at 100 °C mounting base temperature?

The BUK7Y7R6-40EX delivers 56 A continuous drain current at T_mb = 100 °C, as specified in Table 5 (Limiting Values) and confirmed by Fig. 1. This derating reflects thermal constraints of the LFPAK56 package and must be applied when designing PCB copper area and airflow for thermal management.

Is the mounting base electrically isolated from the drain terminal?

No - the mounting base (mb) is internally connected to the drain (D) terminal, as shown in Table 2 (Pinning information) and the simplified outline graphic. It must be routed to the same net as the drain and thermally coupled to a large copper pour for heat dissipation.

Does this MOSFET require a gate resistor for automotive PWM applications?

Yes - a gate resistor (typically 5–10 Ω) is recommended to control dV/dt and suppress ringing, especially given its low Q_GD (8.2 nC) and fast switching (t_f = 11.3 ns). The datasheet specifies RG(ext) = 5 Ω in Fig. 4 (SOA) and Fig. 14 (gate charge waveform).

How does the 175 °C junction rating impact system-level thermal design?

The 175 °C rating allows operation in under-hood environments where ambient temperatures exceed 125 °C. Combined with R_th(j-mb) = 1.58 K/W, it enables designs that rely solely on PCB copper thermal mass instead of bolted heatsinks - reducing mechanical complexity and cost in space-constrained modules.