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NXP Semiconductors BUK9213-30A,118
- Part No.:
- BUK9213-30A,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
BUK9213-30A,118.pdf
- Description:
- MOSFET N-CH 30V 55A DPAK
- Quantity:
- Payment:
- Shipping:
Inventory:2,621
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Product details
Overview
BUK9213-30A from NXP Semiconductors is a logic-level N-channel TrenchMOS FET in DPAK (SOT428) package, rated for 30 V drain-source voltage, 75 A continuous drain current at 25 °C mounting base temperature, and 150 W total power dissipation. It delivers 9–11 mΩ RDS(on) at VGS = 10 V and 25 A, operates up to 175 °C junction temperature, and is AEC-Q101 qualified for automotive critical power switching.
For engineers reviewing the BUK9213-30A datasheet, BUK9213-30A pinout, BUK9213-30A application, or BUK9213-30A equivalent, this page provides verified technical context, thermal design guidance, gate-drive compatibility with 4.5–5 V logic controllers, and validated alternatives for 12 V automotive load switching in motors, lamps, and solenoids.
Technical Context
This device uses TrenchMOS technology to achieve low on-resistance and robust avalanche ruggedness (467 mJ), enabling reliable operation under inductive load switching transients. Its gate threshold voltage ranges from 0.5 V (at 175 °C) to 2.3 V (at –55 °C), ensuring stable turn-on across automotive temperature extremes.
The integrated source-drain diode supports freewheeling in H-bridge and relay drive topologies, with 0.85–1.2 V forward voltage at 15 A and 55 ns reverse recovery time. Thermal resistance from junction to mounting base is 0.56 K/W typical, supporting high-power dissipation when mounted on thermally optimized PCB copper areas.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V maximum - supports 12 V automotive systems with margin for load-dump transients. |
| ID (continuous) | 75 A at Tmb = 25 °C - enables high-current motor and lamp loads without external heatsinking at ambient conditions. |
| RDS(on) | 11 mΩ max at VGS = 5 V, ID = 25 A, Tj = 25 °C - ensures low conduction loss with standard 5 V microcontroller GPIO drive. |
| Tj max | 175 °C - allows operation in engine bay and under-hood environments without derating below specification limits. |
| Rth(j-mb) | 0.56 K/W typical - enables efficient heat transfer to PCB copper or heatsink via mounting base, critical for sustained 54 A operation at Tmb = 100 °C. |
| EAS | 467 mJ non-repetitive avalanche energy - withstands unclamped inductive switching events in solenoid and relay drivers. |
| QG(tot) | 37 nC typical - determines gate drive power and switching speed; compatible with standard MOSFET drivers like NXP's PCA9406. |
Pinout & Package
DPAK (SOT428) plastic single-ended surface-mounted package with 3 leads (one lead cropped); mounting base electrically connected to drain terminal for low-inductance, high-current path and thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Logic-level control input; accepts 4.5–5 V drive directly from MCU GPIO; threshold voltage shifts predictably with temperature (0.5–2.3 V range). |
| 2 (D) | Drain | Main high-side or low-side power path; internally bonded to mounting base for thermal and electrical connection to heatsink or PCB copper pour. |
| 3 (S) | Source | Power return path; referenced to system ground in low-side switch configuration; forms common node with internal body diode cathode. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive safety-critical applications including engine control, lighting, and chassis systems per stress test requirements. |
| Logic-level gate drive | Guaranteed turn-on with 4.5 V VGS; eliminates need for gate driver ICs in 5 V MCU-based designs, reducing BOM count and layout complexity. |
| 175 °C junction rating | Enables uninterrupted operation in under-hood environments where ambient temperatures exceed 105 °C and thermal cycling is severe. |
| Low RDS(on) at 5 V | 13 mΩ max at VGS = 5 V, ID = 25 A, Tj = 25 °C - minimizes I²R losses in battery-powered and efficiency-sensitive 12 V systems. |
| High avalanche energy | 467 mJ EAS - protects against destructive voltage spikes during inductive load turn-off without external snubbers in motor and solenoid circuits. |
Applications
| Automotive Lighting Control | Engine Bay Solenoid Driver |
|---|---|
|
Use Scenario: Switching 12 V halogen or LED headlamps with PWM dimming and overcurrent protection. IC Role / Device Role / Timing Role: Low-side power switch controlling lamp current path; handles repetitive 75 A inrush during cold filament startup. Use Value: 11 mΩ RDS(on) at 5 V gate drive reduces thermal rise during PWM duty cycles >90 %, eliminating need for active cooling in compact headlamp modules. |
Use Scenario: Driving fuel injector or transmission solenoid coils requiring fast, robust 12 V switching with flyback energy handling. IC Role / Device Role / Timing Role: High-energy clamping switch; absorbs unclamped inductive kickback during coil de-energization. Use Value: 467 mJ avalanche energy rating ensures single-pulse survivability without external TVS, simplifying PCB layout and improving long-term reliability in harsh vibration environments. |
| 12 V DC Motor Starter | Body Control Module Load Switch |
|
Use Scenario: Controlling starter motor auxiliary circuits or small blower motors in HVAC systems. IC Role / Device Role / Timing Role: High-current, thermally resilient power switch operating continuously at 54 A with Tmb = 100 °C. Use Value: 0.56 K/W Rth(j-mb) enables direct mounting to thick copper planes, sustaining full-rated current without thermal shutdown in space-constrained modules. |
Use Scenario: Managing power distribution to door locks, window lifters, and mirror actuators in centralized body control units. IC Role / Device Role / Timing Role: Protected load switch with built-in thermal and overcurrent robustness; interfaces directly with 5 V CAN/LIN microcontrollers. Use Value: AEC-Q101 qualification and 175 °C operation guarantee functional safety compliance and zero field failures across vehicle lifetime under repeated thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N3LLH6 | 30 V, 220 A rated, DFN5x6 package; lower RDS(on) (1.2 mΩ @ 10 V) but requires 10 V gate drive for full performance; no AEC-Q101 certification. | Higher current capacity suits larger motors but lacks automotive qualification; unsuitable for safety-critical modules without additional validation. | Select only for non-automotive industrial 12 V systems where AEC-Q101 is not mandated and PCB space allows DFN5x6 footprint. |
| ON Semiconductor NTMFS4C09NT1G | 30 V, 75 A, SO-8FL package; RDS(on) = 10.5 mΩ @ 4.5 V; AEC-Q101 qualified; thermal resistance Rth(j-a) = 40 K/W (vs. 71.4 K/W for BUK9213-30A) but lower mounting-base thermal path due to lack of exposed drain pad. | Better ambient-air cooling but inferior board-level heat extraction; limited to lower-duty-cycle loads unless actively cooled. | Prefer for space-constrained PCBs with forced airflow; avoid in thermally isolated under-hood locations where mounting-base conduction is primary cooling path. |
Compared with STL220N3LLH6 and NTMFS4C09NT1G, the BUK9213-30A uniquely combines AEC-Q101 qualification, DPAK mounting-base thermal conduction, and guaranteed 5 V logic-level operation-making it the only option among the three suitable for uncooled, safety-critical 12 V automotive load switching where thermal mass and reliability are prioritized over peak current density.
Availability
BUK9213-30A is available at Aetrix Electronics and suitable for automotive lighting control, engine bay solenoid actuation, and 12 V DC motor starter applications requiring stable component supply across extended production lifecycles.
Supply support for BUK9213-30A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The BUK9213-30A belongs to NXP's TrenchMOS logic-level power FET product line, engineered specifically for automotive-grade 12 V power switching where reliability under thermal stress, gate-drive simplicity, and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum continuous drain current for BUK9213-30A at 100 °C mounting base temperature?
The BUK9213-30A supports 54 A continuous drain current at Tmb = 100 °C with VGS = 5 V, as specified in Table 4 (Limiting Values). This rating is constrained by bondwire current limits-not thermal dissipation-and remains valid up to the 175 °C junction temperature limit. The BUK9213-30A maintains safe operation under sustained high-current conditions in engine compartment environments when properly mounted.
Is BUK9213-30A suitable for use with 3.3 V microcontroller GPIOs?
No, the BUK9213-30A is not guaranteed to fully enhance with 3.3 V gate drive. Its RDS(on) is characterized at VGS = 4.5 V and 5 V, with 14.4 mΩ max at 4.5 V. At 3.3 V, the device operates in the sub-threshold region (see Figure 7), resulting in significantly higher on-resistance and unpredictable switching behavior. The BUK9213-30A requires ≥4.5 V gate drive for reliable logic-level operation in production systems.
Does BUK9213-30A include an integrated body diode, and what are its key parameters?
Yes, the BUK9213-30A integrates a source-drain body diode with VSD = 0.85–1.2 V at IS = 15 A and Tj = 25 °C (Table 6), and reverse recovery time trr = 55 ns under specified test conditions. This diode supports freewheeling in low-side switch configurations and is rated for 75 A continuous source current at Tmb = 25 °C. The BUK9213-30A body diode enables simplified H-bridge and relay driver designs without external diodes.
What is the thermal resistance from junction to mounting base for BUK9213-30A, and how does it impact PCB layout?
The BUK9213-30A has a typical Rth(j-mb) of 0.56 K/W (Table 5), measured from silicon junction to the exposed mounting base (drain-connected tab). This low value mandates direct thermal coupling to large copper pours or heatsinks via the mounting base. PCB layout must allocate ≥200 mm² of 2-oz copper connected to pin 2 (drain) and the mounting base area; insufficient copper increases junction temperature and risks exceeding the 175 °C limit. The BUK9213-30A's thermal performance is critically dependent on this interface.
How does the avalanche ruggedness of BUK9213-30A compare to standard industrial MOSFETs?
The BUK9213-30A specifies 467 mJ non-repetitive drain-source avalanche energy (EAS) under defined test conditions (ID = 55 A, Vsup ≤30 V, unclamped), which exceeds typical industrial MOSFETs by 2–3×. This ruggedness is achieved through TrenchMOS process optimization and is validated per AEC-Q101 stress testing. In practice, the BUK9213-30A reliably survives inductive turn-off transients in automotive solenoid and motor circuits without external clamping components-unlike most non-automotive MOSFETs that require TVS diodes or RC snubbers. The BUK9213-30A's avalanche rating is a design-critical parameter for under-hood reliability.
BUK9213-30A,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 55A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 11mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 37 nC @ 5 V
- Vgs (Max):
- ±15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2852 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
BUK9213-30A,118 FAQ
1.How can I place an order for BUK9213-30A,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9213-30A,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9213-30A,118 reliable?
The price and inventory of BUK9213-30A,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9213-30A,118 is usually 5 days.
3.What payment methods are accepted for BUK9213-30A,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9213-30A,118 transactions.
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4.How is shipping managed for BUK9213-30A,118?
BUK9213-30A,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9213-30A,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9213-30A,118?
For technical support, including BUK9213-30A,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9213-30A,118 requirements.
6.How does Aetrix verify that BUK9213-30A,118 is sourced from the original manufacturer or authorized distributors?
All BUK9213-30A,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9213-30A,118 meets industry standards.
7.What is the process for return or replacement of BUK9213-30A,118?
All BUK9213-30A,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK9213-30A,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9213-30A,118 part is unused and in its original packaging.
Return procedure for BUK9213-30A,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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