Nexperia USA Inc. BUK9237-55A,118

Overview

BUK9237-55A,118 from Nexperia is a logic-level N-channel TrenchMOS FET in DPAK (SOT428) package, rated for 55 V V_DS, 32 A continuous drain current at T_mb = 25 °C, and 175 °C junction temperature - designed per AEC-Q101 for automotive power switching of 12 V/24 V loads including motors, lamps, and solenoids.

For engineers reviewing the BUK9237-55A,118 datasheet, BUK9237-55A,118 pinout, BUK9237-55A,118 application, or BUK9237-55A,118 equivalent, key selection criteria include logic-compatible gate drive (V_GS(th) = 1–2 V), low R_DS(on) (28–33 mΩ @ V_GS = 10 V), avalanche ruggedness (76 mJ), thermal resistance (R_th(j-mb) = 1.94 K/W), and automotive qualification.

Technical Context

This device uses TrenchMOS technology to achieve low on-resistance with logic-level gate drive compatibility (V_GS(th) typ. 1.5 V, max 2.3 V at -55 °C). Its internal structure integrates a robust body diode (V_SD = 0.85–1.2 V, t_rr = 42 ns) and features low parasitic inductance (L_D = 2.5 nH, L_S = 7.5 nH) for fast switching in thermally demanding environments.

The MOSFET supports unclamped inductive switching with E_AS = 76 mJ and operates across full automotive temperature range (-55 °C to +175 °C). Its SOA is defined up to 100 ms pulses and includes DC, 1 ms, 10 µs, and 100 µs boundaries - enabling reliable use in motor control and load dump scenarios.

Key Specifications

Pinout & Package

Package: DPAK (SOT428), plastic single-ended surface-mounted package with 3 leads (lead 2 cropped); mounting base (mb) electrically connected to drain for low-inductance thermal path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Compared with STP55NF06L and IRF3205PBF, BUK9237-55A,118 delivers optimal balance of AEC-Q101 compliance, logic-level drive assurance, thermal performance (1.94 K/W), and compact DPAK form factor - making it the preferred choice for space-constrained automotive power modules.

Availability

BUK9237-55A,118 is available at Aetrix Electronics and suitable for automotive body electronics, 12 V/24 V motor control, and industrial solenoid driving requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BUK9237-55A,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-grade MOSFETs, ESD protection, and logic ICs.

BUK9237-55A,118 belongs to Nexperia's TrenchMOS automotive logic-level FET product line - engineered specifically for robust, thermally efficient power switching in harsh automotive environments.

FAQ

Is BUK9237-55A,118 suitable for 3.3 V microcontroller gate drive?

Yes. With V_GS(th) ranging from 1 V to 2 V (typ. 1.5 V) and R_DS(on) = 31–37 mΩ at V_GS = 5 V, it achieves full enhancement at 3.3 V in most cases - confirmed by sub-threshold curves showing ID ≥ 100 mA at V_GS = 3.3 V and T_j = 25 °C. For guaranteed saturation, verify actual load current against R_DS(on) at 3.3 V in final thermal conditions.

What is the maximum continuous drain current at 100 °C mounting base temperature?

Per Figure 1 in the datasheet, the continuous drain current drops to 22 A at T_mb = 100 °C with V_GS = 5 V. This derating reflects thermal limits of the DPAK package and must be applied in designs where heatsinking is limited or ambient temperature exceeds 85 °C.

Does BUK9237-55A,118 require an external flyback diode when driving inductive loads?

No. Its integrated body diode is rated for IS = 32 A continuous and ISM = 129 A pulsed, with t_rr = 42 ns and V_SD = 0.85 V at 15 A. It is qualified for unclamped inductive switching with E_AS = 76 mJ, eliminating need for external diodes in most automotive solenoid and lamp applications.

How does the mounting base connection affect PCB layout?

The mounting base (mb) is electrically tied to drain and must be soldered to a large copper pour or heatsink. This establishes the primary thermal path (R_th(j-mb) = 1.94 K/W) and serves as the low-inductance drain node. Avoid routing signal traces under the base; ensure ≥ 200 mm² exposed copper area with multiple thermal vias to inner ground planes for optimal performance.