Nexperia USA Inc. BUK9506-75B,127

Overview

BUK9506-75B,127 from NXP Semiconductors is a logic-level N-channel TrenchMOS FET in TO-220AB package, rated for 75 V drain-source voltage, 75 A continuous drain current at T_mb = 25 °C, and 300 W total power dissipation. It features 4.7 mΩ R_DS(on) at V_GS = 10 V and 25 °C, operates up to 175 °C junction temperature, and is AEC-Q101 qualified for automotive load switching applications including motors, lamps, and solenoids in 12 V/24 V systems.

For engineers reviewing the BUK9506-75B,127 datasheet, BUK9506-75B,127 pinout, BUK9506-75B,127 application, or BUK9506-75B,127 equivalent, key selection criteria include logic-level gate drive compatibility (V_GS(th) = 1.1–2.0 V), low on-resistance under thermal stress, avalanche ruggedness (852 mJ), and mounting-base thermal resistance of 0.5 K/W - all critical for high-reliability automotive power switching designs.

Technical Context

This device employs TrenchMOS technology to achieve low R_DS(on) while maintaining robust avalanche capability and stable threshold voltage across -55 °C to +175 °C. Its gate-source threshold voltage ranges from 0.5 V at 175 °C to 2.3 V at -55 °C, enabling reliable turn-on with standard 5 V microcontroller outputs even under extreme thermal conditions.

The internal drain and source inductances are tightly controlled (L_D = 3.5–4.5 nH, L_S = 7.5 nH), minimizing switching oscillation in high-di/dt automotive loads. Dynamic parameters include Q_G(tot) = 95 nC and Q_GD = 37 nC at V_GS = 5 V, supporting efficient PWM control in motor drivers and DC-DC secondary-side switches.

Key Specifications

Pinout & Package

Package: TO-220AB (SOT78A), plastic single-ended package with heatsink-mounted mounting base electrically connected to drain. Requires mechanical fastening via single mounting hole; leads are tinned except terminal zone per JEDEC SC-46 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Compared with STP75NF75 and IRFB4115PBF, BUK9506-75B,127 uniquely combines AEC-Q101 qualification, true logic-level gate drive (≤2.0 V V_GS(th)), and 0.5 K/W thermal resistance - making it the only option among the three that satisfies automotive-grade reliability, MCU-direct control, and high-power thermal management simultaneously.

Availability

BUK9506-75B,127 is available at Aetrix Electronics and suitable for automotive body control modules, 12 V/24 V motor drives, and industrial solenoid actuation requiring stable component supply across multi-year production lifecycles.

Supply support for BUK9506-75B,127 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

BUK9506-75B,127 belongs to NXP's TrenchMOS logic-level power MOSFET product line, engineered specifically for high-reliability automotive power switching where AEC-Q101 compliance, thermal resilience, and direct microcontroller interfacing are mandatory.

FAQ

Is BUK9506-75B,127 suitable for high-frequency PWM applications?

Yes - with 68 ns turn-on delay, 144 ns rise time, and 95 nC total gate charge, it supports PWM frequencies up to 100 kHz in motor control and DC-DC applications. Its low Q_GD/Q_G ratio (37/95 ≈ 0.39) ensures clean switching transitions and reduced Miller-induced shoot-through risk when paired with standard gate drivers.

What is the maximum continuous drain current at 100 °C mounting base temperature?

Per Figure 1 in the datasheet, the continuous drain current is derated to 75 A at T_mb = 100 °C - matching the package-limited ceiling. This reflects thermal saturation of the TO-220AB package, not silicon limitation, and remains constant from 100 °C to 175 °C mounting base temperature.

Does the mounting base require electrical isolation from the heatsink?

No - the mounting base is internally connected to the drain terminal (Pin 2). When mounted to a conductive heatsink, the heatsink becomes part of the drain circuit. Electrical isolation is only required if the heatsink is grounded or at a different potential; otherwise, direct metal-to-metal contact maximizes thermal performance.

Can BUK9506-75B,127 replace older BUK9506-75B versions without design changes?

Yes - the ",127" suffix denotes tape-and-reel packaging per ordering code BUK9506-75B,127 (SOT78A, 1000 pcs/reel). Electrical, thermal, and mechanical specifications are identical to the base BUK9506-75B part; only packaging format differs, requiring no PCB or schematic modifications.