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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

NXP Semiconductors BUK9609-55A,118

Name: BUK9609-55A,118
Brand: NXP Semiconductors
SKU: BUK9609-55A,118
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BUK9609-55A,118

Manufacturer:: NXP Semiconductors

Category:: FETs, MOSFETs

Package:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Datasheet:: BUK9609-55A,118.pdf

Description:: MOSFET N-CH 55V 75A D2PAK

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Product details

Overview

BUK9609-55A from NXP Semiconductors (formerly Philips) is an N-channel TrenchMOS™ logic-level power MOSFET in SOT404 (D2-PAK) package, rated for 55 V drain-source voltage, 108 A DC drain current at T_mb = 25 °C and V_GS = 5 V, with typical R_DS(on) of 7.6 mΩ at V_GS = 5 V and I_D = 25 A. It operates up to 175 °C junction temperature and is Q101-compliant for automotive power switching.

For engineers reviewing the BUK9609-55A datasheet, BUK9609-55A pinout, BUK9609-55A application, or BUK9609-55A equivalent, this page delivers verified electrical specs, thermal behavior, gate drive compatibility, and real-world use context for 12 V/24 V motor, lamp, and solenoid control in harsh-environment systems.

Technical Context

This device uses trench-gate silicon technology to achieve low R_DS(on) while maintaining robust avalanche energy rating (400 mJ unclamped) and high-temperature operation. Its logic-level gate threshold (V_GS(th) = 1–2 V typ.) enables direct drive from 3.3 V or 5 V microcontrollers without level-shifting circuitry.

The SOT404 package features a large mounting base electrically connected to the drain, enabling efficient heatsinking via PCB copper or external heatsink. Internal drain and source inductances are minimized (L_d = 2.5 nH, L_s = 7.5 nH), supporting fast switching with reduced ringing in high-di/dt applications.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	55 V - Maximum continuous drain-source blocking voltage; suitable for 12 V and 24 V automotive battery rails with margin.
I_D (DC)	108 A at T_mb = 25 °C, V_GS = 5 V - High-current capability enables single-device control of heavy-duty loads like starter relays or HVAC blowers.
R_DS(on)	7.6 mΩ typ. at V_GS = 5 V, I_D = 25 A, T_j = 25 °C - Low conduction loss reduces heat generation and improves system efficiency in high-duty-cycle switching.
T_j max	175 °C - Extended junction temperature rating supports operation in engine bay or under-hood environments without derating penalties.
Q_g(tot)	60 nC - Total gate charge determines required driver strength; compatible with standard logic-level gate drivers (e.g., TC4427, UCC27531).
E_AS	400 mJ - Non-repetitive avalanche energy rating allows safe handling of inductive kickback from motors and solenoids without external snubbers.
R_th(j-mb)	0.71 K/W max - Low junction-to-mounting-base thermal resistance enables effective heat transfer to heatsink or copper pour, critical for sustained high-current operation.

Pinout & Package

SOT404 (D2-PAK) plastic surface-mount package with 3 leads and integral mounting base. The mounting base is electrically connected to the drain terminal and serves as primary thermal path. Pin 2 is not internally connected and must remain unconnected per datasheet.

Pin/Terminal	Circuit Role	Design Meaning
1	Gate (G)	Control input; logic-level compatible (V_GS(th) = 1–2 V); requires <100 nA leakage current drive.
2	Not connected	No internal connection; must be left floating or omitted from PCB layout per datasheet Note [1].
3	Source (S)	Power return path; referenced to ground or low-side switch node; carries full load current.
Mounting base	Drain (D)	Primary drain terminal and thermal interface; electrically tied to drain; must be soldered to large copper area or heatsink.

Key Features

Feature	Design Value
TrenchMOS™ technology	Enables 7.6 mΩ R_DS(on) at 55 V rating - achieves higher current density and lower conduction loss than planar MOSFETs in same voltage class.
Q101 qualification	Complies with AEC-Q101 stress test standard - validated for automotive-grade reliability including temperature cycling, HTRB, and UIS.
Logic-level gate drive	V_GS(th) = 1–2 V typ. - eliminates need for gate driver ICs when interfacing with 3.3 V or 5 V MCUs, reducing BOM count and layout complexity.
175 °C junction rating	Supports operation in high-ambient environments (e.g., engine compartments) without forced cooling or significant current derating.
Avalanche ruggedness	400 mJ E_AS - withstands repetitive inductive turn-off transients from 24 V solenoids and brushed DC motors without failure.

Applications

Automotive Body Control Module	Industrial Motor Starter
Use Scenario: Controlling headlamp, fog lamp, and interior lighting circuits in modern vehicle BCMs. IC Role / Device Role / Timing Role: High-side or low-side power switch managing 12 V/24 V resistive and inrush-limited loads. Use Value: Low R_DS(on) minimizes self-heating during long-duration illumination; Q101 compliance ensures field reliability over 15-year vehicle life.	Use Scenario: Solid-state replacement for electromechanical contactors in HVAC blower or conveyor motor starters. IC Role / Device Role / Timing Role: Low-side switching element driving brushed DC motors up to 2 kW at 24 V. Use Value: 400 mJ avalanche rating absorbs back-EMF during abrupt shutdown; 175 °C rating sustains operation during extended duty cycles.
Truck Trailer Brake Solenoid Driver	Off-Highway Equipment Power Distribution
Use Scenario: Driving 24 V pneumatic brake solenoids in commercial trailer control units. IC Role / Device Role / Timing Role: Fast-switching, high-current switch with precise PWM control for proportional braking. Use Value: 60 nC gate charge enables clean 1–20 kHz PWM edges; low gate leakage (<100 nA) prevents unintended turn-on in sleep mode.	Use Scenario: Centralized power distribution unit in agricultural or construction machinery with multiple 12 V/24 V subsystems. IC Role / Device Role / Timing Role: Protected load switch providing overcurrent and thermal shutdown via external monitoring. Use Value: Mounting base-to-drain connection simplifies heatsinking on thick copper PCBs; 0.71 K/W R_th(j-mb) supports >75 A continuous current with passive cooling.

Automotive Body Control Module

Industrial Motor Starter

Use Scenario: Controlling headlamp, fog lamp, and interior lighting circuits in modern vehicle BCMs.

IC Role / Device Role / Timing Role: High-side or low-side power switch managing 12 V/24 V resistive and inrush-limited loads.

Use Value: Low R_DS(on) minimizes self-heating during long-duration illumination; Q101 compliance ensures field reliability over 15-year vehicle life.

Use Scenario: Solid-state replacement for electromechanical contactors in HVAC blower or conveyor motor starters.

IC Role / Device Role / Timing Role: Low-side switching element driving brushed DC motors up to 2 kW at 24 V.

Use Value: 400 mJ avalanche rating absorbs back-EMF during abrupt shutdown; 175 °C rating sustains operation during extended duty cycles.

Truck Trailer Brake Solenoid Driver

Off-Highway Equipment Power Distribution

Use Scenario: Driving 24 V pneumatic brake solenoids in commercial trailer control units.

IC Role / Device Role / Timing Role: Fast-switching, high-current switch with precise PWM control for proportional braking.

Use Value: 60 nC gate charge enables clean 1–20 kHz PWM edges; low gate leakage (<100 nA) prevents unintended turn-on in sleep mode.

Use Scenario: Centralized power distribution unit in agricultural or construction machinery with multiple 12 V/24 V subsystems.

IC Role / Device Role / Timing Role: Protected load switch providing overcurrent and thermal shutdown via external monitoring.

Use Value: Mounting base-to-drain connection simplifies heatsinking on thick copper PCBs; 0.71 K/W R_th(j-mb) supports >75 A continuous current with passive cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP110N55F7	55 V, 110 A, R_DS(on) = 6.5 mΩ @ V_GS = 10 V; requires 10 V gate drive for full performance; TO-220FP package.	Higher R_DS(on) at 4.5 V (12 mΩ) limits use with 3.3 V controllers; lacks Q101 qualification.	Select only if 10 V gate drive is available and automotive qualification is not required.
IRF1405ZPBF	55 V, 169 A, R_DS(on) = 5.3 mΩ @ V_GS = 10 V; TO-220AB package; no logic-level rating (V_GS(th) = 2–4 V).	Higher gate threshold increases risk of partial turn-on with 3.3 V MCU outputs; not optimized for direct logic-level drive.	Prefer for high-current, non-automotive applications where gate driver ICs are already present.

Compared with STP110N55F7 and IRF1405ZPBF, the BUK9609-55A uniquely combines Q101 qualification, true logic-level operation down to 4.5 V, and D2-PAK thermal performance-making it the only choice for automotive-grade, MCU-direct-driven 24 V power switching where reliability and layout simplicity are critical.

Availability

BUK9609-55A is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, off-highway equipment power distribution, and trailer brake systems requiring stable component supply across extended product lifecycles.

Supply support for BUK9609-55A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' semiconductor division.

The BUK9x series was designed specifically for rugged, high-current automotive power switching-emphasizing logic-level drive compatibility, avalanche robustness, and AEC-Q101 qualification for under-hood and chassis-mounted systems.

FAQ

What is the maximum continuous drain current for BUK9609-55A at 100 °C mounting base temperature?

The BUK9609-55A supports 75 A continuous drain current at T_mb = 100 °C and V_GS = 5 V, as limited by package thermal constraints (Figure 2). This value reflects derating from the 108 A rating at 25 °C mounting base temperature and ensures safe operation within the SOA boundary under sustained high-temperature conditions.

Is BUK9609-55A suitable for direct drive from a 3.3 V microcontroller GPIO?

Yes, the BUK9609-55A is explicitly designed for logic-level operation: its gate threshold voltage is 1–2 V typical, and R_DS(on) remains low (≤10 mΩ) at V_GS = 4.5 V. A 3.3 V GPIO can fully enhance the device, delivering near-minimum on-resistance without external level-shifting circuitry.

Does BUK9609-55A have an integrated body diode, and what are its key parameters?

Yes, BUK9609-55A includes a built-in source-drain diode with forward voltage V_SD = 0.85–1.2 V at I_S = 25 A and reverse recovery time t_rr = 70 ns. Its recovered charge Q_r is 160 nC, enabling efficient freewheeling in inductive load circuits such as motor drives and solenoid controls.

What is the thermal resistance from junction to mounting base for BUK9609-55A, and how does it impact heatsinking?

The maximum thermal resistance from junction to mounting base (R_th(j-mb)) for BUK9609-55A is 0.71 K/W. This low value means that for every watt dissipated, the junction rises only ~0.71 °C above the mounting base temperature-enabling effective passive heatsinking using PCB copper or bolted heatsinks without requiring forced air or oversized thermal pads.

Can BUK9609-55A replace BUK9509-55A in a design, and what is the key mechanical difference?

BUK9609-55A and BUK9509-55A share identical electrical specifications but differ in package: BUK9509-55A uses SOT78 (TO-220AB), while BUK9609-55A uses SOT404 (D2-PAK). The D2-PAK offers superior thermal performance (R_th(j-mb) = 0.71 K/W vs. TO-220's ~1.0 K/W) and surface-mount compatibility, but requires rework of footprint and thermal pad layout.

BUK9609-55A,118 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: TrenchMOS™

Package/Case:: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 55 V

Current - Continuous Drain (Id) @ 25°C:: 75A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 8mOhm @ 25A, 10V

Vgs(th) (Max) @ Id:: 2V @ 1mA

Gate Charge (Qg) (Max) @ Vgs:: 60 nC @ 5 V

Vgs (Max):: ±15V

Input Capacitance (Ciss) (Max) @ Vds:: 4633 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 211W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: D2PAK

BUK9609-55A,118 FAQ

1.How can I place an order for BUK9609-55A,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK9609-55A,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK9609-55A,118 reliable?

The price and inventory of BUK9609-55A,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9609-55A,118 is usually 5 days.

3.What payment methods are accepted for BUK9609-55A,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9609-55A,118 transactions.

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4.How is shipping managed for BUK9609-55A,118?

BUK9609-55A,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK9609-55A,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK9609-55A,118?

For technical support, including BUK9609-55A,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9609-55A,118 requirements.

6.How does Aetrix verify that BUK9609-55A,118 is sourced from the original manufacturer or authorized distributors?

All BUK9609-55A,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9609-55A,118 meets industry standards.

7.What is the process for return or replacement of BUK9609-55A,118?

All BUK9609-55A,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK9609-55A,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK9609-55A,118 part is unused and in its original packaging.

Return procedure for BUK9609-55A,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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