Nexperia USA Inc. BUK96180-100A,118

Overview

BUK96180-100A,118 from Nexperia is a logic-level N-channel TrenchMOS FET in D2PAK (SOT404) package, rated for 100 V drain-source voltage, 11 A continuous drain current at 25 °C mounting base temperature, and 54 W total power dissipation. It features 152–173 mΩ R_DS(on) at V_GS = 10 V and 5 A, supports automotive-grade operation per AEC-Q101, and delivers robust unclamped avalanche energy of 1.5 mJ - deployed in engine control module power stages.

For engineers reviewing the BUK96180-100A,118 datasheet, BUK96180-100A,118 pinout, BUK96180-100A,118 application, or BUK96180-100A,118 equivalent, key selection criteria include gate drive compatibility at 4.5–5 V logic levels, thermal resistance to mounting base (2.8 K/W), avalanche ruggedness, and AEC-Q101 qualification for safety-critical automotive switching.

Technical Context

This device employs TrenchMOS technology to achieve low on-resistance with logic-level gate drive capability, enabling direct interface with 5 V microcontrollers without level-shifting circuitry. Its gate threshold voltage ranges from 0.5 V (T_j = 175 °C) to 2.3 V (T_j = −55 °C), ensuring reliable turn-on across automotive temperature extremes.

The integrated source-drain diode exhibits 0.85–1.2 V forward voltage at 5 A and 25 °C, with 49 ns reverse recovery time and 0.13 µC recovered charge - critical for synchronous rectification and inductive load commutation in DC-DC converters and motor drivers.

Key Specifications

Pinout & Package

Package: D2PAK (SOT404), plastic surface-mount with exposed mounting base electrically connected to drain - optimized for high-power thermal management in automotive PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power switching applications.

Compared with STL220N10F7 and IRF3205PBF, BUK96180-100A,118 uniquely combines AEC-Q101 qualification, 100 V rating, D2PAK thermal efficiency, and true logic-level operation - making it the sole fit for safety-critical automotive power switching where qualification, footprint, and gate drive simplicity are jointly required.

Availability

BUK96180-100A,118 is available at Aetrix Electronics and suitable for engine control units, HVAC motor controllers, transmission solenoid drivers, and body control modules requiring stable component supply across extended automotive product lifecycles.

Supply support for BUK96180-100A,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors - high-volume, high-reliability discrete, logic, and MOSFET devices engineered for automotive, industrial, and computing applications.

BUK96180-100A,118 belongs to Nexperia's Automotive Logic-Level Power MOSFET family, designed specifically for robust, thermally efficient, and AEC-Q101-compliant switching in harsh-temperature automotive subsystems.

FAQ

Is BUK96180-100A,118 suitable for high-frequency PWM applications above 100 kHz?

No - its 112–157 ns rise time and 25–38 ns fall time limit practical switching frequency to ≤50 kHz in hard-switched topologies. For >100 kHz operation, consider devices with lower C_iss and faster transition times, such as Nexperia's NextPower series, which offer sub-10 ns switching with comparable R_DS(on).

Can BUK96180-100A,118 be used in high-side switch configurations?

Yes - it functions as a high-side switch when paired with a gate driver capable of providing V_GS ≥ 5 V relative to the source node. However, due to its logic-level threshold, bootstrap or isolated gate drive is required to maintain sufficient V_GS during high-side operation; it is more commonly deployed in low-side configurations for simplicity.

What is the maximum allowable mounting base temperature for continuous operation?

The absolute maximum mounting base temperature is 175 °C, but continuous operation at that level violates derating curves. At T_mb = 100 °C, the continuous drain current drops to 7.7 A (per Table 4), and thermal design must ensure T_mb ≤ 100 °C for full 11 A rating - verified via thermal simulation or IR measurement under worst-case ambient and airflow conditions.

Does the mounting base require electrical isolation from the PCB heatsink?

No - the mounting base is electrically connected to the drain terminal, so if isolation is required (e.g., in high-side configurations), a thermally conductive but electrically insulating pad (e.g., ceramic or silicone-based) must be used between the D2PAK tab and heatsink. Standard solder attachment assumes drain potential is compatible with heatsink grounding.