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NXP Semiconductors BUK9635-55,118

Part No.:
BUK9635-55,118
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixBUK9635-55,118.pdf
Description:
MOSFET N-CH 55V 34A D2PAK
Quantity:
Payment:
Payment
Shipping:
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Inventory:8,670

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Product details

Overview

BUK9635-55,118 from NXP Semiconductors (formerly Philips) is an N-channel enhancement-mode logic-level TrenchMOS power transistor in SOT404 (TO-263) package, rated for 55 V drain-source voltage, 34 A DC drain current at 25 °C, 35 mΩ RDS(ON) at VGS = 5 V, and 85 W total power dissipation. It integrates ESD protection up to 2 kV and is designed for automotive and industrial switching applications requiring robust gate drive compatibility with 5 V microcontrollers.

For engineers reviewing the BUK9635-55,118 datasheet, BUK9635-55,118 pinout, BUK9635-55,118 application, or BUK9635-55,118 equivalent, key selection criteria include its logic-level gate threshold (1–2 V), low on-resistance at 5 V drive, thermal resistance junction-to-mounting-base (max 1.75 K/W), avalanche energy rating (45 mJ), and integrated reverse diode characteristics (VSD = 0.95–1.2 V at 25 A).

Technical Context

The BUK9635-55,118 employs trench-gate MOSFET technology to achieve low RDS(ON) while maintaining stable gate threshold across temperature (0.5–2.3 V). Its internal structure includes a monolithic source-drain diode with 40 ns reverse recovery time and 0.16 µC Qrr, enabling efficient freewheeling in inductive loads.

It operates within a junction temperature range of –55 °C to 175 °C and supports pulsed drain currents up to 136 A. The device's safe operating area (SOA) is defined for unclamped inductive switching with specified gate resistance (RGS = 50 Ω) and gate drive (VGS = 5 V), confirming suitability for automotive load-switching and motor control circuits.

Key Specifications

ParameterValue and Actual Design Meaning
VDS55 V - Maximum continuous drain-source blocking voltage; defines maximum supply rail compatibility in 48 V automotive systems.
ID (DC)34 A at Tmb = 25 °C - Continuous current capability with heatsink; derates to 24 A at 100 °C mounting base temperature.
RDS(ON)35 mΩ max at VGS = 5 V, ID = 17 A - Ensures <1.8 W conduction loss at 30 A, enabling high-efficiency low-voltage switching.
EAS45 mJ non-repetitive unclamped inductive energy - Supports reliable turn-off under inductive kickback without external snubbers in relay or solenoid drivers.
VGS(th)1.0–2.0 V typical at 25 °C - Fully enhances with standard 3.3 V or 5 V logic outputs; eliminates need for gate boosters.
Ciss1050–1400 pF - Determines gate drive strength requirement; compatible with standard 1 A peak gate drivers at ≤100 kHz switching.
Tj max175 °C - Enables operation in under-hood automotive environments with minimal thermal margin compromise.

Pinout & Package

Package: SOT404 (TO-263), surface-mount, isolated mounting base (pin 4/mb connected to drain); net mass 1.4 g; UL94 V0 epoxy.

Pin/TerminalCircuit RoleDesign Meaning
1 (Gate)Control inputLogic-level compatible; requires <1 µA leakage at ±5 V; sensitive to ESD (2 kV HBM).
2 (Drain)High-side power pathConnected internally to mounting base (mb); primary heat transfer path to PCB copper pour or heatsink.
3 (Source)Power return referenceLow-inductance source path (Ls = 7.5 nH); referenced to driver ground; carries full load current.
mb (Mounting Base)Drain thermal & electrical nodeElectrically tied to pin 2; must be soldered to large copper area for thermal management and EMI reduction.

Key Features

FeatureDesign Value
Logic-level gate driveOperates fully enhanced with 3.3 V or 5 V MCU GPIOs-no level-shifting required in battery-powered or automotive body-control modules.
Integrated ESD protection2 kV Human Body Model rating on all pins-reduces need for external TVS in cost-sensitive automotive interior modules.
TrenchMOS architectureDelivers 35 mΩ RDS(ON) at 5 V drive-enables lower conduction losses than planar MOSFETs in 12–48 V DC-DC and load-switch designs.
Monolithic body diode40 ns trr, 0.16 µC Qrr-supports synchronous rectification and flyback recovery in brushed DC motor drivers without external diodes.
High avalanche ruggedness45 mJ unclamped inductive energy rating-ensures single-pulse survivability during relay coil de-energization or solenoid actuation transients.

Applications

Automotive Body Control ModuleIndustrial PLC Output Stage

Use Scenario: Switching 12 V/24 V lighting, HVAC actuators, and door locks in vehicle BCMs.

IC Role / Device Role / Timing Role: High-side load switch controlled by 5 V microcontroller PWM output.

Use Value: Low RDS(ON) minimizes self-heating during continuous duty; logic-level gate enables direct MCU interface without discrete level shifters.

Use Scenario: Driving 24 V solenoids and indicator lamps in programmable logic controller output cards.

IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays in DIN-rail mounted industrial controllers.

Use Value: 136 A pulse rating and 45 mJ avalanche energy withstand inductive kickback without snubber networks, reducing BOM count and board space.

48 V Mild Hybrid DC-DC ConverterBrushed DC Motor Driver

Use Scenario: High-side synchronous rectifier in bidirectional 48 V–12 V DC-DC converters for mild hybrid vehicles.

IC Role / Device Role / Timing Role: Power switch in buck-boost topology with gate driven by dedicated gate driver IC.

Use Value: 55 V VDS rating provides 20 % margin over 48 V nominal bus; low Ciss enables efficient 100–200 kHz switching with moderate gate drive power.

Use Scenario: Half-bridge high-side switch in 24 V brushed DC motor control for power tools and medical pumps.

IC Role / Device Role / Timing Role: Unidirectional power stage switch with integrated body diode providing freewheeling path.

Use Value: 0.95 V VSD forward drop at 25 A reduces freewheeling losses vs. external Schottky diodes; 40 ns trr limits switching loss during commutation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP36NF06L60 V VDS, 36 A ID, 28 mΩ RDS(ON) @ 5 V, TO-220 packageHigher voltage rating but through-hole only; lacks integrated ESD protection (requires external TVS)Preferred where higher voltage margin is critical and PCB layout allows through-hole mounting.
IRF3205PBF55 V VDS, 110 A ID, 8.0 mΩ RDS(ON) @ 10 V, TO-220 packageRequires 10 V gate drive; not logic-level; no ESD rating specified; higher conduction efficiency but incompatible with 3.3 V controlSelected when gate drive can supply ≥10 V and lowest possible RDS(ON) is prioritized over logic compatibility.

Compared with STP36NF06L and IRF3205PBF, the BUK9635-55,118 uniquely combines logic-level drive, integrated 2 kV ESD protection, and surface-mount SOT404 packaging-making it optimal for space-constrained, 5 V-controlled automotive modules where reliability and assembly efficiency are critical.

Availability

BUK9635-55,118 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC output stages, 48 V mild hybrid DC-DC converters, and brushed DC motor drivers requiring stable component supply and long-term production continuity.

Supply support for BUK9635-55,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with origins in Philips' semiconductor division.

The BUK9635-55,118 belongs to NXP's TrenchMOS logic-level power MOSFET product line, engineered specifically for automotive-grade load switching and industrial control where robustness, low gate drive voltage, and high reliability under thermal stress are mandatory.

FAQ

What is the maximum continuous drain current for BUK9635-55,118 at 100 °C mounting base temperature?

The BUK9635-55,118 supports 24 A DC drain current at Tmb = 100 °C, per its limiting values table. This derating reflects thermal constraints of the SOT404 package and ensures safe operation without exceeding the 175 °C maximum junction temperature. At 25 °C mounting base, the rating is 34 A. Designers must verify PCB copper area and airflow to maintain Tmb within spec for the intended load profile.

Does BUK9635-55,118 require an external gate resistor for typical 5 V MCU drive?

While the BUK9635-55,118 can be driven directly by a 5 V MCU GPIO, a small series gate resistor (typically 10–47 Ω) is recommended to dampen ringing and limit peak gate current during fast transitions. The datasheet specifies dynamic timing parameters (e.g., td(on), tr) using RG = 10 Ω, confirming this value as a validated design point for stable switching behavior without oscillation.

Is the mounting base (mb) of BUK9635-55,118 electrically isolated from other pins?

No-the mounting base (mb) of the BUK9635-55,118 is electrically connected to pin 2 (drain), as confirmed by the pinning diagram and mechanical data. This configuration makes the SOT404 package a drain-isolated variant, requiring the mounting pad to be routed to the high-side power net and thermally coupled to a heatsink or large copper pour. Isolation is not provided; careful PCB layout is essential to avoid shorting.

What is the reverse diode forward voltage of BUK9635-55,118 at 34 A?

The reverse diode (body diode) forward voltage of the BUK9635-55,118 is 1.0 V maximum at IF = 34 A and VGS = 0 V, per the "Reverse Diode Characteristics" section. This value is measured under zero gate bias and reflects the intrinsic parasitic diode performance-critical for freewheeling path loss estimation in half-bridge or high-side switch topologies where the diode conducts during dead-time.

Can BUK9635-55,118 be used in linear (analog) regulation mode?

The BUK9635-55,118 is not characterized or rated for linear-mode operation. Its Safe Operating Area (SOA) graph is limited to pulsed conditions, and no continuous linear derating curves are provided. Using it in analog regulation risks thermal runaway due to positive temperature coefficient of RDS(ON) and insufficient SOA margin-designers should select purpose-built linear MOSFETs or bipolar transistors instead.

BUK9635-55,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
TrenchMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
55 V
Current - Continuous Drain (Id) @ 25°C:
34A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
5V
Rds On (Max) @ Id, Vgs:
35mOhm @ 17A, 5V
Vgs(th) (Max) @ Id:
2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
±10V
Input Capacitance (Ciss) (Max) @ Vds:
1400 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
85W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

BUK9635-55,118 FAQ

1.How can I place an order for BUK9635-55,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK9635-55,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK9635-55,118 reliable?

The price and inventory of BUK9635-55,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9635-55,118 is usually 5 days.

3.What payment methods are accepted for BUK9635-55,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9635-55,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK9635-55,118?

BUK9635-55,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK9635-55,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK9635-55,118?

For technical support, including BUK9635-55,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9635-55,118 requirements.

6.How does Aetrix verify that BUK9635-55,118 is sourced from the original manufacturer or authorized distributors?

All BUK9635-55,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9635-55,118 meets industry standards.

7.What is the process for return or replacement of BUK9635-55,118?

All BUK9635-55,118 units undergo pre-shipment inspection (PSI). If there is an issue with BUK9635-55,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK9635-55,118 part is unused and in its original packaging.

Return procedure for BUK9635-55,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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