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NXP Semiconductors BUK964R2-55B/C

Part No.:
BUK964R2-55B/C
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
-
Datasheet:
AetrixBUK964R2-55B/C.pdf
Description:
N-CHANNEL TRENCHMOS LOGIC LEVEL
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Shipping:
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Inventory:2,824

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Product details

Overview

BUK964R2-55B from Nexperia is an AEC-Q101-qualified N-channel TrenchMOS logic-level power MOSFET in D2PAK (SOT404) package, rated for 55 V VDS, 75 A continuous drain current at Tmb = 25 °C, and 3.5 mΩ typical RDS(on) at VGS = 5 V and Tj = 25 °C. It serves as a high-current, thermally robust switch in automotive 12 V/24 V load control circuits including solenoids, lamps, and motors.

For engineers reviewing the BUK964R2-55B datasheet, BUK964R2-55B pinout, BUK964R2-55B application, or BUK964R2-55B equivalent, key selection criteria include its logic-level gate drive compatibility (VGS(th) = 1.1–2.0 V), 175 °C junction rating, avalanche ruggedness (1.2 J), low thermal resistance (Rth(j-mb) = 0.5 K/W), and automotive qualification per AEC-Q101.

Technical Context

This device uses TrenchMOS technology to achieve low on-state resistance while maintaining fast switching performance: QG(tot) = 95 nC and td(off) = 273 ns at VDS = 30 V, enabling efficient operation in high-frequency PWM-controlled loads. Its gate threshold voltage (VGS(th)) remains stable across temperature (0.5 V min at 175 °C), supporting reliable turn-on under hot-cranking conditions.

The integrated source-drain diode exhibits VSD = 0.85 V typical at IS = 40 A and Tj = 25 °C, with trr = 78 ns and Qr = 171 nC - characteristics critical for freewheeling in inductive load switching. Mounting base (mb) is electrically connected to drain, requiring isolation-aware PCB layout.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 55 V maximum - supports full 24 V automotive battery transient (load dump) margin without breakdown.
RDS(on) 3.5 mΩ typical at VGS = 5 V, Tj = 25 °C - enables <1 W conduction loss at 50 A, reducing heatsink requirements.
ID (continuous) 75 A at Tmb = 25 °C - defines maximum steady-state current before thermal derating begins.
Ptot 300 W at Tmb = 25 °C - reflects package-limited power handling with direct mounting base thermal path.
Rth(j-mb) 0.5 K/W maximum - ensures minimal junction-to-mounting-base temperature rise, critical for high-power density designs.
VGS(th) 1.1–2.0 V at Tj = 25 °C - guarantees full enhancement with standard 3.3 V or 5 V microcontroller GPIOs.
EAS 1.2 J non-repetitive avalanche energy - provides robustness against inductive switching transients without external snubbers.

Pinout & Package

Package: D2PAK (SOT404), plastic single-ended surface-mounted package with 3 leads (one lead cropped); mounting base electrically connected to drain terminal.

Pin/Terminal Circuit Role Design Meaning
1 Gate (G) Logic-level control input; requires no level-shifting when driven by 3.3 V/5 V MCUs; gate leakage <100 nA.
2 Drain (D) Main high-side power path; internally bonded to mounting base - must be isolated from PCB ground plane.
3 Source (S) Power return path; referenced to system ground; used for current sensing and feedback in high-side configurations.

Key Features

Feature Design Value
AEC-Q101 qualified Validated for automotive safety-critical applications including engine control, body electronics, and ADAS power stages.
175 °C junction rating Enables operation in under-hood environments without thermal shutdown, extending reliability in thermally constrained enclosures.
Low RDS(on) at 5 V drive 3.5 mΩ typical eliminates need for gate drivers in medium-power switching, simplifying BOM and layout.
Drain-connected mounting base Provides ultra-low thermal resistance path (0.5 K/W) but mandates electrical isolation of heatsink from PCB ground.
Unclamped avalanche capability 1.2 J energy rating allows safe absorption of inductive kickback during fault events without external protection.

Applications

Automotive Load Switching 12 V/24 V Motor Control

Use Scenario: High-side switching of HVAC blower motors, fuel pumps, and radiator fans in passenger vehicles.

IC Role / Device Role / Timing Role: Power switch controlling DC motor direction and speed via PWM; operates at 1–20 kHz switching frequency.

Use Value: Low RDS(on) minimizes I²R losses during continuous operation; 175 °C rating prevents thermal derating in sealed engine bay enclosures.

Use Scenario: Driving brushed DC motors in power seats, window lifts, and sunroof actuators.

IC Role / Device Role / Timing Role: Bidirectional H-bridge half-bridge element; handles reverse recovery during commutation.

Use Value: Fast trr (78 ns) and low Qr (171 nC) reduce switching losses and EMI during direction reversal.

LED Headlamp Driver Solenoid Actuation System

Use Scenario: Constant-current regulation and dimming of high-brightness LED arrays in adaptive front lighting systems (AFS).

IC Role / Device Role / Timing Role: High-side current sink with analog/PWM dimming; operates in linear or saturated mode depending on brightness level.

Use Value: Tight VGS(th) distribution (1.1–2.0 V) ensures consistent turn-on across temperature, preventing LED flicker during cold start.

Use Scenario: Controlling hydraulic or pneumatic solenoid valves in transmission control modules and brake-by-wire systems.

IC Role / Device Role / Timing Role: Pulse-width modulated power switch delivering precise current pulses to solenoid coils.

Use Value: Avalanche ruggedness (1.2 J) absorbs coil flyback energy without clamping diodes, reducing component count and board space.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL220N4LF6AG 40 V VDS, 220 A ID, 1.2 mΩ RDS(on) at 10 V - lower voltage rating, higher current, requires 10 V gate drive for optimal RDS(on). Not suitable for 55 V automotive transients; better for 12 V-only high-current applications like starter relays. Select only if system max VDS ≤40 V and gate drive ≥10 V is available; not drop-in for BUK964R2-55B.
IRF1404ZLPBF 40 V VDS, 180 A ID, 3.8 mΩ RDS(on) at 10 V - lacks AEC-Q101 qualification and 175 °C rating; TO-220 package. Intended for industrial/commercial use only; unsuitable for automotive under-hood deployment. Consider only for non-automotive 12 V systems where qualification and thermal rating are not required.

Compared with STL220N4LF6AG and IRF1404ZLPBF, the BUK964R2-55B uniquely combines 55 V rating, AEC-Q101 qualification, 175 °C operation, and true logic-level drive - making it the only viable option for automotive 24 V load switching where reliability, thermal margin, and gate drive simplicity are jointly required.

Availability

BUK964R2-55B is available at Aetrix Electronics and suitable for automotive body control modules, 12 V/24 V motor drives, and solenoid actuation systems requiring stable component supply across extended production lifecycles.

Supply support for BUK964R2-55B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.

The BUK964R2-55B belongs to Nexperia's TrenchMOS logic-level automotive power MOSFET family, engineered specifically for robust, low-loss switching in harsh automotive environments including engine compartments and chassis electronics.

FAQ

What is the maximum continuous drain current for BUK964R2-55B at 100 °C mounting base temperature?

The BUK964R2-55B supports 75 A continuous drain current at Tmb = 100 °C under VGS = 5 V conditions, as specified in Table 4 of the datasheet. This value is identical to its rating at 25 °C because current is package-limited rather than chip-limited at this temperature range. Derating begins above 100 °C per Figure 1.

Is BUK964R2-55B suitable for high-side switching configurations?

Yes, BUK964R2-55B is commonly used in high-side switching due to its logic-level gate threshold (1.1–2.0 V) and drain-connected mounting base. However, the mounting base must be electrically isolated from PCB ground, and gate drive must reference the source potential - typically requiring a charge pump or isolated gate driver for full enhancement in floating configurations.

Does BUK964R2-55B have built-in avalanche ruggedness, and what is its rated energy?

Yes, BUK964R2-55B is rated for unclamped inductive switching with EAS = 1.2 J at ID = 75 A, Vsup ≤55 V, RGS = 50 Ω, and Tj(init) = 25 °C. This specification is confirmed in Table 1 and Table 4 of the datasheet and enables reliable operation in inductive load circuits without external snubbers.

What is the thermal resistance from junction to mounting base for BUK964R2-55B?

The maximum thermal resistance from junction to mounting base (Rth(j-mb)) for BUK964R2-55B is 0.5 K/W, as stated in Table 5. This low value results from the direct metal mounting base connection to the drain, enabling efficient heat transfer to an external heatsink when properly mounted with thermal interface material.

Can BUK964R2-55B be driven directly by a 3.3 V microcontroller GPIO?

Yes, BUK964R2-55B can be driven directly by a 3.3 V microcontroller GPIO because its gate threshold voltage VGS(th) ranges from 1.1 V to 2.0 V at 25 °C, and its RDS(on) remains low (4.4 mΩ max at VGS = 4.5 V). Full enhancement is achieved with 3.3 V, though RDS(on) will be slightly higher than at 5 V - verified in Figure 6 and Table 6.

BUK964R2-55B/C Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
FET Type:
-
Technology:
-
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
-
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
-
Vgs(th) (Max) @ Id:
-
Gate Charge (Qg) (Max) @ Vgs:
-
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
-
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

BUK964R2-55B/C FAQ

1.How can I place an order for BUK964R2-55B/C through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK964R2-55B/C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK964R2-55B/C reliable?

The price and inventory of BUK964R2-55B/C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK964R2-55B/C is usually 5 days.

3.What payment methods are accepted for BUK964R2-55B/C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK964R2-55B/C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK964R2-55B/C?

BUK964R2-55B/C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK964R2-55B/C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK964R2-55B/C?

For technical support, including BUK964R2-55B/C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK964R2-55B/C requirements.

6.How does Aetrix verify that BUK964R2-55B/C is sourced from the original manufacturer or authorized distributors?

All BUK964R2-55B/C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK964R2-55B/C meets industry standards.

7.What is the process for return or replacement of BUK964R2-55B/C?

All BUK964R2-55B/C units undergo pre-shipment inspection (PSI). If there is an issue with BUK964R2-55B/C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK964R2-55B/C part is unused and in its original packaging.

Return procedure for BUK964R2-55B/C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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