Nexperia USA Inc. BUK9675-55A,118

Overview

BUK9675-55A,118 from Nexperia is a logic-level N-channel TrenchMOS FET in D2PAK (SOT404) package, rated for 55 V V_DS, 20 A continuous drain current at T_mb = 25 °C, and 175 °C junction temperature. It delivers 62 W total power dissipation and features 64–75 mΩ R_DS(on) at V_GS = 5 V and T_j = 25 °C, enabling direct drive from microcontrollers in automotive load switching.

For engineers reviewing the BUK9675-55A,118 datasheet, BUK9675-55A,118 pinout, BUK9675-55A,118 application, or BUK9675-55A,118 equivalent, key selection criteria include AEC-Q101 qualification, thermally robust 175 °C rating, low R_DS(on) at logic-level gate drive, avalanche energy capability (72 mJ), and mounting-base thermal resistance of 2.4 K/W.

Technical Context

This device implements a trench-gate MOSFET architecture optimized for low conduction loss and fast switching in 12 V/24 V automotive power rails. Its gate threshold voltage (V_GS(th)) ranges from 0.5 V (T_j = 175 °C) to 2.3 V (T_j = −55 °C), ensuring reliable turn-on across full automotive temperature range with 5 V logic sources.

It integrates an intrinsic body diode with 0.85–1.2 V forward voltage at 15 A and exhibits 33 ns reverse recovery time under defined dI/dt conditions. Dynamic parameters include C_iss = 440–643 pF, C_oss = 90–111 pF, and turn-off delay t_d(off) = 28 ns - supporting efficient PWM control in motor and solenoid drivers.

Key Specifications

Pinout & Package

Package: D2PAK (SOT404), plastic single-ended surface-mounted package with exposed mounting base electrically connected to drain. Dimensions: 15.8 × 10.3 × 4.5 mm (L × W × H), 3 leads (lead 1 cropped).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power switching applications.

Compared with STL220N5LF5 and IRF3205PBF, BUK9675-55A,118 uniquely combines AEC-Q101 compliance, guaranteed 5 V logic-level operation, and 175 °C capability - making it the only viable choice for production automotive power switches where reliability and thermal margin are non-negotiable.

Availability

BUK9675-55A,118 is available at Aetrix Electronics and suitable for automotive engine control, HVAC motor drives, and transmission solenoid actuation requiring stable component supply across extended product lifecycles.

Supply support for BUK9675-55A,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with deep roots in automotive and industrial power management.

BUK9675-55A,118 belongs to Nexperia's TrenchMOS automotive-qualified power MOSFET family, engineered specifically for robust, thermally efficient switching in 12 V/24 V vehicle subsystems under harsh environmental conditions.

FAQ

Is BUK9675-55A,118 suitable for high-side switching in 24 V automotive systems?

Yes. With 55 V V_DS rating and AEC-Q101 qualification, it supports 24 V nominal systems including load dump transients up to 35 V. Its 175 °C junction rating and low R_DS(on) at 5 V gate drive make it ideal for high-side configurations in battery management and body control modules.

What is the maximum continuous drain current at 100 °C mounting base temperature?

Per Figure 1 in the datasheet, the normalized continuous drain current drops to 70% at T_mb = 100 °C, yielding 14 A (70% of 20 A). This value is explicitly specified in Table 4 (Limiting Values) and validated for sustained operation without derating beyond thermal design limits.

Does BUK9675-55A,118 require a gate resistor for safe switching?

A gate resistor is recommended to control dV/dt and suppress oscillation. Typical values range from 10 Ω to 47 Ω, based on test conditions in the datasheet (RG(ext) = 10 Ω used for timing measurements). The internal gate resistance is not specified, so external limiting ensures reliable turn-on/turn-off behavior in noisy automotive environments.

Can the mounting base be soldered directly to a large copper pour for thermal management?

Yes. The mounting base is electrically connected to the drain and designed for direct soldering to a PCB thermal pad. Nexperia recommends minimum footprint guidelines in Figure 4 and thermal characterization data confirm 2.4 K/W R_th(j-mb) when properly implemented - enabling effective heat extraction without additional mechanical fasteners.