Nexperia USA Inc. BUK9K12-60E/1X
- Part No.:
- BUK9K12-60E/1X
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-1205, 8-LFPAK56
- Datasheet:
-
BUK9K12-60E/1X.pdf
- Description:
- MOSFET 60V 35A LFPAK56D
- Quantity:
- Payment:

- Shipping:

Inventory:2,750
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9K12-60E from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated for 60 V VDS, 11.5 mΩ RDS(on) at 5 V VGS and 25 °C, AEC-Q101 qualified, and rated for continuous operation up to 175 °C junction temperature - deployed in automotive transmission control and high-reliability 12 V power switching.
For engineers reviewing the BUK9K12-60E datasheet, BUK9K12-60E pinout, BUK9K12-60E application, or BUK9K12-60E equivalent, this page delivers verified electrical specs, thermal performance data, dual-FET layout context, and automotive-grade selection guidance without generic marketing language.
Technical Context
This device integrates two independent N-channel TrenchMOS transistors in a single LFPAK56D thermally enhanced package, sharing no internal connection between FET1 and FET2 - each features true logic-level gate drive (VGS(th) > 0.5 V at 175 °C), repetitive avalanche rating, and optimized dynamic parameters including 8.27 nC QGD and 24.5 nC QG(tot).
Its 2.21 K/W Rth(j-mb) enables high-power dissipation (68 W at Tmb = 25 °C) with minimal thermal derating, while the 175 °C maximum junction temperature and -55 °C to +175 °C storage range support under-hood automotive environments where thermal cycling and long-term reliability are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage; supports full 12 V automotive battery transient margin (e.g., load dump up to 40 V). |
| RDS(on) | 11.5 mΩ @ VGS = 5 V, ID = 15 A, Tj = 25 °C - Enables low conduction loss in high-current motor/solenoid drivers. |
| ID | 35 A continuous @ Tmb = 25 °C - Limited by package thermal capability; usable up to 35 A with proper PCB copper area and mounting base cooling. |
| QGD | 8.27 nC - Gate-drain charge directly impacts switching loss and Miller-induced turn-off delay in hard-switched topologies. |
| Rth(j-mb) | 2.21 K/W - Junction-to-mounting-base thermal resistance; defines minimum heatsinking requirement for sustained 35 A operation. |
| Tj(max) | 175 °C - Maximum junction temperature; allows operation in engine bay locations without active cooling. |
| Avalanche Energy | 118 mJ (non-repetitive, EDS(AL)S) - Withstands single-pulse inductive energy during fault events like solenoid de-energization. |
Pinout & Package
LFPAK56D (SOT1205) is a thermally optimized 8-lead surface-mount package with dual exposed drain pads (pins 5/6 = D2, pins 7/8 = D1) and separate source/gate terminals for independent FET control. Mounting base thermal path is integral to mechanical design.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of FET1 - referenced to local ground or current-sense resistor for independent low-side switching. |
| 2 | G1 | Gate input of FET1 - requires 5 V logic-compatible drive; threshold remains functional up to 175 °C. |
| 3 | S2 | Source terminal of FET2 - electrically isolated from S1; enables dual independent half-bridge or H-bridge configurations. |
| 4 | G2 | Gate input of FET2 - fully decoupled from G1; supports asynchronous or complementary control schemes. |
| 5, 6 | D2 | Drain terminal of FET2 - internally paralleled pins reduce inductance and improve current sharing in high-frequency switching. |
| 7, 8 | D1 | Drain terminal of FET1 - dual-pin layout lowers thermal resistance and enhances power handling versus single-pin alternatives. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent N-channel MOSFETs | Enables compact dual-switch solutions (e.g., H-bridge motor driver) without external isolation or discrete pairing. |
| AEC-Q101 qualification | Validated for automotive applications including transmission control modules, meeting stress test requirements for temperature cycling, humidity, and mechanical shock. |
| Repetitive avalanche rated | Supports robust operation in inductive load switching (e.g., fuel injectors, solenoids) without external snubbers in many cases. |
| 175 °C maximum junction temperature | Eliminates need for derating in under-hood environments; maintains RDS(on) stability up to extreme ambient conditions. |
| True logic-level gate (VGS(th) > 0.5 V @ 175 °C) | Ensures reliable turn-on with standard 5 V microcontroller GPIO, even at peak operating temperature. |
Applications
| Transmission Control Module | Fuel Injector Driver |
|---|---|
|
Use Scenario: High-speed on/off control of hydraulic solenoids regulating gear engagement in automatic transmissions. IC Role / Device Role / Timing Role: Dual low-side switch - one FET drives solenoid coil, second handles auxiliary valve or diagnostic path. Use Value: 11.5 mΩ RDS(on) minimizes resistive heating during 10–50 ms pulse-width modulated actuation; 175 °C rating ensures uninterrupted function during prolonged hot-soak conditions. |
Use Scenario: Precision current-controlled switching of 12 V gasoline/diesel fuel injectors with fast rise/fall times. IC Role / Device Role / Timing Role: Single-FET low-side driver with integrated body diode recovery (trr = 22.6 ns) for flyback energy recirculation. Use Value: 25.3 ns fall time and 28 ns rise time enable sub-millisecond injection timing resolution; QGD = 8.27 nC reduces Miller plateau duration during turn-off. |
| Electric Power Steering (EPS) Motor Phase Switch | 12 V Automotive Lighting Control |
|
Use Scenario: Half-bridge leg in brushless DC motor driver for steering assist torque generation. IC Role / Device Role / Timing Role: Dual-FET configuration used as synchronous rectifier pair in phase-leg topology with external high-side driver. Use Value: Dual die layout reduces PCB footprint vs. two discrete SO-8 devices; 68 W Ptot supports intermittent 35 A peak currents during parking maneuvers. |
Use Scenario: PWM dimming and overcurrent protection for LED headlamps and daytime running lights. IC Role / Device Role / Timing Role: Low-side current switch with integrated avalanche ruggedness for lamp open-circuit transients. Use Value: 118 mJ non-repetitive avalanche energy absorbs inductive kick from LED driver inductors; 500 µA IDSS @ 175 °C ensures stable leakage behavior across full temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | 60 V, 2.2 mΩ @ 10 V, 25 °C; requires 10 V gate drive; not AEC-Q101 qualified. | Higher efficiency at 10 V systems but unsuitable for direct 5 V MCU interface or automotive qualification requirements. | Select only for non-automotive, high-efficiency 10 V gate-drive designs where qualification is not required. |
| ON Semiconductor NTMFS5C675NL | 60 V, 5.2 mΩ @ 10 V, 25 °C; LFPAK56 package; AEC-Q101 qualified; single-channel only. | Superior RDS(on) at 10 V but lacks dual-FET integration - requires two devices for same functionality as BUK9K12-60E. | Choose when higher efficiency justifies added board space and routing complexity; verify thermal layout for dual-device placement. |
Compared with STL220N6F7 and NTMFS5C675NL, BUK9K12-60E uniquely combines dual-channel integration, 5 V logic compatibility, AEC-Q101 qualification, and 175 °C operation - making it the only option for space-constrained, thermally demanding automotive dual-switch applications requiring single-package simplicity and guaranteed qualification.
Availability
BUK9K12-60E is available at Aetrix Electronics and suitable for automotive transmission control, fuel injector driving, and electric power steering motor switching requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BUK9K12-60E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic components, with leadership in automotive-qualified MOSFETs and advanced packaging technologies.
The BUK9K series targets high-performance automotive power switching, delivering trench-based MOSFETs optimized for thermal robustness, logic-level drive, and AEC-Q101 compliance in engine bay and chassis control applications.
FAQ
Is BUK9K12-60E pin-compatible with other LFPAK56D dual-MOSFETs?
No - BUK9K12-60E uses a unique pinout (S1-G1-S2-G2-D2-D2-D1-D1) that differs from standard dual-channel LFPAK56D variants like BUK7K13-60E (which has S1-G1-D1-D1-D2-G2-S2-S2). PCB layout must match SOT1205 mechanical outline and terminal mapping exactly; no mechanical or electrical drop-in replacement exists.
What is the maximum continuous drain current at 100 °C mounting base temperature?
Per Figure 2 in the datasheet, the continuous drain current is 35 A at Tmb = 25 °C and remains 35 A at Tmb = 100 °C - limited by package construction rather than silicon thermal limits. Derating begins above 100 °C, reaching ~22 A at Tmb = 150 °C.
Does BUK9K12-60E include integrated ESD protection on gate terminals?
Yes - the device specifies ±100 nA IGSS (gate leakage) at VGS = ±10 V and Tj = 25 °C, indicating robust gate oxide integrity. While not explicitly rated per HBM/CDM standards in the datasheet, its AEC-Q101 qualification includes ESD stress testing per JESD22-A114 (HBM ≥ 2 kV) and JESD22-C101 (CDM ≥ 1 kV).
Can BUK9K12-60E be used in synchronous rectification applications?
Yes - its low RDS(on) (11.5 mΩ), fast switching (tf = 25.3 ns), and integrated body diode with trr = 22.6 ns and Qr = 18.1 nC make it suitable for synchronous rectification in 12 V DC-DC converters, provided gate drive timing avoids shoot-through and layout minimizes common-source inductance.
BUK9K12-60E/1X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1205, 8-LFPAK56
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Technology:
- -
- Configuration:
- -
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 60V
- Current - Continuous Drain (Id) @ 25°C:
- 35A (Ta)
- Rds On (Max) @ Id, Vgs:
- 10.7mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 24.5nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3470pF @ 25V
- Power - Max:
- 68W (Ta)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56D
BUK9K12-60E/1X FAQ
1.How can I place an order for BUK9K12-60E/1X through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9K12-60E/1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9K12-60E/1X reliable?
The price and inventory of BUK9K12-60E/1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9K12-60E/1X is usually 5 days.
3.What payment methods are accepted for BUK9K12-60E/1X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9K12-60E/1X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9K12-60E/1X?
BUK9K12-60E/1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9K12-60E/1X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9K12-60E/1X?
For technical support, including BUK9K12-60E/1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9K12-60E/1X requirements.
6.How does Aetrix verify that BUK9K12-60E/1X is sourced from the original manufacturer or authorized distributors?
All BUK9K12-60E/1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9K12-60E/1X meets industry standards.
7.What is the process for return or replacement of BUK9K12-60E/1X?
All BUK9K12-60E/1X units undergo pre-shipment inspection (PSI). If there is an issue with BUK9K12-60E/1X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9K12-60E/1X part is unused and in its original packaging.
Return procedure for BUK9K12-60E/1X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9K12-60E/1X Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

