Nexperia USA Inc. BUK9K12-60EX
- Part No.:
- BUK9K12-60EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-1205, 8-LFPAK56
- Datasheet:
-
BUK9K12-60EX.pdf
- Description:
- MOSFET 2N-CH 60V 35A LFPAK56D
- Quantity:
- Payment:

- Shipping:

Inventory:16,500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9K12-60EX from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated for 60 V VDS, 11.5 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, AEC-Q101 qualified, and rated for continuous operation up to 175 °C junction temperature - deployed in automotive transmission control and high-reliability 12 V power switching.
For engineers reviewing the BUK9K12-60EX datasheet, BUK9K12-60EX pinout, BUK9K12-60EX application, or BUK9K12-60EX equivalent, this page delivers verified electrical specs, thermal performance data, dual-FET pin assignment, AEC-Q101 qualification context, and direct alternatives for thermally demanding automotive power stages.
Technical Context
This device integrates two independent N-channel TrenchMOS transistors in a single LFPAK56D package with shared mounting base, enabling compact dual-switch topologies without cross-conduction risk. Each FET features true logic-level gate drive (VGS(th) > 0.5 V at 175 °C) and repetitive avalanche rating (EAS = 118 mJ).
Thermal design is enabled by low Rth(j-mb) = 2.21 K/W and 175 °C maximum junction temperature, supporting sustained 35 A continuous drain current at Tmb = 25 °C. Dynamic parameters include QGD = 8.27 nC and tf = 25.3 ns, optimized for fast-switching 12 V automotive loads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage for 12 V automotive systems with load-dump margin |
| RDS(on) | 11.5 mΩ @ VGS = 5 V, Tj = 25 °C - Enables <1.7 W conduction loss at 35 A, critical for thermally constrained PCBs |
| ID | 35 A continuous @ Tmb = 25 °C - Package-limited current capacity suitable for motor/solenoid drivers |
| Ptot | 68 W @ Tmb = 25 °C - High power density enabled by copper-clip LFPAK56D construction |
| Tj(max) | 175 °C - Supports operation in under-hood environments without derating below ambient 125 °C |
| QGD | 8.27 nC - Low gate-drain charge reduces switching losses and improves EMI behavior in PWM control |
| Rth(j-mb) | 2.21 K/W - Enables efficient heat transfer to heatsink or copper plane, reducing thermal interface dependency |
Pinout & Package
LFPAK56D (SOT1205) is a copper-clip, dual-side cooled surface-mount package with 8 leads and exposed mounting base for enhanced thermal performance. Dimensions: 4.70 × 3.50 × 1.05 mm (L × W × H), with 1.27 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of FET1 - Directly connects to low-side return path; electrically isolated from S2 |
| 2 | G1 | Gate terminal of FET1 - Requires logic-level drive (≥2.6 V) for full enhancement; no level-shifting needed |
| 3 | S2 | Source terminal of FET2 - Independent return path for second switch; enables half-bridge or dual-load control |
| 4 | G2 | Gate terminal of FET2 - Fully independent control; supports asynchronous or complementary switching |
| 5, 6 | D2 | Drain terminal of FET2 - Internally paralleled pins for lower inductance and higher current handling |
| 7, 8 | D1 | Drain terminal of FET1 - Internally paralleled pins; supports high-current routing with reduced bond-wire impedance |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive-grade reliability including temperature cycling, HTRB, and UHAST - required for transmission control modules |
| Repetitive avalanche rated | EAS = 118 mJ per FET - Absorbs inductive kickback from solenoids/motors without external snubbers |
| True logic-level gate | VGS(th) > 0.5 V at 175 °C - Ensures turn-on margin across full automotive temperature range with 3.3 V/5 V MCU outputs |
| 175 °C junction rating | Enables operation in engine bay locations where ambient exceeds 125 °C - eliminates need for remote placement or forced cooling |
| Low Rth(j-mb) | 2.21 K/W - Delivers 3× better thermal resistance vs. SO-8, allowing same current in 30% smaller board area |
Applications
| Transmission Control Valve Driver | Automotive HVAC Blower Motor Switch |
|---|---|
|
Use Scenario: Driving 12 V PWM-controlled hydraulic solenoids in automatic transmission valve bodies. IC Role / Device Role / Timing Role: Dual high-side/low-side switch enabling bidirectional current control and regenerative braking of solenoid coils. Use Value: 11.5 mΩ RDS(on) minimizes coil heating during 100% duty-cycle hold; 175 °C rating ensures reliability near hot gearbox housing. |
Use Scenario: Controlling brushed DC blower motor speed in climate control systems via H-bridge configuration. IC Role / Device Role / Timing Role: Two independent N-channel switches forming half-bridge legs; driven by MCU PWM with dead-time control. Use Value: QGD = 8.27 nC enables clean 20 kHz switching with minimal shoot-through risk; avalanche rating handles motor back-EMF spikes. |
| 12 V LED Headlamp Matrix Switch | Engine Start-Stop Solenoid Interface |
|
Use Scenario: Individual channel switching for adaptive LED headlamp segments requiring precise current regulation. IC Role / Device Role / Timing Role: Low-side switch for each LED string, synchronized with constant-current driver ICs. Use Value: 35 A continuous rating supports multi-string parallel operation; low RDS(on) maintains <1% power loss at 10 A per channel. |
Use Scenario: Engaging starter motor solenoid and fuel cutoff valves during engine cranking and restart cycles. IC Role / Device Role / Timing Role: High-current, high-reliability switch interfacing between 12 V battery rail and safety-critical actuators. Use Value: AEC-Q101 qualification and 118 mJ avalanche energy ensure fail-safe operation during cold-cranking voltage dips and load dump transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | 60 V, 2.2 mΩ @ 10 V, requires 10 V gate drive; not AEC-Q101 qualified | Targeted at industrial motor drives, not automotive safety-critical use | Select only if system uses 10 V gate drivers and does not require automotive qualification |
| ON Semiconductor NTMFS5C675NL | 60 V, 5.8 mΩ @ 10 V, LFPAK56 package, AEC-Q101 qualified but rated only to 150 °C Tj | Suitable for less thermally aggressive under-hood locations | Prefer when lower RDS(on) is critical and junction temperature stays ≤150 °C |
Compared with STL220N6F7 and NTMFS5C675NL, BUK9K12-60EX uniquely combines AEC-Q101 qualification, 175 °C operation, and true 5 V logic-level drive - making it the only option for high-temperature, safety-critical automotive dual-switching where gate drive voltage and thermal margin are constrained.
Availability
BUK9K12-60EX is available at Aetrix Electronics and suitable for automotive transmission control, HVAC blower motor interfaces, adaptive LED lighting systems, and engine start-stop solenoid actuation requiring stable component supply across extended product lifecycles.
Supply support for BUK9K12-60EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and advanced packaging.
The BUK9K series belongs to Nexperia's AEC-Q101-qualified logic-level automotive MOSFET family, engineered specifically for thermally demanding 12 V power switching in transmission, chassis, and body control modules.
FAQ
Is BUK9K12-60EX pin-compatible with standard SO-8 dual MOSFETs?
No. BUK9K12-60EX uses LFPAK56D (SOT1205), a copper-clip package with different pin layout and thermal pad geometry versus SO-8. Pin 1–4 map to S1/G1/S2/G2, while pins 5–8 are paralleled drain terminals (D2/D2/D1/D1). PCB footprint must match SOT1205 mechanical drawing.
What is the maximum safe operating frequency for PWM switching?
Based on tf = 25.3 ns and QGD = 8.27 nC, reliable operation extends to ≥100 kHz with appropriate gate driving (5 Ω series resistance, 5 V logic-level source). Thermal limits govern practical upper bound: at 35 A and 60 V, switching losses constrain duty cycle and frequency in high-power applications.
Does BUK9K12-60EX support paralleling of the two FETs for higher current?
No. The two FETs share no internal connection and have independent gates and sources. Paralleling would require matched gate drive timing and external current-sharing resistors. Its intended use is dual independent switching - e.g., half-bridge legs or separate load controls - not current stacking.
How does the 175 °C rating impact PCB layout requirements?
The 175 °C rating allows operation with higher board temperatures, but thermal design remains critical: the mounting base must be soldered to ≥200 mm² of 2 oz copper with ≥4 thermal vias to internal ground planes. Use of solder mask defined pads and controlled reflow profile (peak 260 °C) is mandatory to maintain long-term bond integrity.
BUK9K12-60EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1205, 8-LFPAK56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 60V
- Current - Continuous Drain (Id) @ 25°C:
- 35A
- Rds On (Max) @ Id, Vgs:
- 10.7mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 24.5nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3470pF @ 25V
- Power - Max:
- 68W
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56D
BUK9K12-60EX FAQ
1.How can I place an order for BUK9K12-60EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9K12-60EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9K12-60EX reliable?
The price and inventory of BUK9K12-60EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9K12-60EX is usually 5 days.
3.What payment methods are accepted for BUK9K12-60EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9K12-60EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9K12-60EX?
BUK9K12-60EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9K12-60EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9K12-60EX?
For technical support, including BUK9K12-60EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9K12-60EX requirements.
6.How does Aetrix verify that BUK9K12-60EX is sourced from the original manufacturer or authorized distributors?
All BUK9K12-60EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9K12-60EX meets industry standards.
7.What is the process for return or replacement of BUK9K12-60EX?
All BUK9K12-60EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9K12-60EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9K12-60EX part is unused and in its original packaging.
Return procedure for BUK9K12-60EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9K12-60EX Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

