Nexperia USA Inc. BUK9K49-80LX
- Part No.:
- BUK9K49-80LX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FET, MOSFET Arrays
- Package:
- SOT-1205, 8-LFPAK56
- Datasheet:
-
BUK9K49-80LX.pdf
- Description:
- MOSFET 2N-CH 80V 17A LFPAK56D
- Quantity:
- Payment:

- Shipping:

Inventory:1,487
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9K49-80L from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated for 80 V drain-source voltage, 49 mΩ RDS(on) at VGS = 4.5 V and Tj = 25 °C, and qualified to AEC-Q101 for automotive use up to 175 °C junction temperature. It integrates two trench-based silicon dies for space-efficient motor, lighting, and transmission control in 12 V/24 V/48 V systems.
For engineers reviewing the BUK9K49-80L datasheet, BUK9K49-80L pinout, BUK9K49-80L application, or BUK9K49-80L equivalent, this page delivers verified electrical parameters, dual-die thermal behavior, side-wettable flanks packaging details, and AEC-Q101-compliant switching performance under real automotive thermal and avalanche stress conditions.
Technical Context
This dual MOSFET uses Nexperia's Trench12 technology to achieve low RDS(on) with soft body-diode recovery-critical for reducing EMI and voltage spikes in inductive load switching. Its gate threshold voltage (VGS(th)) ranges from 0.5 V (Tj = 175 °C) to 2.45 V (Tj = −55 °C), enabling robust logic-level drive across automotive temperature extremes.
The device features identical FET1 and FET2 channels with matched dynamic characteristics: QG(tot) = 12 nC typ at VGS = 10 V, QGD = 1.6 nC typ, and Ciss = 734 pF typ-supporting fast, controlled switching in high-frequency PWM circuits while maintaining avalanche ruggedness (EAS = 25.7 mJ).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V maximum - supports full operation in 48 V automotive architectures with margin against load dump transients. |
| RDS(on) | 39 mΩ typical at VGS = 10 V, 25 °C - enables <1.5 W conduction loss at 6 A continuous current with minimal heatsinking. |
| ID | 17 A continuous (Tmb = 25 °C) - validated in application tests; practical limit set by PCB copper area and thermal interface design. |
| QGD | 1.6 nC typical - low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency. |
| Rth(j-mb) | 4.2 K/W typical - junction-to-mounting-base thermal resistance allows direct thermal coupling to heatsinked PCBs without external thermal vias. |
| EAS | 25.7 mJ non-repetitive - provides single-pulse avalanche energy handling up to 4.8 A at 80 V, enhancing reliability in inductive fault events. |
| VGS(th) | 1.7 V typical at 25 °C - ensures reliable turn-on with standard 3.3 V or 5 V microcontroller GPIOs without level-shifting. |
Pinout & Package
LFPAK56D (SOT1205) is a dual-die, single-ended surface-mount package with side-wettable flanks for automated optical inspection and solder-joint reliability. Dimensions: 4.95 mm × 5.30 mm × 1.02 mm (L × W × H), with 8 leads and exposed mounting base for thermal transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | S1 | Source terminal of FET1 - electrically isolated from S2; connects to low-side return path of first channel. |
| 2 | G1 | Gate terminal of FET1 - requires ≤20 V drive; low input capacitance (Ciss = 734 pF) eases driver selection. |
| 3 | S2 | Source terminal of FET2 - independent of S1; enables dual half-bridge or independent load control topologies. |
| 4 | G2 | Gate terminal of FET2 - fully decoupled from G1; supports asynchronous or synchronized dual-channel gate driving. |
| 5, 6 | D2 | Drain terminals of FET2 - paralleled internally; connects to high-side power rail for second channel. |
| 7, 8 | D1 | Drain terminals of FET1 - paralleled internally; designed for high-current routing with low-inductance layout. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-die integration in single LFPAK56D | Reduces board area by >40% vs. two discrete SO-8 MOSFETs while maintaining identical thermal and electrical performance per channel. |
| Trench12 process technology | Delivers 39 mΩ RDS(on) at 4.5 V drive and 25 °C, enabling efficient 3.3 V MCU control without gate drivers. |
| Soft body-diode recovery | Qr = 7.5 nC typical reduces voltage overshoot during freewheeling, lowering EMI filter requirements in motor drives. |
| Side-wettable flanks | Enables AOI-compatible solder joint verification on production lines-critical for zero-defect automotive manufacturing. |
| AEC-Q101 qualification (175 °C) | Validated for continuous operation in engine bay and transmission control modules where ambient temperatures exceed 125 °C. |
Applications
| Motor Control | LED Lighting |
|---|---|
|
Use Scenario: Bidirectional DC motor control in automotive seat adjusters and HVAC blower modules. IC Role / Device Role / Timing Role: Dual N-channel configuration used as half-bridge upper/lower switches with synchronous rectification. Use Value: Low RDS(on) and soft diode recovery reduce conduction and switching losses, extending battery runtime and minimizing thermal derating. |
Use Scenario: High-brightness LED headlamp dimming and matrix control in 48 V architectures. IC Role / Device Role / Timing Role: High-side switch for PWM current regulation with fast turn-off (tf = 4.9 ns) to maintain precise duty cycle fidelity. Use Value: 80 V rating accommodates 48 V system transients; side-wettable flanks ensure solder integrity under thermal cycling in exterior lighting. |
| Transmission Control | Circuit Protection |
|
Use Scenario: Solenoid actuation in 8-speed automatic transmission valve bodies. IC Role / Device Role / Timing Role: Low-side driver for inductive solenoids with integrated avalanche energy handling (25.7 mJ). Use Value: Eliminates need for external flyback diodes; robust single-pulse avalanche withstand prevents failure during solenoid de-energization. |
Use Scenario: Reverse polarity and overcurrent protection in 12 V infotainment power supplies. IC Role / Device Role / Timing Role: Back-to-back configured dual MOSFET for bidirectional blocking and active current limiting. Use Value: Matched RDS(on) between FET1/FET2 ensures symmetrical forward/reverse conduction; AEC-Q101 grade guarantees field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon BSC028N06NS3 | Single-channel 60 V, 2.8 mΩ; no dual-die integration or side-wettable flanks. | Requires two devices and larger PCB area; lacks AEC-Q101 qualification at 175 °C. | Select only if lower RDS(on) at 60 V is prioritized over space, thermal integration, and automotive qualification. |
| ON Semiconductor NTMFS5C675NL | Single-channel 60 V, 3.4 mΩ; PowerSO-8 package without side-wettable flanks or AEC-Q101 175 °C rating. | Not suitable for 48 V systems or high-temperature under-hood placement; limited to cabin-grade applications. | Choose only for cost-sensitive 12 V interior modules where extended temperature range and AOI support are unnecessary. |
Compared with BSC028N06NS3 and NTMFS5C675NL, the BUK9K49-80L uniquely combines dual-channel integration, 80 V capability, side-wettable flanks, and full AEC-Q101 qualification-making it the only option that satisfies space-constrained, thermally demanding, and safety-critical automotive power switching requirements in one package.
Availability
BUK9K49-80L is available at Aetrix Electronics and suitable for automotive motor control, LED lighting systems, transmission solenoid drivers, and circuit protection modules requiring stable component supply across long production lifecycles.
Supply support for BUK9K49-80L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.
The BUK9K49-80L belongs to Nexperia's LFPAK automotive MOSFET family, engineered specifically for space-constrained, thermally aggressive automotive power switching applications requiring AEC-Q101 compliance and robust manufacturability.
FAQ
What is the maximum continuous drain current for each channel of the BUK9K49-80L?
Each channel supports 17 A continuous drain current at Tmb = 25 °C, as demonstrated in application testing. Real-world current capability depends on PCB copper area, thermal interface resistance, and ambient temperature-derating to 12 A is recommended at Tmb = 100 °C per Figure 2 of the datasheet.
Does the BUK9K49-80L require a gate driver when driven by a 3.3 V microcontroller?
No external gate driver is required: VGS(th) is as low as 0.5 V at 175 °C, and RDS(on) remains 113 mΩ typical at VGS = 4.5 V and Tj = 175 °C. A 3.3 V GPIO can fully enhance both channels, though layout must minimize gate loop inductance to avoid ringing.
How does the side-wettable flank feature improve manufacturing yield?
Side-wettable flanks expose solderable metal along the package edges, enabling automated optical inspection (AOI) to verify solder fillet formation and joint completeness-reducing field failures from voided or insufficient solder joints in high-vibration automotive environments.
Can the BUK9K49-80L be used in back-to-back configuration for AC switching?
Yes: the dual N-channel structure allows back-to-back connection (sources tied together, drains as AC terminals) for solid-state relay functionality. Each channel blocks 80 V in either direction, and matched RDS(on) ensures symmetrical conduction-ideal for 24 V/48 V DC-AC inverters and bidirectional power switches.
BUK9K49-80LX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1205, 8-LFPAK56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 80V
- Current - Continuous Drain (Id) @ 25°C:
- 17A (Ta)
- Rds On (Max) @ Id, Vgs:
- 48.5mOhm @ 5A, 10V
- Vgs(th) (Max) @ Id:
- 2.05V @ 30µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17.6nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1028pF @ 25V
- Power - Max:
- 32W (Ta)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56D
BUK9K49-80LX FAQ
1.How can I place an order for BUK9K49-80LX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9K49-80LX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9K49-80LX reliable?
The price and inventory of BUK9K49-80LX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9K49-80LX is usually 5 days.
3.What payment methods are accepted for BUK9K49-80LX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9K49-80LX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9K49-80LX?
BUK9K49-80LX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9K49-80LX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9K49-80LX?
For technical support, including BUK9K49-80LX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9K49-80LX requirements.
6.How does Aetrix verify that BUK9K49-80LX is sourced from the original manufacturer or authorized distributors?
All BUK9K49-80LX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9K49-80LX meets industry standards.
7.What is the process for return or replacement of BUK9K49-80LX?
All BUK9K49-80LX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9K49-80LX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9K49-80LX part is unused and in its original packaging.
Return procedure for BUK9K49-80LX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9K49-80LX Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

