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Nexperia USA Inc. BUK9K52-60RAX

Part No.:
BUK9K52-60RAX
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
SOT-1205, 8-LFPAK56
Datasheet:
AetrixBUK9K52-60RAX.pdf
Description:
MOSFET 2N-CH 60V 16A LFPAK56D
Quantity:
Payment:
Payment
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Inventory:2,338

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Product details

Overview

BUK9K52-60RA from Nexperia is a dual N-channel logic-level MOSFET in LFPAK56D (SOT1205) package, rated 60 V VDS, 55 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, AEC-Q101 qualified to 175 °C, and engineered for repetitive avalanche operation in automotive power switching. It serves as a robust high-side/low-side switch in engine control modules and transmission control units.

For engineers reviewing the BUK9K52-60RA datasheet, BUK9K52-60RA pinout, BUK9K52-60RA application, or BUK9K52-60RA equivalent, key selection criteria include its 30 °C junction temperature rise under repetitive avalanche stress, dual-channel isolation, LFPAK56D thermal resistance of 4.68 K/W (j-mb), and compatibility with 5 V logic drive in 12 V–48 V automotive systems.

Technical Context

This device integrates two independent N-channel MOSFETs on a single die within an LFPAK56D copper-clip package, enabling synchronous or isolated dual-switch topologies. Its silicon uses Application Specific FET (ASFET) technology optimized for unclamped inductive switching, with validated 1 billion avalanche events at ≤30 °C Tj rise.

The gate threshold voltage ranges from 1.4 V (min) to 2.45 V (max) across -55 °C to 175 °C, ensuring reliable turn-on with standard 5 V microcontroller outputs. Dynamic parameters-including QGD = 2.3 nC, Ciss = 725 pF max, and tf = 9 ns-support fast, low-loss switching in PWM-driven actuators and auxiliary loads.

Key Specifications

ParameterValue and Actual Design Meaning
VDS60 V - Maximum drain-source blocking voltage compatible with 48 V automotive architectures.
RDS(on)47.3 mΩ typ @ VGS = 5 V, Tj = 25 °C - Enables low conduction loss in high-current motor drivers and solenoid controls.
ID16 A continuous @ Tmb = 25 °C - Supports sustained load currents typical in transmission valve coils and HVAC blowers.
EDS(AL)R19.5 mJ per event - Repetitive avalanche energy rating enabling robust operation in inductive flyback without external snubbers.
Rth(j-mb)4.68 K/W - Low junction-to-mounting-base thermal resistance ensures efficient heat transfer to PCB copper planes.
QGD2.3 nC - Gate-drain charge directly impacts switching loss and dv/dt immunity in high-frequency PWM stages.
VGS(th)1.7 V typ @ Tj = 25 °C - Ensures full enhancement with 3.3 V or 5 V logic-level gate drivers without level-shifting.

Pinout & Package

Package: LFPAK56D (SOT1205), 8-lead single-ended surface-mount package with gull-wing leads and integrated copper clip for enhanced thermal and electrical performance.

Pin/TerminalCircuit RoleDesign Meaning
1S1Source terminal of FET1 - electrically isolated from S2; connects to low-side return path in half-bridge configurations.
2G1Gate terminal of FET1 - requires <2.5 V drive for turn-off; decoupling capacitor placement critical for EMI suppression.
3S2Source terminal of FET2 - independent of S1; enables dual-channel grounding flexibility in multi-load systems.
4G2Gate terminal of FET2 - fully isolated from G1; supports asynchronous control of two separate loads.
5, 6D2Drain terminal of FET2 - internally paralleled pins (5 & 6) reduce current density and parasitic inductance at high di/dt.
7, 8D1Drain terminal of FET1 - internally paralleled pins (7 & 8) provide low-inductance connection to power rail or inductive load.

Key Features

FeatureDesign Value
AEC-Q101 qualificationValidated for automotive use up to 175 °C junction temperature, supporting under-hood deployment without derating.
Repetitive avalanche ratingTested to 1 billion unclamped inductive switching events at ≤30 °C Tj rise - eliminates need for external avalanche protection components.
LFPAK56D copper clip constructionReduces RDS(on) by ~20% vs. standard SO8 and improves thermal cycling reliability over 1000 cycles.
Gull-wing lead formEnables automated optical inspection (AOI) and high-yield reflow soldering on standard SMT lines without tombstoning risk.
Logic-level gate driveVGS(th) ≤ 2.45 V max ensures full enhancement with 3.3 V MCU GPIOs, reducing system BOM cost and complexity.

Applications

Engine Control Unit (ECU)Transmission Control Module (TCM)

Use Scenario: Driving fuel injector solenoids and ignition coil primary windings in gasoline direct injection systems.

IC Role / Device Role / Timing Role: Dual-channel high-side switch managing sequential firing timing and current limiting via PWM duty cycle.

Use Value: 60 V rating withstands battery transients up to ISO 7637-2 Pulse 5a; 19.5 mJ avalanche energy absorbs inductive kickback without clamping diodes.

Use Scenario: Controlling hydraulic pressure valves and shift solenoids in 8-speed automatic transmissions.

IC Role / Device Role / Timing Role: Independent low-side driver for proportional solenoid current regulation with µs-level turn-off response.

Use Value: 47.3 mΩ RDS(on) minimizes I²R heating during sustained 5–10 A valve hold currents; gull-wing leads ensure solder joint integrity under vibration.

Electric Power Steering (EPS)Body Control Module (BCM)

Use Scenario: Managing assist motor phase current in brushless DC motor controllers using six-step commutation.

IC Role / Device Role / Timing Role: Half-bridge upper/lower switch pair delivering precise torque modulation with <10 ns fall time.

Use Value: QGD = 2.3 nC and tf = 9 ns enable >20 kHz PWM without excessive switching loss; dual isolation prevents shoot-through faults.

Use Scenario: Switching auxiliary loads including seat heaters, window lift motors, and HVAC blower fans.

IC Role / Device Role / Timing Role: Standalone dual load switch providing short-circuit protected, current-limited power distribution.

Use Value: 16 A continuous rating supports 200 W heater elements; AEC-Q101 qualification ensures 15-year field reliability in cabin environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel automotive MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon BSC020N06NS3Single-channel 60 V, 2.0 mΩ RDS(on); TO-263 package; no repetitive avalanche rating.Requires two devices for dual functionality; higher thermal resistance (Rth(j-mb) ≈ 12 K/W) limits power density.Choose when ultra-low RDS(on) is prioritized over integration and avalanche ruggedness.
ON Semiconductor NTMFS5C675NLDual-channel 60 V, 6.7 mΩ RDS(on); PowerTrench® 5x6 mm; AEC-Q101 qualified but not avalanche-rated.Lacks documented repetitive avalanche endurance; lower current rating (12 A) restricts use in high-power actuators.Prefer for space-constrained designs where avalanche stress is mitigated externally.

Compared with BUK9K52-60RA, BSC020N06NS3 offers lower conduction loss but doubles component count and thermal overhead, while NTMFS5C675NL saves board area yet sacrifices proven avalanche resilience-making BUK9K52-60RA the optimal choice for unclamped inductive switching in safety-critical automotive subsystems.

Availability

BUK9K52-60RA is available at Aetrix Electronics and suitable for engine control, transmission control, electric power steering, and body control module applications requiring stable component supply across extended automotive lifecycles.

Supply support for BUK9K52-60RA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors for automotive, industrial, and consumer markets, with leadership in MOSFETs, logic, and ESD protection.

BUK9K52-60RA belongs to Nexperia's ASFET (Application Specific FET) product line, designed specifically for ruggedized automotive power switching where repetitive avalanche capability, AEC-Q101 compliance, and LFPAK thermal performance are mandatory.

FAQ

What is the maximum continuous drain current for BUK9K52-60RA at 100 °C mounting base temperature?

At Tmb = 100 °C, the continuous drain current is 11 A per channel, as specified in Table 5 (Limiting values). This derating reflects thermal constraints of the LFPAK56D package and ensures safe operation within the 175 °C maximum junction temperature limit under sustained load conditions.

Does BUK9K52-60RA support parallel operation of both channels for higher current capacity?

No-BUK9K52-60RA integrates two electrically isolated N-channel MOSFETs sharing only the package substrate; its pinout (separate S1/G1/D1 and S2/G2/D2) prohibits internal paralleling. Each channel must be driven and loaded independently to maintain thermal balance and avoid current imbalance-induced failure.

How does the 30 °C junction temperature rise specification relate to repetitive avalanche testing?

The 30 °C Tj rise is the maximum allowable junction-to-ambient temperature increase per avalanche event during the 1 billion-event qualification test. It defines the thermal boundary that ensures silicon integrity and parameter stability across lifetime operation, verified under Vsup ≤ 60 V, ID = 0.5 A, and RGS = 10 Ω conditions per Figure 4 and 5.

Can BUK9K52-60RA be used with 3.3 V microcontroller GPIOs without external level shifting?

Yes-its VGS(th) is 1.7 V typical and 2.45 V maximum at 25 °C, and remains ≥0.5 V even at 175 °C. With 3.3 V drive, the device achieves full enhancement (RDS(on) ≤ 55 mΩ) and delivers rated 16 A current, confirmed in Figure 10 and Table 7.

BUK9K52-60RAX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-1205, 8-LFPAK56
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
60V
Current - Continuous Drain (Id) @ 25°C:
16A (Ta)
Rds On (Max) @ Id, Vgs:
49mOhm @ 5A, 10V
Vgs(th) (Max) @ Id:
2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
5.6nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds:
725pF @ 25V
Power - Max:
32W (Ta)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK56D

BUK9K52-60RAX FAQ

1.How can I place an order for BUK9K52-60RAX through Aetrix?

Please submit a Request for Quotation (RFQ) for BUK9K52-60RAX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BUK9K52-60RAX reliable?

The price and inventory of BUK9K52-60RAX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9K52-60RAX is usually 5 days.

3.What payment methods are accepted for BUK9K52-60RAX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9K52-60RAX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BUK9K52-60RAX?

BUK9K52-60RAX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BUK9K52-60RAX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BUK9K52-60RAX?

For technical support, including BUK9K52-60RAX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9K52-60RAX requirements.

6.How does Aetrix verify that BUK9K52-60RAX is sourced from the original manufacturer or authorized distributors?

All BUK9K52-60RAX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9K52-60RAX meets industry standards.

7.What is the process for return or replacement of BUK9K52-60RAX?

All BUK9K52-60RAX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9K52-60RAX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BUK9K52-60RAX part is unused and in its original packaging.

Return procedure for BUK9K52-60RAX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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