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Nexperia USA Inc. BUK9M10-30EX
- Part No.:
- BUK9M10-30EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK9M10-30EX.pdf
- Description:
- MOSFET N-CH 30V 54A LFPAK33
- Quantity:
- Payment:
- Shipping:
Inventory:533
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Product details
Overview
BUK9M10-30EX from Nexperia is an AEC-Q101 qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, designed for 12 V automotive power switching. It delivers 54 A continuous drain current at Tmb = 25 °C, 10 mΩ RDS(on) at VGS = 5 V and 25 °C, 30 V VDS rating, and operates up to 175 °C junction temperature - enabling direct drive from microcontroller GPIOs in motor, lamp, and solenoid control circuits.
For engineers reviewing the BUK9M10-30EX datasheet, BUK9M10-30EX pinout, BUK9M10-30EX application, or BUK9M10-30EX equivalent, key selection criteria include its true logic-level gate (VGS(th) > 0.5 V at 175 °C), repetitive avalanche rating, 2.46 K/W junction-to-mounting-base thermal resistance, and LFPAK33 package's high-power density for thermally constrained automotive PCB layouts.
Technical Context
This MOSFET uses TrenchMOS technology to achieve low on-resistance and fast switching with QGD = 5.5 nC and tr = 22 ns at VDS = 25 V. Its gate threshold voltage remains functional across -55 °C to 175 °C, with VGS(th) = 1.4–2.1 V at 25 °C and ≥0.5 V at 175 °C, ensuring reliable turn-on under extreme thermal stress.
The device integrates a robust body diode with VSD = 0.84–1.2 V at IS = 15 A and trr = 13.9 ns, supporting freewheeling in inductive loads. Its unclamped avalanche energy EAS = 28.3 mJ enables rugged operation in transient overvoltage conditions common in 12 V vehicle electrical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage compatible with 12 V automotive battery systems including load dump transients. |
| RDS(on) | 8.1–10 mΩ @ VGS = 5 V, ID = 15 A, Tj = 25 °C - Enables low conduction loss in high-current switching nodes (e.g., <0.8 W at 30 A). |
| ID (cont) | 54 A @ Tmb = 25 °C - Supports high-power actuator drivers without external heatsinking in compact layouts. |
| QGD | 5.5 nC - Low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency. |
| Rth(j-mb) | 2.46 K/W - Junction-to-mounting-base thermal resistance allows direct thermal coupling to PCB copper pour or heatsink for sustained 38 A operation at Tmb = 100 °C. |
| Tj max | 175 °C - Extended junction temperature rating supports placement near hot components (e.g., engine control units) without derating. |
| Avalanche | Repetitive - Rated for repeated unclamped inductive switching events, critical for transmission solenoid and fuel injector drivers. |
Pinout & Package
LFPAK33 (SOT1210) is a surface-mount, single-ended power package with exposed mounting base connected to drain, optimized for high-current, low-inductance PCB layout and efficient thermal transfer via soldered copper area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond wire inductance and improve current sharing in high-di/dt applications. |
| 4 | Gate (G) | Single gate input with low Ciss (939–1249 pF) enables fast, low-energy switching using standard logic-level drivers. |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically and thermally connected to drain - must be soldered to large PCB copper pour for thermal and electrical performance. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive-grade reliability including temperature cycling, humidity testing, and mechanical shock per JESD47. |
| True logic-level gate | VGS(th) ≥ 0.5 V at 175 °C ensures guaranteed turn-on with 3.3 V or 5 V MCU outputs even under full thermal stress. |
| Repetitive avalanche rating | 28.3 mJ single-pulse EAS with validated repetitive capability - eliminates need for external snubbers in solenoid/motor flyback paths. |
| Thermal robustness | 175 °C maximum junction temperature and 2.46 K/W Rth(j-mb) enable operation in under-hood environments without forced cooling. |
| Low dynamic losses | QG(tot) = 12.2 nC and QGD/QGS ratio of ~2.1 support efficient 100 kHz+ PWM in DC-DC and motor control stages. |
Applications
| Engine Cooling Fan Control | Automatic Transmission Solenoid Driver |
|---|---|
|
Use Scenario: PWM-controlled 12 V brushless fan module in engine bay with ambient temperatures up to 125 °C. IC Role / Device Role / Timing Role: High-side or low-side power switch regulating fan speed via 20 kHz PWM, handling peak currents up to 45 A. Use Value: 10 mΩ RDS(on) limits conduction loss to <2.1 W at 45 A, while 175 °C rating avoids thermal shutdown during prolonged high-load operation. |
Use Scenario: Driving linear solenoids in 8-speed automatic transmission valve body with rapid duty-cycle changes. IC Role / Device Role / Timing Role: Low-side switch controlling solenoid current with <20 ns turn-off delay and 13.9 ns reverse recovery time for precise hydraulic pressure modulation. Use Value: Repetitive avalanche rating absorbs inductive kickback without clamping diodes; 5.5 nC QGD ensures clean, jitter-free current transitions during gear shifts. |
| LED Headlamp Dimming Circuit | Start-Stop System Battery Disconnect |
|
Use Scenario: High-current LED matrix dimming in adaptive front lighting systems requiring flicker-free 1–10 kHz PWM. IC Role / Device Role / Timing Role: Synchronous rectifier and current sink in buck-based constant-current driver, switching at 500 kHz with minimal dead-time loss. Use Value: Low Coss (201–241 pF) and fast tf = 17.2 ns reduce switching loss and EMI; 30 V rating accommodates 12 V system transients. |
Use Scenario: Bidirectional main battery disconnect switch in start-stop systems managing 12 V supply during engine cranking and restart. IC Role / Device Role / Timing Role: Back-to-back configured MOSFET pair (with external companion) providing controlled soft-start and fault-isolation capability. Use Value: 216 A pulsed IDM and 54 A continuous rating handle cranking surge; 175 °C operation ensures reliability during repeated thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N3LLH6 | 30 V, 2.2 mΩ RDS(on), PowerFLAT 5x6 package, 175 °C rated but not AEC-Q101 qualified. | Lacks automotive qualification; suitable only for industrial or consumer designs where AEC compliance is not mandated. | Select only if lower RDS(on) outweighs qualification requirements and thermal design permits higher power density. |
| ON Semiconductor NTMFS4C09NT1G | 30 V, 9.5 mΩ RDS(on), SO-8FL package, AEC-Q101 qualified, but Rth(j-mb) = 3.5 K/W - 42% higher than BUK9M10-30EX. | Lower thermal performance limits continuous current to ~32 A at Tmb = 100 °C versus 38 A for BUK9M10-30EX. | Prefer when board space is constrained and SO-8FL footprint is required; accept reduced thermal headroom. |
Compared with STL220N3LLH6 and NTMFS4C09NT1G, BUK9M10-30EX uniquely balances AEC-Q101 compliance, 10 mΩ on-resistance, 2.46 K/W thermal resistance, and LFPAK33's superior power-handling in automotive under-hood locations - making it optimal for thermally aggressive, safety-critical switching where qualification and thermal margin are non-negotiable.
Availability
BUK9M10-30EX is available at Aetrix Electronics and suitable for engine cooling fan control, automatic transmission solenoid drivers, and LED headlamp dimming circuits requiring stable component supply across automotive production lifecycles.
Supply support for BUK9M10-30EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs and ESD protection.
BUK9M10-30EX belongs to Nexperia's LFPAK automotive logic-level MOSFET product line, engineered specifically for thermally demanding 12 V automotive power switching applications requiring AEC-Q101 compliance and robust avalanche performance.
FAQ
Is BUK9M10-30EX pin-compatible with other LFPAK33 MOSFETs?
Yes - BUK9M10-30EX uses the standardized LFPAK33 (SOT1210) footprint with pins 1–3 as source, pin 4 as gate, and mounting base as drain. All Nexperia LFPAK33 MOSFETs share identical land pattern and thermal pad layout, enabling drop-in replacement within the same voltage/current class.
What is the maximum safe operating frequency for PWM switching?
Based on its 5.5 nC QGD, 22 ns tr, and 17.2 ns tf, BUK9M10-30EX supports reliable PWM operation up to 500 kHz in hard-switched topologies and 1 MHz in resonant or zero-voltage-switching configurations - provided gate drive strength exceeds 1 A peak and layout minimizes parasitic inductance.
Does the mounting base require electrical isolation from the PCB ground plane?
No - the mounting base is internally connected to the drain terminal and must be soldered directly to a dedicated drain copper pour. Electrical isolation would compromise thermal performance and violate the device's Safe Operating Area (SOA) ratings; proper layout requires separation from adjacent signal or source planes per IPC-2221 creepage requirements.
Can BUK9M10-30EX replace older BUK9Y series MOSFETs in existing designs?
Yes - BUK9M10-30EX supersedes BUK9Y10-30E with identical pinout, improved RDS(on) (10 mΩ vs. 12 mΩ), and enhanced thermal resistance (2.46 K/W vs. 2.9 K/W). No layout changes are needed; verify gate drive timing margins due to slightly lower QG (12.2 nC vs. 13.5 nC) and confirm SOA compliance at elevated temperatures.
BUK9M10-30EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 54A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V
- Rds On (Max) @ Id, Vgs:
- 7.8mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.2 nC @ 5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1249 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 55W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK9M10-30EX FAQ
1.How can I place an order for BUK9M10-30EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9M10-30EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9M10-30EX reliable?
The price and inventory of BUK9M10-30EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M10-30EX is usually 5 days.
3.What payment methods are accepted for BUK9M10-30EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M10-30EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9M10-30EX?
BUK9M10-30EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9M10-30EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9M10-30EX?
For technical support, including BUK9M10-30EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M10-30EX requirements.
6.How does Aetrix verify that BUK9M10-30EX is sourced from the original manufacturer or authorized distributors?
All BUK9M10-30EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M10-30EX meets industry standards.
7.What is the process for return or replacement of BUK9M10-30EX?
All BUK9M10-30EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M10-30EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9M10-30EX part is unused and in its original packaging.
Return procedure for BUK9M10-30EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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