My Inquiry
My Account
Nexperia USA Inc. BUK9M11-40EX
- Part No.:
- BUK9M11-40EX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK9M11-40EX.pdf
- Description:
- MOSFET N-CH 40V 53A LFPAK33
- Quantity:
- Payment:
- Shipping:
Inventory:2,974
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BUK9M11-40EX from Nexperia is an AEC-Q101-qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, designed for 12 V automotive power switching. It delivers 40 V VDS, 11 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, 53 A continuous drain current at Tmb = 25 °C, and operates up to 175 °C junction temperature - enabling direct drive from microcontroller GPIOs in transmission control and solenoid driver circuits.
For engineers reviewing the BUK9M11-40EX datasheet, BUK9M11-40EX pinout, BUK9M11-40EX application, or BUK9M11-40EX equivalent, this device supports thermally demanding automotive subsystems requiring repetitive avalanche capability, true logic-level gate threshold (>0.5 V at 175 °C), and low thermal resistance (Rth(j-mb) = 2.01 K/W) for high-reliability under-hood deployment.
Technical Context
This MOSFET uses TrenchMOS technology and features a monolithic mounting base connected to the drain, enabling efficient heat transfer to the PCB copper pour. Its gate threshold voltage remains functional across -55 °C to 175 °C, with VGS(th) ≥ 0.5 V even at maximum junction temperature - ensuring robust turn-on in cold-cranking and hot-soak conditions.
The device exhibits 5 nC QGD, 13.4 nC QG(tot), and 1294 pF Ciss, supporting fast switching in PWM-driven motor and lamp loads. Repetitive avalanche rating and 32.4 mJ non-repetitive EAS provide inherent ruggedness against inductive kickback in solenoid and transmission valve control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum drain-source blocking voltage compatible with 12 V automotive battery systems including load dump transients. |
| RDS(on) | 9.3–11 mΩ @ VGS = 5 V, ID = 15 A, Tj = 25 °C - Enables <1 W conduction loss at 30 A, reducing heatsink requirements in space-constrained modules. |
| ID (continuous) | 53 A @ Tmb = 25 °C - Supports high-current DC loads such as HVAC blowers and power seat actuators without external gate drivers. |
| Tj max | 175 °C - Qualified for under-hood applications including engine bay ECUs and transmission control units per AEC-Q101. |
| Rth(j-mb) | 2.01 K/W - Low thermal resistance from junction to mounting base enables >40 W power dissipation with minimal board copper area. |
| QGD | 5 nC - Low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency in 20–100 kHz PWM circuits. |
| EAS | 32.4 mJ - Non-repetitive avalanche energy rating allows safe operation during unclamped inductive turn-off events in solenoid drivers. |
Pinout & Package
LFPAK33 (SOT1210) is a surface-mount, single-ended power package with an exposed metal mounting base electrically connected to the drain. Its 3.2 mm × 2.4 mm footprint and 0.9 mm height enable high power density while maintaining compatibility with standard reflow processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond wire inductance and improve current sharing in high-di/dt switching. |
| 4 | Gate (G) | Single gate input optimized for logic-level drive; VGS(th) ≥ 0.5 V at 175 °C ensures reliable turn-on across full automotive temperature range. |
| Mounting base (mb) | Drain (D) | Exposed copper pad serves as primary drain connection and thermal path - must be soldered to large PCB copper pour for rated power handling. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive-grade reliability including temperature cycling, HTRB, and UHAST - suitable for safety-critical transmission and chassis control modules. |
| Repetitive avalanche rating | Enables sustained operation under repeated inductive switching stress without derating, eliminating need for external snubbers in solenoid valve drivers. |
| True logic-level gate | VGS(th) > 0.5 V at 175 °C ensures gate turn-on margin remains >1.5× typical MCU GPIO high level (3.3 V) even at peak junction temperature. |
| 175 °C maximum junction temperature | Supports placement in high-ambient zones (e.g., near exhaust manifolds or power converters) without thermal shutdown or parameter drift. |
| Low Rth(j-mb) | 2.01 K/W thermal resistance enables >50 W pulsed power handling with only 25 mm² of 2-oz copper - critical for compact body control modules. |
Applications
| Transmission Control Valve Driver | Motor Load Switch for HVAC Blower |
|---|---|
|
Use Scenario: Driving 12 V proportional solenoid valves in automatic transmission shift control modules. IC Role / Device Role / Timing Role: High-side or low-side power switch controlling solenoid current with PWM frequencies up to 20 kHz. Use Value: 11 mΩ RDS(on) limits conduction loss to <1.0 W at 300 mA hold current, while 32.4 mJ EAS absorbs inductive flyback without clamping diodes. |
Use Scenario: On/off and speed control of brushed DC blower motors in automotive HVAC systems. IC Role / Device Role / Timing Role: Low-side switching element in half-bridge configuration with freewheeling diode path through internal body diode. Use Value: 53 A continuous rating supports peak startup currents >40 A; 175 °C rating ensures stable operation adjacent to heater cores. |
| 12 V Lamp Dimming Circuit | Engine Bay Power Distribution Unit |
|
Use Scenario: PWM-based dimming of LED headlamp position lamps and interior ambient lighting. IC Role / Device Role / Timing Role: Low-side switch modulating current at 1–5 kHz to avoid audible noise while maintaining thermal stability. Use Value: 5 nC QGD and 13.4 nC QG(tot) enable clean, low-loss switching transitions - reducing EMI and gate driver power consumption. |
Use Scenario: Solid-state replacement for mechanical relays in engine compartment fuse boxes and junction blocks. IC Role / Device Role / Timing Role: High-reliability load switch managing auxiliary 12 V circuits (e.g., fuel pump, radiator fan) with diagnostic feedback. Use Value: AEC-Q101 qualification and 175 °C operation ensure >15-year field life in high-vibration, high-temperature environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | 40 V, 2.2 mΩ RDS(on) @ 10 V, LFPAK56 package, 175 °C rated | Lower RDS(on) but requires 10 V gate drive - not logic-level; larger footprint increases board area | Select when higher efficiency at 10 V drive is prioritized over MCU GPIO compatibility and space constraints. |
| ON Semiconductor NTMFS4C09NT1G | 40 V, 9.5 mΩ RDS(on) @ 10 V, SO-8FL package, AEC-Q101 qualified | SO-8FL has higher Rth(j-mb) (~3.5 K/W); no repetitive avalanche rating; smaller thermal pad area | Choose for cost-sensitive designs where lower power dissipation (<25 W) and legacy SO-8 layout reuse are required. |
Compared with STL220N4F7AG and NTMFS4C09NT1G, BUK9M11-40EX uniquely balances logic-level drive, 175 °C operation, repetitive avalanche capability, and LFPAK33's thermal performance - making it optimal for compact, high-reliability 12 V automotive switches where gate drive voltage and thermal headroom are constrained.
Availability
BUK9M11-40EX is available at Aetrix Electronics and suitable for automotive transmission control, HVAC motor switching, LED lamp dimming, and engine bay power distribution requiring stable component supply across extended production lifecycles.
Supply support for BUK9M11-40EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions - serving automotive, industrial, and consumer markets with AEC-Q101-qualified components.
BUK9M11-40EX belongs to Nexperia's Automotive Logic-Level MOSFET product line, engineered specifically for 12 V automotive power switching applications demanding robustness, thermal resilience, and direct microcontroller interface without level-shifting circuitry.
FAQ
Is BUK9M11-40EX pin-compatible with other LFPAK33 MOSFETs?
Yes - BUK9M11-40EX uses the standardized SOT1210 (LFPAK33) footprint with identical pin assignment (pins 1–3 = Source, pin 4 = Gate, mounting base = Drain). This enables drop-in replacement among Nexperia's LFPAK33 logic-level MOSFET family, provided RDS(on), QG, and thermal requirements align with the target application.
What is the maximum recommended PCB copper area for thermal performance?
For full 62 W Ptot rating at Tmb = 25 °C, Nexperia specifies a minimum 250 mm² (e.g., 15 mm × 16.7 mm) of 2-ounce copper connected directly to the mounting base. Smaller areas reduce allowable power - e.g., 100 mm² limits continuous dissipation to ~35 W per thermal simulation data in Figure 1.
Does BUK9M11-40EX require a gate resistor for automotive PWM operation?
A gate resistor (typically 5–22 Ω) is recommended to damp ringing and control dV/dt during switching, especially in noisy automotive environments. The device's 5 nC QGD and 13.4 nC QG(tot) allow fast edge rates, but uncontrolled ringing can exceed CISPR 25 Class 5 EMI limits or cause false triggering in adjacent circuits.
Can BUK9M11-40EX be used in high-side switching configurations?
No - the mounting base is internally connected to the drain, making high-side configuration impractical without isolated gate drive and complex thermal management. It is optimized for low-side switching where the source is grounded and the mounting base connects directly to the PCB ground plane for thermal and electrical performance.
BUK9M11-40EX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 53A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V, 10V
- Rds On (Max) @ Id, Vgs:
- 9mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 13.4 nC @ 5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1721 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 62W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK9M11-40EX FAQ
1.How can I place an order for BUK9M11-40EX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9M11-40EX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9M11-40EX reliable?
The price and inventory of BUK9M11-40EX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M11-40EX is usually 5 days.
3.What payment methods are accepted for BUK9M11-40EX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M11-40EX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9M11-40EX?
BUK9M11-40EX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9M11-40EX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9M11-40EX?
For technical support, including BUK9M11-40EX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M11-40EX requirements.
6.How does Aetrix verify that BUK9M11-40EX is sourced from the original manufacturer or authorized distributors?
All BUK9M11-40EX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M11-40EX meets industry standards.
7.What is the process for return or replacement of BUK9M11-40EX?
All BUK9M11-40EX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M11-40EX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9M11-40EX part is unused and in its original packaging.
Return procedure for BUK9M11-40EX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BUK9M11-40EX Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
