Nexperia USA Inc. BUK9M24-80LX
- Part No.:
- BUK9M24-80LX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Datasheet:
-
BUK9M24-80LX.pdf
- Description:
- BUK9M24-80L/SOT1210/MLFPAK
- Quantity:
- Payment:

- Shipping:

Inventory:1,299
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Product details
Overview
BUK9M24-80LX from Nexperia is an AEC-Q101-qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, rated for 80 V VDS, 24 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C, and 35 A continuous drain current at Tmb = 25 °C. It delivers soft body-diode recovery and side-wettable flanks for AOI-compatible solder joints, targeting high-reliability automotive load switching.
For engineers reviewing the BUK9M24-80LX datasheet, BUK9M24-80LX pinout, BUK9M24-80LX application, or BUK9M24-80LX equivalent, key selection criteria include its 175 °C junction rating, 2.23 K/W Rth(j-mb), avalanche ruggedness (30.7 mJ), and logic-level gate drive compatibility down to 4.5 V.
Technical Context
This MOSFET employs Trench12 technology to achieve low RDS(on) with controlled QG (18.9 nC typ) and QGD (2.1 nC typ), enabling efficient hard-switching in 12–48 V automotive systems. Its gate threshold voltage (VGS(th)) ranges from 0.5 V to 2.45 V across -55 °C to 175 °C, ensuring robust turn-on under cold-cranking and high-temperature conditions.
The integrated source-drain diode exhibits 16 nC recovered charge (Qr) and 28 ns reverse recovery time (trr) at IS = 10 A, supporting snubberless inductive load control. Thermal resistance from junction to mounting base is tightly specified at 2.23 K/W max, enabling direct thermal coupling to PCB copper planes without heatsinks in many applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V - Maximum drain-source blocking voltage; supports 48 V automotive systems with margin against load-dump transients. |
| RDS(on) | 24 mΩ @ VGS = 10 V, Tj = 25 °C - Low conduction loss enabling <1 W dissipation at 20 A, reducing thermal design burden. |
| ID | 35 A continuous @ Tmb = 25 °C - Validated current capability; actual system limit determined by PCB copper area and ambient temperature. |
| QGD | 2.1 nC typ - Low gate-drain charge minimizes Miller-induced switching delay and improves EMI performance in high-frequency PWM. |
| Rth(j-mb) | 2.23 K/W max - Enables direct thermal path to mounting base; allows >50 W power handling with 100 °C ΔT to board. |
| EAS | 30.7 mJ - Unclamped avalanche energy rating ensures robustness during inductive turn-off events without external snubbers. |
| VGS(th) | 1.7 V typ @ 25 °C - Logic-level compatible; fully enhanced with standard 3.3 V or 5 V microcontroller GPIOs. |
Pinout & Package
LFPAK33 (SOT1210) is a 8-lead surface-mount plastic package with exposed mounting base connected to drain, optimized for high-power density and automated optical inspection via side-wettable flanks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Three parallel source terminals reduce bond wire inductance and improve current sharing; directly tied to PCB source plane. |
| 4 | Gate (G) | Single gate input with 1.7 Ω typical gate resistance; designed for low-inductance layout with short gate trace to driver. |
| Mounting Base (mb) | Drain (D) | Exposed copper pad electrically and thermally connected to drain; serves as primary heat path and high-current drain connection. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS ≥ 4.5 V - eliminates need for gate boosters in 3.3 V/5 V MCU-controlled circuits. |
| Side-wettable flanks | Enables automated optical inspection of solder joints - critical for zero-defect automotive manufacturing compliance. |
| AEC-Q101 qualification | Qualified to 175 °C junction temperature - validated for under-hood applications including transmission control modules. |
| Soft body-diode recovery | Qr = 16 nC, trr = 28 ns - reduces voltage overshoot and EMI during freewheeling in motor and solenoid drives. |
| Trench12 process | Delivers 24 mΩ RDS(on) in LFPAK33 - achieves higher current density than planar MOSFETs while maintaining ruggedness. |
Applications
| Motor Control | Lamp & LED Driver |
|---|---|
Use Scenario: Driving brushed DC motors in HVAC actuators and power seat modules. IC Role / Device Role / Timing Role: High-side or low-side switch controlling bidirectional motor current up to 35 A peak. Use Value: Low RDS(on) minimizes resistive heating during PWM duty cycles; soft diode recovery prevents voltage spikes damaging MCU GPIOs. | Use Scenario: Constant-current LED headlamp and DRL drivers in 12 V/24 V platforms. IC Role / Device Role / Timing Role: PWM-controlled current sink regulating LED string current with fast switching. Use Value: 2.23 K/W thermal resistance enables stable operation at 100% duty cycle without heatsink on 2 oz copper. |
| Transmission Control | Circuit Protection |
Use Scenario: Solenoid actuation in automatic transmission valve bodies. IC Role / Device Role / Timing Role: High-reliability power switch delivering precise 12 V pulses to electro-hydraulic valves. Use Value: AEC-Q101 qualification and 175 °C operation ensure functional safety compliance in harsh under-transmission environments. | Use Scenario: Reverse-polarity and overcurrent protection in battery management and infotainment ECUs. IC Role / Device Role / Timing Role: Low-loss series pass element in active protection ICs or discrete protection circuits. Use Value: 80 V rating withstands ISO 7637-2 pulse 5a (load dump); 30.7 mJ avalanche energy absorbs inductive kickback from relay coils. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ONsemi NTMFS5C428NLT1G | 40 V VDS, 2.2 mΩ RDS(on), Power56 package - lower voltage, lower RDS(on), but not AEC-Q101 qualified. | Restricted to 12 V systems only; unsuitable for 24/48 V or load-dump tolerant designs. | Select only for cost-sensitive 12 V non-safety-critical loads where qualification is not required. |
| Infineon BSC028N06NS3 G | 60 V VDS, 2.8 mΩ RDS(on), PG-TSDSON-8 - higher current density but no side-wettable flanks or AEC-Q101 at 175 °C. | Lacks AOI support and extended temperature validation; requires additional process validation for automotive use. | Prefer when board space is constrained and thermal budget allows; verify solder joint inspection method compatibility. |
Compared with NTMFS5C428NLT1G and BSC028N06NS3 G, BUK9M24-80LX uniquely combines 80 V rating, AEC-Q101 at 175 °C, side-wettable flanks, and LFPAK33's proven thermal performance-making it the only drop-in solution for new 48 V mild-hybrid and high-temperature transmission control designs.
Availability
BUK9M24-80LX is available at Aetrix Electronics and suitable for automotive motor control, LED lighting, transmission solenoid actuation, and circuit protection requiring stable component supply across production lifecycles.
Supply support for BUK9M24-80LX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete and logic devices for automotive, industrial, and consumer markets.
BUK9M24-80LX belongs to Nexperia's Automotive Logic-Level MOSFET product line, engineered specifically for high-reliability, high-temperature switching in 12–48 V vehicle subsystems where AEC-Q101 compliance and robust thermal behavior are mandatory.
FAQ
What is the maximum continuous drain current for BUK9M24-80LX at 100 °C mounting base temperature?
At Tmb = 100 °C, the continuous drain current is 25 A per the datasheet Figure 2. This derating reflects thermal limits of the LFPAK33 package and PCB layout; actual current must be verified using measured Tmb and thermal simulation.
Does BUK9M24-80LX support gate drive from a 3.3 V microcontroller without level shifting?
Yes - its VGS(th) is 1.7 V typical at 25 °C and remains ≥0.5 V at 175 °C, enabling full enhancement with 3.3 V logic. However, RDS(on) rises to 55 mΩ at VGS = 4.5 V and Tj = 175 °C, so thermal design must account for increased conduction loss.
How does the side-wettable flank feature impact manufacturing yield?
The side-wettable flanks enable automated optical inspection (AOI) of solder fillets on all four package edges, improving defect detection for head-in-pillow and insufficient solder defects. This directly supports zero-defect goals in Tier 1 automotive SMT lines without requiring X-ray inspection.
Is the mounting base electrically isolated from other terminals?
No - the mounting base is internally connected to the drain (D) terminal, as confirmed in Table 2 (Pinning information). It must be routed to the drain net on the PCB and thermally coupled to a copper pour serving as both heatsink and high-current return path.
BUK9M24-80LX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOT-1210, 8-LFPAK33 (5-Lead)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 35A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 23.6mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.05V @ 60µA
- Gate Charge (Qg) (Max) @ Vgs:
- 28.4 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1810 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 67W (Ta)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK33
BUK9M24-80LX FAQ
1.How can I place an order for BUK9M24-80LX through Aetrix?
Please submit a Request for Quotation (RFQ) for BUK9M24-80LX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BUK9M24-80LX reliable?
The price and inventory of BUK9M24-80LX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BUK9M24-80LX is usually 5 days.
3.What payment methods are accepted for BUK9M24-80LX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BUK9M24-80LX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BUK9M24-80LX?
BUK9M24-80LX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BUK9M24-80LX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BUK9M24-80LX?
For technical support, including BUK9M24-80LX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BUK9M24-80LX requirements.
6.How does Aetrix verify that BUK9M24-80LX is sourced from the original manufacturer or authorized distributors?
All BUK9M24-80LX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BUK9M24-80LX meets industry standards.
7.What is the process for return or replacement of BUK9M24-80LX?
All BUK9M24-80LX units undergo pre-shipment inspection (PSI). If there is an issue with BUK9M24-80LX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BUK9M24-80LX part is unused and in its original packaging.
Return procedure for BUK9M24-80LX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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