Nexperia USA Inc. BUK9M35-80EX

Overview

BUK9M35-80EX from Nexperia is an AEC-Q101-qualified N-channel logic-level MOSFET in LFPAK33 (SOT1210) package, rated for 80 V V_DS, 35 mΩ R_DS(on) at V_GS = 5 V and T_j = 25 °C, and 175 °C junction operation-designed for high-reliability automotive power switching in 12 V/24 V/48 V systems.

For engineers reviewing the BUK9M35-80EX datasheet, BUK9M35-80EX pinout, BUK9M35-80EX application, or BUK9M35-80EX equivalent, this device supports thermally demanding motor, lamp, and solenoid control with true logic-level gate drive (V_GS(th) > 0.5 V at 175 °C), repetitive avalanche rating, and mounting-base thermal resistance of 2.01 K/W.

Technical Context

This MOSFET employs TrenchMOS technology to achieve low on-resistance and fast switching performance, with Q_GD = 4.9 nC and t_f = 12 ns under standard test conditions (V_DS = 60 V, R_G(ext) = 5 Ω). Its LFPAK33 package integrates a thermally optimized mounting base connected directly to the drain, enabling efficient heat transfer to PCB copper.

The device features a robust source-drain diode with V_SD = 0.78 V at I_S = 5 A and T_j = 25 °C, and is qualified for automotive use per AEC-Q101 with guaranteed operation up to 175 °C junction temperature and non-repetitive avalanche energy E_AS = 32.3 mJ.

Key Specifications

Pinout & Package

LFPAK33 (SOT1210) is a surface-mount plastic package with 8 leads and an exposed metal mounting base thermally and electrically connected to the drain. It provides superior thermal performance over conventional SO8 and DPAK packages via direct die-to-PCB thermal path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Compared with STL220N4F7AG and NTMFS5C670NL, BUK9M35-80EX uniquely delivers 80 V blocking, verified 0.5 V V_GS(th) at 175 °C, and AEC-Q101 compliance in a thermally superior LFPAK33 package-making it the only drop-in solution for 48 V automotive switching where both voltage headroom and high-temperature logic compatibility are mandatory.

Availability

BUK9M35-80EX is available at Aetrix Electronics and suitable for automotive engine control units, transmission control modules, and 48 V mild-hybrid systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for BUK9M35-80EX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified MOSFETs, ESD protection, and logic ICs.

BUK9M35-80EX belongs to Nexperia's Automotive Logic Level MOSFET product line, engineered specifically for thermally aggressive automotive power switching applications requiring AEC-Q101 compliance, 175 °C operation, and robust avalanche performance.

FAQ

What is the maximum continuous drain current for BUK9M35-80EX at 100 °C mounting base temperature?

At T_mb = 100 °C, the continuous drain current is 19 A (per Table 5, Limiting Values). This value is derived from thermal derating curves in Figure 2 and reflects real-world PCB thermal performance-not ambient temperature ratings. The device must be mounted on a minimum 200 mm² 2-oz copper area with ≥6 thermal vias for this rating to be achievable.

Is BUK9M35-80EX pin-compatible with other LFPAK33 MOSFETs like BUK9Y8R5-40E?

No-BUK9M35-80EX uses the standard LFPAK33 (SOT1210) pinout (Pins 1–3 = Source, Pin 4 = Gate, mounting base = Drain), but BUK9Y8R5-40E has identical pinning. However, electrical differences-including 40 V vs. 80 V V_DS, 0.85 mΩ vs. 35 mΩ R_DS(on), and different gate charge-preclude functional interchangeability without circuit revalidation.

Does BUK9M35-80EX include an integrated body diode, and what are its key parameters?

Yes-it features a monolithic source-drain diode with forward voltage V_SD = 0.78 V at I_S = 5 A and T_j = 25 °C (Table 10), reverse recovery time t_rr = 21 ns, and recovered charge Q_r = 21.6 nC. These values support efficient freewheeling in inductive loads, though external Schottky diodes may still be needed for ultra-fast or zero-recovery requirements.

How does the mounting base connection affect PCB layout and thermal design?

The mounting base is electrically connected to the drain and serves as the primary thermal path. PCB layout must expose the base pad with no solder mask, connect it to ≥200 mm² internal/external copper pour, and use ≥6 x 0.3 mm vias filled with thermal epoxy to inner ground or thermal planes. Failure to implement this results in junction temperature exceeding 175 °C even at moderate power levels.